Abstract: A transmission elastic wave filter element and a reception elastic wave filter element each flip-chip mounted to a principal surface of a substrate are sealed off by a sealing member. The sealing member includes a base portion in contact with the principal surface of the substrate and made of a first dielectric material, and a lower dielectric-constant portion made of a second dielectric material having a dielectric constant lower than that of the first dielectric material and arranged in at least one of a region of the sealing member that faces the transmission elastic wave filter element on a side opposite from the substrate with respect to the transmission elastic wave filter element, and a region of the sealing member that faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element.

Abstract: In an elastic wave duplexer, a reception elastic wave filter element and a transmission elastic wave filter element are flip-chip mounted to a principal surface of a substrate. A sealing member is disposed on the principal surface of the substrate to cover and seal off at least one of the reception elastic wave filter element and the transmission elastic wave filter element. The sealing member has different thicknesses between a reception-element-covering region, which faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element, and a transmission-element-covering region, which faces the transmission elastic wave filter element on the side opposite from the substrate with respect to the transmission elastic wave filter element.

Abstract: A small-sized elastic wave apparatus in which heat generated at a portion of a cascade connection between resonators is sufficiently dissipated includes on one main surface of a piezoelectric substrate in an elastic wave filter mounted on a base substrate on which an input/output wiring line, a ground wiring line, and a floating wiring line insulated from the input/output wiring line and the ground wiring line are provided, first electrodes coupled to the input/output wiring line or the ground wiring line, second electrodes coupled to the floating wiring line, resonators, connection wiring lines connecting the resonators, and electrode wiring lines connecting the resonators and the first electrodes. The second electrodes are disposed in contact with the connection wiring line cascading the resonators and the connection wiring line cascading the resonators, respectively.

Abstract: An elastic wave device includes a first elastic wave resonator and a second elastic wave resonator that are connected in series to each other, and a resistor is connected in parallel with the first elastic wave resonator while no resistors are connected in parallel with the second elastic wave resonator.

Abstract: A transmission elastic wave filter element and a reception elastic wave filter element each flip-chip mounted to a principal surface of a substrate are sealed off by a sealing member. The sealing member includes a base portion in contact with the principal surface of the substrate and made of a first dielectric material, and a lower dielectric-constant portion made of a second dielectric material having a dielectric constant lower than that of the first dielectric material and arranged in at least one of a region of the sealing member that faces the transmission elastic wave filter element on a side opposite from the substrate with respect to the transmission elastic wave filter element, and a region of the sealing member that faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element.

Abstract: In an elastic wave duplexer, a reception elastic wave filter element and a transmission elastic wave filter element are flip-chip mounted to a principal surface of a substrate. A sealing member is disposed on the principal surface of the substrate to cover and seal off at least one of the reception elastic wave filter element and the transmission elastic wave filter element. The sealing member has different thicknesses between a reception-element-covering region, which faces the reception elastic wave filter element on the side opposite from the substrate with respect to the reception elastic wave filter element, and a transmission-element-covering region, which faces the transmission elastic wave filter element on the side opposite from the substrate with respect to the transmission elastic wave filter element.

Abstract: An elastic wave device includes a first elastic wave resonator and a second elastic wave resonator that are connected in series to each other, and a resistor is connected in parallel with the first elastic wave resonator while no resistors are connected in parallel with the second elastic wave resonator.

Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.

Abstract: A method for manufacturing a surface acoustic wave device includes a substrate thickness reduction step of reducing the thickness of a piezoelectric substrate by machining a principal surface of the piezoelectric substrate, and a bonding step of bonding a support substrate having a smaller coefficient of linear expansion than the piezoelectric substrate through a resin adhesive layer to the piezoelectric substrate the thickness of which is reduced.

Abstract: A SAW duplexer includes a first SAW filter having a passband with a relatively low frequency, and a second SAW filter having a passband with a relatively high frequency. The first and second SAW filters each have a ladder-shaped circuit configuration. A bridging inductor is connected in parallel to at least one serial arm resonator in the second SAW filter. The bridging inductor includes a coiled portion provided on a multilayer package substrate. The coiled portion is defined by connecting first to third wires provided on first to third layers by via-hole conductors. First, third, and fifth via-hole conductors that define a coil return wire portion are disposed inside the coiled portion.

Abstract: A SAW duplexer includes a first SAW filter having a passband with a relatively low frequency, and a second SAW filter having a passband with a relatively high frequency. The first and second SAW filters each have a ladder-shaped circuit configuration. A bridging inductor is connected in parallel to at least one serial arm resonator in the second SAW filter. The bridging inductor includes a coiled portion provided on a multilayer package substrate. The coiled portion is defined by connecting first to third wires provided on first to third layers by via-hole conductors. First, third, and fifth via-hole conductors that define a coil return wire portion are disposed inside the coiled portion.

Abstract: A surface acoustic wave device includes a sealing resin for sealing a gap between a surface acoustic wave element and a mounting board. The sealing resin is prevented from flowing so as to reach a vibrating portion of the surface acoustic wave element. In the surface acoustic wave device, a surface acoustic wave element is connected to a mounting board through bumps, the outer peripheral edge of the surface acoustic wave element is sealed by a sealing resin, and a vibration space is secured between the vibrating portion of the surface acoustic wave element and mounting board. In the surface acoustic wave element, an outer barrier enclosing the bumps and the vibrating portion and an inner barrier enclosing the vibrating portion are provided, the height of the outer barrier is lower than the total height of the height of the bumps and the height of electrode lands formed on the mounting board, and the height of the inner barrier is lower than the height of the bumps.

