Abstract: A power supply monitoring circuit monitors an in-vehicle power supply in an ECU. The ECU has power supply circuits powered by the in-vehicle power supply through a power supply line and supplying power to a downstream load. The power supply monitoring circuit includes a voltage supply monitoring circuit and a control circuit. The power supply line is commonly connected to the in-vehicle power supply and the power supply circuits by having a branching node where the power supply line is branched out from the in-vehicle power supply to the power supply circuits. The voltage monitoring circuit monitors the in-vehicle power supply by monitoring the power supply line. The control circuit controls the power supply circuits or a device powered by the power supply circuits to discharge operational charges remained in the power supply circuits or the device.

Abstract: A diode (11) is provided on a substrate (1) and thermally insulated from the substrate (1). A positive feedback circuit (18) provides a positive feedback loop so that when a current of the diode (11) decreases due to a change in temperature of the diode (11), the positive feedback circuit (18) further decreases the current of the diode (11), and when the current of the diode (11) increases, the positive feedback circuit (18) further increases the current of the diode (11).

Abstract: A diode (11) is provided on a substrate (1) and thermally insulated from the substrate (1). A positive feedback circuit (18) provides a positive feedback loop so that when a current of the diode (11) decreases due to a change in temperature of the diode (11), the positive feedback circuit (18) further decreases the current of the diode (11), and when the current of the diode (11) increases, the positive feedback circuit (18) further increases the current of the diode (11).

Abstract: The number of steps required for a welding operation of a work implement of a hydraulic excavator is reduced while the welding quality is improved. A boom includes a top plate, a left side plate joined to the top plate, and a boom foot bracket. The boom foot bracket includes an extending portion. The extending portion includes a portion that faces a side surface of the top plate.

Abstract: There is provided an in-vehicle electronic control apparatus suitable for enhancing a robust characteristic of a failure diagnosis process performed for a functional part having a function relating to a drive-control of an actuator. A functional part (120) relating to the drive-control of an electric motor (12) includes a main functional part (120a) and an alternative functional part (120b) that is an alternative of the main functional part.

Abstract: There is provided an in-vehicle electronic control apparatus suitable for enhancing a robust characteristic of a failure diagnosis process performed for a functional part having a function relating to a drive-control of an actuator. A functional part (120) relating to the drive-control of an electric motor (12) includes a main functional part (120a) and an alternative functional part (120b) that is an alternative of the main functional part.

Abstract: A thermal infrared solid-state imaging device includes a pixel array having pixels diodes, a vertical power supply line connected to horizontal drive lines and commonly connecting the horizontal drive lines, integrating circuits for integrating voltages at the ends of the vertical signal lines for a predetermined integration time, and current sources connected to the vertical signal lines at an opposite end to the end of the vertical signal line which is connected to the integrating circuit. The integration time is equally divided substantially into two periods, and during one divided period of the integration time, energization is performed between one end of the vertical power supply line and the current source, and during the other divided period of the integration time, the energization is performed between other end of the vertical power supply line and the current source.

Abstract: A thermal infrared solid-state imaging device includes a horizontal scanning circuit for scanning a pixel area horizontally to read an infrared image, and vertical scanning circuits provided at both ends of the pixel area. The vertical scanning circuits drive a drive line by applying a driving voltage at both ends of the drive line (in two-end driving). Further a bias voltage is applied at the end of the pixel area to a bias line connected to differential integrating circuits.

Abstract: A thermal infrared imaging device includes a diode, a power supply for supplying a constant power supply voltage to an anode of the diode through a first interconnection, a voltage setting circuit for setting a voltage across the diode, and a current read circuit which is connected to a cathode of the diode through a second interconnection and the voltage setting circuit, for reading a current of the diode. The voltage setting circuit controls a voltage of a connection point of the second interconnection and the voltage setting circuit to a voltage obtained by subtracting a voltage drop from a predetermined bias voltage. The voltage drop is generated by resistances of the first and second interconnections, and the diode current.

Abstract: A thermal infrared solid-state imaging device includes a horizontal scanning circuit for scanning a pixel area horizontally to read an infrared image, and vertical scanning circuits provided at both ends of the pixel area. The vertical scanning circuits drive a drive line by applying a driving voltage at both ends of the drive line (in two-end driving). Further a bias voltage is applied at the end of the pixel area to a bias line connected to differential integrating circuits.

Abstract: A thermal infrared solid-state imaging device includes a pixel array having pixels diodes, a vertical power supply line connected to horizontal drive lines and commonly connecting the horizontal drive lines, integrating circuits for integrating voltages at the ends of the vertical signal lines for a predetermined integration time, and current sources connected to the vertical signal lines at an opposite end to the end of the vertical signal line which is connected to the integrating circuit. The integration time is equally divided substantially into two periods, and during one divided period of the integration time, energization is performed between one end of the vertical power supply line and the current source, and during the other divided period of the integration time, the energization is performed between other end of the vertical power supply line and the current source.

