Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

Abstract: A gas decomposition filter unit (10A) of the present invention includes: a housing (1A) including gas decomposition pellets (3) and having a mesh (5) as a side surface vertical to a direction in which gas flows, which mesh (5) having a mesh size smaller than each of the gas decomposition pellets (3); and a light guide member 4A for causing light having entered from a light source (2) to exit toward the gas decomposition pellets (3), which light guide member 4A is provided along at least one direction so as to extend over a spatial range in which the plurality of gas decomposition pellets (3) are provided along the side surface of the housing.

Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

Abstract: A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).

Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.

Abstract: There is provided a light emitting device highly resistant to the environment, and having good heat resistance, light resistance and gas barrier property, and a method for producing same. With the light emitting device, a substrate 2 and interconnect patterns 5A, 5B formed on the surface thereof are covered with an acrylic resin primer 10 having better gas barrier property than a silicone resin sealing resin part 3. Light resistance is ensured by the silicone resin sealing resin portion 3 and the gas barrier property can be ensured by the acrylic resin primer 10.

Abstract: A backlight device (10) includes: an LED package (12) including an LED chip (12A) and an Ag reflective layer (12B); and an optical member (for example, a prism sheet (16)) for adjusting light emitted from the LED package (12). The optical member (16) adjusts an amount of a halogen thus contained and the like so that emission of halogen is decreased to a degree in which no silver halide is generated on the Ag reflective layer (12B).

Abstract: A light emitting element includes: A light emitting element, includes: at least one LED chip provided on an installation surface of a substrate; a metallic reflecting plate, provided upright in a light projecting direction of the LED chip on the installation surface so as to surround an entire periphery of the LED chip, the metallic reflecting plate reflecting light projected from the LED chip to guide the light to a light projecting surface provided in the light projecting direction; and a first metallic portion and a second metallic portion, respectively connected to the LED chip as electrode terminals for supplying a driving current to the LED chip, each being formed in an area surrounded by the metallic reflecting plate on the installation surface, wherein an insulating section is formed surrounding the second metallic portion, to electrically insulate the second metallic portion from other portion in the area, and the first metallic portion is formed outside the insulating section in the area as an insta

Abstract: A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.

Abstract: To provide a light emitting device that is improved in intensity of light emitted from a light outgoing surface and has excellent heat releasing property, the light emitting device according to the present invention includes an LED chip 501 mounted on a substrate and an insulating section 509 formed on a front surface of the substrate and made of light-transmitting resin. The insulating section 509 has a multilayer structure constituted of a titanium dioxide-added resin layer 509c to which titanium dioxide is added and a titanium dioxide-free resin layer 509b to which no titanium dioxide is added.

Abstract: A light emitter includes reflectors that are spaced apart by a short distance to reduce a thickness of the light emitter. A fabrication method of such light emitters, and an image display using such light emitters are also provided. A light emitter includes: an LED chip 7, reflectors 2 provided on both sides of the LED chip 7, and a second resin layer 4 on which the LED chip 7 and the reflectors 2 are provided. Reflecting faces 9 of the reflectors 2 reflect light emitted by the LED chip 7. In the light emitter, the reflecting faces 9 of the reflectors 2 are formed perpendicular to the second resin layer 4 on which the LED chip 7 is provided.

Abstract: A light emitting element includes: A light emitting element, includes: at least one LED chip provided on an installation surface of a substrate; a metallic reflecting plate, provided upright in a light projecting direction of the LED chip on the installation surface so as to surround an entire periphery of the LED chip, the metallic reflecting plate reflecting light projected from the LED chip to guide the light to a light projecting surface provided in the light projecting direction; and a first metallic portion and a second metallic portion, respectively connected to the LED chip as electrode terminals for supplying a driving current to the LED chip, each being formed in an area surrounded by the metallic reflecting plate on the installation surface, wherein an insulating section is formed surrounding the second metallic portion, to electrically insulate the second metallic portion from other portion in the area, and the first metallic portion is formed outside the insulating section in the area as an insta