Patents by Inventor Masashi Sawa

Masashi Sawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7142278
    Abstract: A glass sheet for a liquid crystal display apparatus with a scribe groove formed thereon is divided by cooling the scribe groove and its surroundings and heating surrounding areas on both sides of the scribe groove to extend the scribe groove to a backside of the glass sheet, resulting in uniform distribution of residual stress on a cutting area. Also disclosed is a method for cutting a thin a sheet of brittle material such as a glass or ceramics by extending a scribe groove without deformation or impact so that peeling or cracking is reduced.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: November 28, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Tatemura, Masashi Sawa, Katsumi Kobara
  • Publication number: 20040141145
    Abstract: A method for cutting a thin sheet of brittle material such as glass or ceramics by extending a scribe groove without deformation or impact so that some peeling or crack may be reduced has been developed and the above described method is applied to a glass display plate for a liquid crystal display apparatus. A glass sheet for a liquid crystal display apparatus with a scribe groove formed thereon is divided by cooling the scribe groove and its surroundings and heating surrounding areas on both sides of the scribe groove to extend the scribe groove to a backside of the glass sheet, resulting in uniform distribution of residual stress on a cut area.
    Type: Application
    Filed: January 8, 2004
    Publication date: July 22, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Makoto Tatemura, Masashi Sawa, Katsumi Kobara
  • Patent number: 6700639
    Abstract: A glass sheet for a liquid crystal display apparatus with a scribe groove formed thereon is divided by cooling the scribe groove and its surroundings and heating surrounding areas on both sides of the scribe groove to extend the scribe groove to a backside of the glass sheet, resulting in uniform distribution of residual stress on a cutting area. Also disclosed is a method for cutting a thin sheet of brittle material such as glass or ceramics by extending a scribe groove without deformation or impact so that peeling or cracking is reduced.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: March 2, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Tatemura, Masashi Sawa, Katsumi Kobara
  • Publication number: 20020001059
    Abstract: A method for cutting a thin sheet of brittle material such as glass or ceramics by extending a scribe groove without deformation or impact so that some peeling or crack may be reduced has been developed and the above described method is applied to a glass display plate for a liquid crystal display apparatus. A glass sheet for a liquid crystal display apparatus with a scribe groove formed thereon is divided by cooling the scribe groove and its surroundings and heating surrounding areas on both sides of the scribe groove to extend the scribe groove to a backside of the glass sheet, resulting in uniform distribution of residual stress on a cut area.
    Type: Application
    Filed: February 26, 2001
    Publication date: January 3, 2002
    Inventors: Makoto Tatemura, Masashi Sawa, Katsumi Kobara
  • Patent number: 5022797
    Abstract: A diamond tool for the mirror-finish cutting of non-ferrous materials and a method of manufacturing the same are provided. The diamond tool has a main cutting edge and minute side cutting edges formed at the opposite ends of the main cutting edge so as to intersect the main cutting edge at an angle. The dept .DELTA. of chamfer of the side cutting edge is 1.5 to 5 times the depth of tears formed in the machined surface (0.1 .mu.m.ltoreq..DELTA..ltoreq.1 .mu.m) and the length l.sub.2 of the side cutting edged is 1.5 to 10 times the feed of the diamond tool (0.02 mm.ltoreq.l.sub.2 .ltoreq.0.8 mm). The rake face of the diamond tool comprises two rake faces and two side rake faces. A tool grinding surface plate for manufacturing the diamond tool has a flat surface for grinding the rake faces, and a circumferential tapered surface for grinding the side rake faces.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: June 11, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Masashi Sawa, Masami Masuda, Yukio Maeda, Ryu Itoh