Patents by Inventor Masashi SHIMOYASU
Masashi SHIMOYASU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120142Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.Type: ApplicationFiled: October 4, 2023Publication date: April 11, 2024Applicant: TDK CORPORATIONInventors: Yoji TOZAWA, Masashi SHIMOYASU, Akihiko OIDE, Daiki KATO, Makoto YOSHINO, Takashi ENDO, Takuya KODAMA, Akira AKASAKA, Ken ITOH
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Patent number: 11894195Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.Type: GrantFiled: November 8, 2021Date of Patent: February 6, 2024Assignee: TDK CORPORATIONInventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato
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Publication number: 20240038436Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
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Patent number: 11817252Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: January 11, 2022Date of Patent: November 14, 2023Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20230317351Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.Type: ApplicationFiled: March 23, 2023Publication date: October 5, 2023Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Yoji TOZAWA, Akihiko OIDE, Daiki KATO, Midori KISHIMOTO, Satoshi TAKASU, Yo SAITO, Rui TAKAHASHI, Kenta SASAKI, Makoto YOSHINO, Kazuhiro EBINA
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Patent number: 11631521Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.Type: GrantFiled: April 29, 2019Date of Patent: April 18, 2023Assignee: TDK CORPORATIONInventors: Yoji Tozawa, Takuo Abe, Yuma Ishikawa, Hidekazu Sato, Takashi Endo, Masashi Shimoyasu, Kazuma Takahashi
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Publication number: 20220301761Abstract: In the multi-layer inductor, a through conductor provided in a sintered element body includes a pair of extracting conductors and a pair of internal conductors, and an end portion of the extracting conductor and an end portion of the internal conductor overlap each other in a stacking direction of the element body. Thus, the amount of shrinkage of each conductor during sintering of the element body is reduced, and internal stress generated in the element body after sintering is prevented.Type: ApplicationFiled: March 14, 2022Publication date: September 22, 2022Applicant: TDK CORPORATIONInventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Masashi SHIMOYASU, Daiki KATO, Hideki SAITOU, Seiji OSADA, Kazuhiro EBINA
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Patent number: 11373789Abstract: A ferrite sintered body of the invention includes; a main component including 48.65 to 49.45 mol % of iron oxide in terms of Fe2O3, 2 to 16 mol % of copper oxide in terms of CuO, 28.00 to 33.00 mol % of zinc oxide in terms of ZnO, and a balance including nickel oxide, and a subcomponent including boron oxide in an amount of 5 to 100 ppm in terms of B2O3 with respect to 100 parts by weight of the main component, in which the ferrite sintered body includes crystal grains having an average crystal grain size of 2 to 30 ?m.Type: GrantFiled: December 28, 2018Date of Patent: June 28, 2022Assignee: TDK CORPORATIONInventors: Takeshi Shibayama, Yukio Takahashi, Takashi Suzuki, Hiroyuki Tanoue, Masashi Shimoyasu, Masahiro Kato
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Publication number: 20220130594Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: January 11, 2022Publication date: April 28, 2022Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 11270833Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: March 8, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20220068565Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.Type: ApplicationFiled: November 8, 2021Publication date: March 3, 2022Applicant: TDK CORPORATIONInventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO
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Patent number: 11239020Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: February 1, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Patent number: 11227721Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.Type: GrantFiled: November 24, 2017Date of Patent: January 18, 2022Assignee: TDK CORPORATIONInventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato, Masashi Kitazaki, Naoki Uchida, Masahiro Kato
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Publication number: 20210383960Abstract: A multilayer conductor component includes an element body, an internal conductor, and an external electrode. The external electrode includes a sintered metal layer. The sintered metal layer is disposed on an end surface, a pair of side surfaces, a first main surface, and a second main surface of the element body. An electrode length, which is a length in the first direction from an edge of the sintered metal layer to a reference plane including the end surface, at a central portion of the first main surface in the third direction, is shorter than the electrode length at each of the ridge portions. The electrode length at a central portion of each of the pair of side surfaces in the second direction is equal to or less than the electrode length at each of the ridge portions.Type: ApplicationFiled: June 3, 2021Publication date: December 9, 2021Applicant: TDK CORPORATIONInventors: Daiki KATO, Masashi SHIMOYASU, Yoji TOZAWA, Seiichi NAKAGAWA, Akihiko OIDE, Makoto YOSHINO, Kazuhiro EBINA
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Publication number: 20210375527Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.Type: ApplicationFiled: May 25, 2021Publication date: December 2, 2021Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Daiki KATO, Yoji TOZAWA, Takashi ENDO, Seiichi NAKAGAWA, Mitsuru ITO, Kenta SASAKI, Akihiko OIDE, Makoto YOSHINO, Kazuhiro EBINA
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Publication number: 20200185144Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: February 13, 2020Publication date: June 11, 2020Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 10643781Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: May 18, 2017Date of Patent: May 5, 2020Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
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Patent number: 10614946Abstract: An electronic component includes a body and a pair of terminal electrodes. The body has a pair of end faces opposing each other in a first direction, a pair of main faces opposing each other in a second direction, and a pair of side faces opposing each other in a third direction. One of the main faces serves as a mounting face. A clearance in the first direction between an end edge of a conductive resin layer and the end edge of a base metal layer at an end portion of the one of the main faces in the third direction is longer than a clearance in the first direction between the end edge of the conductive resin layer and the end edge of the base metal layer at a central portion of the one of the main faces in the third direction.Type: GrantFiled: November 15, 2017Date of Patent: April 7, 2020Assignee: TDK CORPORATIONInventors: Yoji Tozawa, Masashi Shimoyasu, Junichi Otsuka, Tsutomu Ono, Hidekazu Sato
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Publication number: 20190348212Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.Type: ApplicationFiled: April 29, 2019Publication date: November 14, 2019Applicant: TDK CORPORATIONInventors: Yoji TOZAWA, Takuo ABE, Yuma ISHIKAWA, Hidekazu SATO, Takashi ENDO, Masashi SHIMOYASU, Kazuma TAKAHASHI
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Publication number: 20190221344Abstract: A ferrite sintered body of the invention includes; a main component including 48.65 to 49.45 mol % of iron oxide in terms of Fe2O3, 2 to 16 mol % of copper oxide in terms of CuO, 28.00 to 33.00 mol % of zinc oxide in terms of ZnO, and a balance including nickel oxide, and a subcomponent including boron oxide in an amount of 5 to 100 ppm in terms of B2O3 with respect to 100 parts by weight of the main component, in which the ferrite sintered body includes crystal grains having an average crystal grain size of 2 to 30 ?m.Type: ApplicationFiled: December 28, 2018Publication date: July 18, 2019Applicant: TDK CORPORATIONInventors: Takeshi SHIBAYAMA, Yukio TAKAHASHI, Takashi SUZUKI, Hiroyuki TANOUE, Masashi SHIMOYASU, Masahiro KATO