Abstract: In a gas turbine and a control method thereof, and a combined cycle plant, the gas turbine includes a compressor that compresses air, a combustor that mixes and combusts compressed air compressed by the compressor and fuel, a turbine that obtains rotational power using combustion gas generated by the combustor, a compressed air cooling heat exchanger that cools the compressed air to produce air for heat exchange, air temperature adjusting heat exchangers that exchange heat between the air and the compressed air, a heat exchange amount adjusting device that adjusts a heat exchange amount of each of the compressed air cooling heat exchanger and the air temperature adjusting heat exchangers, and a control device that controls the heat exchange amount adjusting device, in which the control device controls the heat exchange amount adjusting device based on a temperature of the air to be taken into the compressor.

Abstract: In a gas turbine and a control method thereof, and a combined cycle plant, the gas turbine includes a compressor that compresses air, a combustor that mixes and combusts compressed air compressed by the compressor and fuel, a turbine that obtains rotational power using combustion gas generated by the combustor, a compressed air cooling heat exchanger that cools the compressed air to produce air for heat exchange, air temperature adjusting heat exchangers that exchange heat between the air and the compressed air, a heat exchange amount adjusting device that adjusts a heat exchange amount of each of the compressed air cooling heat exchanger and the air temperature adjusting heat exchangers, and a control device that controls the heat exchange amount adjusting device, in which the control device controls the heat exchange amount adjusting device based on a temperature of the air to be taken into the compressor.

Abstract: In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.

Abstract: In plasma displays in different inch sizes, there is a disadvantage in that because each of the plasma displays in different inch sizes has an output semiconductor device with a different outer shape, a pitch of the external lead and the number of the output semiconductor devices vary, so that printed circuit boards need be designed differently for the different inch sizes. A hybrid integrated circuit includes mounting portions which are composed of a conductive path on an insulated metal substrate, and into which at least an output semiconductor device of a discharge maintaining circuit is incorporated, and includes external terminals arranged at a constant pitch. When the inch size of the plasma display is changed, the mounting portions are designed to have a size enough to accommodate the output semiconductor device for the greatest inch size. Thus, the same hybrid integrated circuit is commonly used.

Abstract: In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.