Abstract: The present invention provides polypeptide and antibody for assessing predisposition of myelodysplastic syndrome or myeloid tumor, and method for screening therapeutic drugs therefor. The polypeptide comprises at least a portion of the U2AF35 gene, at least a portion of the ZRSR2 gene, at least a portion of the SFRS2 gene, or at least a portion of the SF3B1 gene, and is able to serve as a marker for evaluating predisposition for myelodysplastic syndromes or a myelogenous tumor.

Abstract: [Problem] To provide a method for assessing myelodysplastic syndrome or myeloid tumor predisposition, on the basis of a genetic diagnosis using massively parallel sequencing technology, as well as a peptide and antibody therefor, and a method for screening for candidate therapeutic drugs or prophylactic drugs for myelodysplastic syndrome or myeloid tumor. [Solution] A method for assessing whether or not there is a predisposition for the occurrence of myelodysplastic syndrome or myeloid tumor, wherein the method comprises a step for using a sample that includes a subject's human genes and detecting a mutation in at least one gene from among the U2AF35 gene, the ZRSR2 gene, the SFRS2 gene, or the SF3B1 gene.

Abstract: A secondary winding, divided into a plurality of sections, is provided around a primary winding of the air-core type. First and second diode groups are disposed on four substrates which surround the secondary winding. Diodes in each of the first and second diode groups are disposed on two adjacent substrates so that these diodes are connected in series so as to have the same polarity direction, respectively. The first and second diode groups are respectively divided into a plurality of diode sections. Winding start ends and winding finish ends of winding sections are coupled between the respective two adjacent diode sections. The diode sections disposed on the each substrate are arranged to be spaced apart along the axial direction of the primary winding. One of the diode sections to which induced voltages of the winding sections are applied is disposed on two adjacent substrates, and the other diode section is disposed on the other two adjacent substrates.