Abstract: According to the present invention, a hollowed portion is formed on a lower bonded surface of a rotary drum to which a rotation-side rotary transformer is bonded, and a hollowed portion is formed on an upper bonded surface of the fixed drum to which a fixation-side rotary transformer is bonded. Thus, excessive adhesive is absorbed by the hollowed portions and adhesive layers do not have uneven thicknesses, thereby securing surface runout accuracies of the rotary transformers. Further, since an adhesive is applied to the outer peripheral side of the hollowed portion of the rotary drum, the adhesive does not flow into ball bearings located on the inner peripheral side.

Abstract: A surface acoustic wave device includes a sealing resin for sealing a gap between a surface acoustic wave element and a mounting board. The sealing resin is prevented from flowing so as to reach a vibrating portion of the surface acoustic wave element. In the surface acoustic wave device, a surface acoustic wave element is connected to a mounting board through bumps, the outer peripheral edge of the surface acoustic wave element is sealed by a sealing resin, and a vibration space is secured between the vibrating portion of the surface acoustic wave element and mounting board. In the surface acoustic wave element, an outer barrier enclosing the bumps and the vibrating portion and an inner barrier enclosing the vibrating portion are provided, the height of the outer barrier is lower than the total height of the height of the bumps and the height of electrode lands formed on the mounting board, and the height of the inner barrier is lower than the height of the bumps.

Abstract: A surface acoustic wave device includes a surface acoustic wave element mounted on a substrate, and the surface acoustic wave element is sealed by a resin sealing layer. Even when the size of the surface acoustic wave element is reduced, a short circuit in a mounting electrode is prevented from occurring when it is mounted, a fillet formation of a conductive bond in the mounting can be easily and visually checked, and the cost can be reduced. The surface acoustic wave element is mounted on a multi-layered substrate by a face-down mounting method by using bumps, the surface acoustic wave element is sealed by the resin sealing layer, electrode lands on an upper surface of the multi-layered substrate connected to the bumps are connected to internal electrodes through via hole electrodes, and the internal electrodes are electrically connected to the mounting electrodes on a lower surface of the multi-layered substrate and end surface wiring electrodes.

Abstract: According to the present invention, a cylindrical side wall is provided in a housing so as to surround an outer periphery of a stopper member. Further, an end surface of the side wall is higher than a top surface of outermost periphery of the stopper member. Oil otherwise scattered is received by the side wall for collection. Oil is thus prevented from scattering even if during manufacturing, the amount of oil dripped between the shaft and the oil-impregnated bearing is not strictly controlled, so that a slightly excessive amount of oil is dripped. Therefore, the present motor device enables manufacturing operations to be favorably performed, and is reliable having a long lifetime.

Abstract: In order to not only obtain excellent sound quality in a long-time recording mode not less than five times a standard recording mode by preventing, without narrowing a track pitch of a high-fidelity head, the high-fidelity head from tracing the third sound track from a target sound track as well as excellent picture quality free from crosstalk from an adjoining video track of a target video track but enable special playback without using a field memory in a video tape recorder, one head pair in conventional double azimuth type four heads for the standard recording mode and a threefold recording mode is used for video recording in the long-time recording mode and a head pair having a head width smaller than a width of a recording track is used exclusively for video playback in the long-time recording mode.

Abstract: According to the present invention, a cylindrical side wall is provided in a housing so as to surround an outer periphery of a stopper member. Further, an end surface of the side wall is higher than a top surface of outermost periphery of the stopper member. Oil otherwise scattered is received by the side wall for collection. Oil is thus prevented from scattering even if during manufacturing, the amount of oil dripped between the shaft and the oil-impregnated bearing is not strictly controlled, so that a slightly excessive amount of oil is dripped. Therefore, the present motor device enables manufacturing operations to be favorably performed, and is reliable having a long lifetime.

Abstract: According to the present invention, a hollowed portion is formed on a lower bonded surface of a rotary drum to which a rotation-side rotary transformer is bonded, and a hollowed portion is formed on an upper bonded surface of the fixed drum to which a fixation-side rotary transformer is bonded. Thus, excessive adhesive is absorbed by the hollowed portions and adhesive layers do not have uneven thicknesses, thereby securing surface runout accuracies of the rotary transformers. Further, since an adhesive is applied to the outer peripheral side of the hollowed portion of the rotary drum, the adhesive does not flow into ball bearings located on the inner peripheral side.

Abstract: A surface acoustic wave device includes a surface acoustic wave element mounted on a substrate, and the surface acoustic wave element is sealed by a resin sealing layer. Even when the size of the surface acoustic wave element is reduced, a short circuit in a mounting electrode is prevented from occurring when it is mounted, a fillet formation of a conductive bond in the mounting can be easily and visually checked, and the cost can be reduced. The surface acoustic wave element is mounted on a multi-layered substrate by a face-down mounting method by using bumps, the surface acoustic wave element is sealed by the resin sealing layer, electrode lands on an upper surface of the multi-layered substrate connected to the bumps are connected to internal electrodes through via hole electrodes, and the internal electrodes are electrically connected to the mounting electrodes on a lower surface of the multi-layered substrate and end surface wiring electrodes.