Patents by Inventor MASASHI TSUBOTANI

MASASHI TSUBOTANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connected board and display device
    Patent number: 10847908
    Abstract: A connected board includes a first circuit board including a first ground and a second circuit board including a second ground. The first circuit board includes a rigid portion and a flexible portion. The rigid portion includes a section of a conductive layer having flexibility and hard substrates prepared from an insulator and having rigidity. The section of the conductive layer is bonded to the hard substrates and held by the hard substrates. The flexible portion includes a section of the conductive layer extending from the rigid portion and a soft substrate covering the section. The soft substrate includes a connection hole for connecting the second circuit board to the first circuit board. The second circuit board is mounted to the flexible portion in the connection hole. The second ground is directly connected to the conductive layer of the first circuit board.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: November 24, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Masashi Tsubotani
  • CONNECTED BOARD AND DISPLAY DEVICE
    Publication number: 20200036119
    Abstract: A connected board includes a first circuit board including a first ground and a second circuit board including a second ground. The first circuit board includes a rigid portion and a flexible portion. The rigid portion includes a section of a conductive layer having flexibility and hard substrates prepared from an insulator and having rigidity. The section of the conductive layer is bonded to the hard substrates and held by the hard substrates. The flexible portion includes a section of the conductive layer extending from the rigid portion and a soft substrate covering the section. The soft substrate includes a connection hole for connecting the second circuit board to the first circuit board. The second circuit board is mounted to the flexible portion in the connection hole. The second ground is directly connected to the conductive layer of the first circuit board.
    Type: Application
    Filed: June 21, 2019
    Publication date: January 30, 2020
    Inventor: MASASHI TSUBOTANI