Abstract: The vibrator element includes a base part, a vibrating arm extending from the base part, and a weight provided to the vibrating arm, wherein the weight includes a thick film part, a thin film part thinner in film thickness than the thick film part, and a connection part which is located between the thick film part and the thin film part to connect the thick film part and the thin film part to each other, and which forms a taper shape gradually decreasing in film thickness in a direction from the thick film part side toward the thin film part.

Abstract: A processing mark that is thinned or removed in a thickness direction of a vibration arm is formed at a weight provided at a drive vibration arm of a vibration element, and including a pair of weight ends aligned in an extending direction of the vibration arm. The processing mark includes a first processing end and a second processing end aligned in the extending direction of the vibration arm, the first processing end overlaps one weight end of the weight in plan view in the extending direction of the vibration arm, and a width of the first processing end is smaller than a width of the second processing end.

Abstract: A vibrator device includes a base; and a vibrator element including a quartz crystal vibrator element attached to the base via a first metal bump, in which the first metal bump is disposed on a straight line inclined within a range of +55° to +65° or ?65° to ?55° with respect to an X axis of the quartz crystal constituting the quartz crystal vibrator element in plan view seen from a direction in which the base and the quartz crystal vibrator element are arranged.

Abstract: A vibrator device includes abase, a circuit element that is attached to the base, and a vibrator element that is arranged at an active surface of the circuit element and is attached to the circuit element, and the circuit element includes a terminal for frequency adjustment that is used for frequency adjustment of the vibrator element and is disposed in a region that does not overlap the vibrator element when viewed in a plan view of the active surface.

Abstract: A frequency adjustment method of a vibration element includes adjusting a resonance frequency of the vibration element by irradiating the vibration element, which includes a vibrating arm having a first principal surface and a second principal surface that are in a front and back relationship with each other with an energy ray, to remove a part of the vibrating arm on the first principal surface, and in which an activation amount by the energy ray on the second principal surface of the vibrating arm is smaller than an activation amount by the energy ray on the first principal surface of the vibrating arm.

Abstract: A method of manufacturing a vibrator device includes preparing a vibrator element including a vibrating arm and a weight provided to the vibrating arm, and irradiating the weight with a laser beam to remove apart of the weight. Further, in the step of irradiating the weight with the laser beam to remove the part of the weight, the part of the weight is irradiated with the laser beam to thereby provide the weight with a removed area where the part of the weight is removed, and an unremoved area where the weight is not removed, and in an area close to the unremoved area in the removed area, an amount of irradiation with the laser beam is gradually increased in a direction from the unremoved area side toward the removed area.

Abstract: The vibrator element includes a base part, a vibrating arm extending from the base part, and a weight provided to the vibrating arm, wherein the weight includes a thick film part, a thin film part thinner in film thickness than the thick film part, and a connection part which is located between the thick film part and the thin film part to connect the thick film part and the thin film part to each other, and which forms a taper shape gradually decreasing in film thickness in a direction from the thick film part side toward the thin film part.

Abstract: A vibrator device includes a base, a relay substrate that is supported by the base, and a vibrator element that is supported by the relay substrate. In addition, the vibrator element includes a vibration substrate formed of a piezoelectric single-crystalline body and an excitation electrode disposed on the vibration substrate. In addition, the relay substrate includes a substrate formed of the piezoelectric single-crystalline body. A crystal axis of the substrate and a crystal axis of the vibration substrate are shifted from each other.

Abstract: A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view. The vibrator device being configured to reduce a mounting stress applied to a vibrator element and to reduce frequency variation of the vibrator element due to the mounting stress, in a case of mounting on a package after adjusting a frequency of the vibrator element.

Abstract: A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.

Abstract: A processing mark that is thinned or removed in a thickness direction of a vibration arm is formed at a weight provided at a drive vibration arm of a vibration element, and including a pair of weight ends aligned in an extending direction of the vibration arm. The processing mark includes a first processing end and a second processing end aligned in the extending direction of the vibration arm, the first processing end overlaps one weight end of the weight in plan view in the extending direction of the vibration arm, and a width of the first processing end is smaller than a width of the second processing end.

Abstract: A vibrating element includes a base, a vibrating arm extending from the base, and having an arm section provided with an electrode film, and a weight section, a weight film provided to the weight section, and the vibrating arm has a first principal surface and a second principal surface in an obverse-reverse relationship, the electrode film and the weight film are disposed on the first principal surface and the second principal surface, and a thickness of the electrode film disposed on the first principal surface, a thickness of the weight film disposed on the first principal surface, a thickness of the electrode film disposed on the second principal surface, and a thickness of the weight film disposed on the second principal surface are each no less than 50 nm and no more than 500 nm.

Abstract: A frequency adjustment method of a vibration element includes adjusting a resonance frequency of the vibration element by irradiating the vibration element, which includes a vibrating arm having a first principal surface and a second principal surface that are in a front and back relationship with each other with an energy ray, to remove a part of the vibrating arm on the first principal surface, and in which an activation amount by the energy ray on the second principal surface of the vibrating arm is smaller than an activation amount by the energy ray on the first principal surface of the vibrating arm.

Abstract: An electronic device includes an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode, an IC so disposed that the IC faces the vibration element, terminals disposed on the side facing the upper surface of the IC and electrically connected to the connection electrode via a fixing member, wiring sections electrically connected to the terminals and located below the terminals, and a protective layer located above the wiring sections and disposed in a portion where the adjustment section overlaps with the wiring sections in a plan view.

Abstract: A vibrator device includes a base; and a vibrator element including a quartz crystal vibrator element attached to the base via a first metal bump, in which the first metal bump is disposed on a straight line inclined within a range of +55° to +65° or ?65° to ?55° with respect to an X axis of the quartz crystal constituting the quartz crystal vibrator element in plan view seen from a direction in which the base and the quartz crystal vibrator element are arranged.

Abstract: A vibrator device includes a base; a circuit element attached to the base; a vibrator element attached to the circuit element; and a plurality of temperature sensors arranged in the circuit element, in which the circuit element includes a first connecting terminal connected to the base, a second connecting terminal connected to the vibrator element, and at least one circuit of an output buffer circuit, a power supply circuit, and a phase-locked loop circuit, and the shortest distance between each of the plurality of temperature sensors and the first connecting terminal or the second connecting terminal is shorter than the shortest distance between each of the temperature sensors and the at least one circuit.

Abstract: A vibrator device includes a base, a first relay substrate mounted on the base, a second relay substrate mounted on the first relay substrate, and a vibrator element mounted on the second relay substrate, in which the second relay substrate is disposed between the first relay substrate and the vibrator, and the second relay substrate includes a terminal that is electrically coupled to the vibrator element and is positioned in a region overlapping with the first relay substrate and not overlapping the vibrator element in a plan view.

Abstract: A vibrator device includes a base, a relay substrate that is supported by the base, and a vibrator element that is supported by the relay substrate. In addition, the vibrator element includes a vibration substrate formed of a piezoelectric single-crystalline body and an excitation electrode disposed on the vibration substrate. In addition, the relay substrate includes a substrate formed of the piezoelectric single-crystalline body. A crystal axis of the substrate and a crystal axis of the vibration substrate are shifted from each other.

Abstract: A vibrator device includes abase, a circuit element that is attached to the base, and a vibrator element that is arranged at an active surface of the circuit element and is attached to the circuit element, and the circuit element includes a terminal for frequency adjustment that is used for frequency adjustment of the vibrator element and is disposed in a region that does not overlap the vibrator element when viewed in a plan view of the active surface.

Abstract: A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.