Abstract: An infrared solid state imaging device includes a pixel area with arranged infrared detection pixels and a integration circuit for modulating output current based on the output of the pixel. The integration circuit contains an integrating transistor that modulates a current based on the difference in potential between first and second constant current devices, a integration capacitor for storing the modulated current and being reset periodically, a bias current supply transistor, a switch for connecting the drain with the gate of the bias current supply transistor, a capacitor providing AC coupling between the output of the integrating transistor and the integrating capacitor, a gate bias switch for providing the integrating transistor with a bias voltage, a switch for selecting, as input to the integrating transistor, either one of outputs from the first and second constant current devices, and a capacitor for providing AC coupling between the switch and the gate of the integrating transistor.

Abstract: According to one embodiment, a plurality of light receiving elements photoelectrically convert light signals having information signals, respectively. A plurality of first amplification circuits amplify currents of electric signals from the respective light receiving elements. A selecting section selectively outputs one of signals amplified by the plurality of first amplification circuits. A second amplification circuit amplifies a voltage of the signal output from the selecting section, and supplies the signal to the outside.

Abstract: An infrared solid-state image pickup apparatus includes an SOI substrate having a silicon oxide film layer and an SOI layer on a silicon substrate, a detecting portion which is provided with a PN junction diode formed on the SOI substrate and converts a temperature change generated by an incident infrared ray to an electric signal, and a support that holds the detecting portion with a space from the silicon substrate of the SOI substrate. An impurity in a semiconductor layer constituting the PN junction diode is distributed such that carriers flowing in the semiconductor layer are distributed in such an uneven manner as being much in a central portion of the semiconductor layer than in a peripheral portion thereof.

Abstract: A thermal infrared imaging device includes a diode, a power supply for supplying a constant power supply voltage to an anode of the diode through a first interconnection, a voltage setting circuit for setting a voltage across the diode, and a current read circuit which is connected to a cathode of the diode through a second interconnection and the voltage setting circuit, for reading a current of the diode. The voltage setting circuit controls a voltage of a connection point of the second interconnection and the voltage setting circuit to a voltage obtained by subtracting a voltage drop from a predetermined bias voltage. The voltage drop is generated by resistances of the first and second interconnections, and the diode current.

Abstract: According to one embodiment, a control method, includes moving a pickup head to an adjustment position adjusting the quantity of adjustment of focus balance measuring the amplitude of an RF signal in the adjustment position adjusting the focus balance adjustment quantity and measuring the RG signal amplitude a plurality of times estimating the focus balance adjustment quantity at which the RF signal amplitude is maximized from the measured focus balance adjustment quantities and RF signal amplitude moving the pickup head to a different adjustment position estimating the focus balance adjustment quantity at which the RF signal amplitude is maximized in the different adjustment position by adjusting the focus balance adjustment quantity and measuring the RF signal amplitude a plurality of times and adjusting the focus balance adjustment quantity to the focus balance adjustment quantity estimated in the different adjustment position.

Abstract: An infrared solid state imaging device includes a pixel area with arranged infrared detection pixels and a integration circuit for modulating output current based on the output of the pixel. The integration circuit contains an integrating transistor that modulates a current based on the difference in potential between first and second constant current devices, a integration capacitor for storing the modulated current and being reset periodically, a bias current supply transistor, a switch for connecting the drain with the gate of the bias current supply transistor, a capacitor providing AC coupling between the output of the integrating transistor and the integrating capacitor, a gate bias switch for providing the integrating transistor with a bias voltage, a switch for selecting, as input to the integrating transistor, either one of outputs from the first and second constant current devices, and a capacitor for providing AC coupling between the switch and the gate of the integrating transistor.

Abstract: According to one embodiment, in a data write operation, the average value of the emission power detected by a front monitor is obtained via a low-pass filter and a sample hold circuit. In the write operation, erase power controlled by an erase APC is obtained via a sample hold circuit. While an LD is emitting light with the erase power, an erase current is determined from the output voltage of the erase APC. On the basis of the average power, the erase power, the erase current, and a waveform of the recording pulse, a current-to-emission-power characteristic of the LD is estimated. Furthermore, on the basis of the current-to-emission-power characteristic, the peak power in the write operation of the LD are controlled.

Abstract: A stage apparatus for driving and moving a target object comprises: a movable slider for mounting and moving the target object; a movable-slider driving unit for driving the movable slider; a feedforward compensator for calculating the driving amount to be generated by the movable slider driving unit over the period of time during the movement of the movable slider from the start position up to the target position to which the movable slider is to be moved, based upon the start position and the target position; a movable-slider position sensor for detecting the position of the movable slider; a feedback compensator for calculating the driving amount to be generated by the movable slider driving unit over the period of time during the movement of the movable slider from the start position up to the target position, based upon the target position to which the movable slider is to be moved, and the position of the movable slider detected by the movable-slider position sensor.

Abstract: According to one embodiment, a plurality of light receiving elements photoelectrically convert light signals having information signals, respectively. A plurality of first amplification circuits amplify currents of electric signals from the respective light receiving elements. A selecting section selectively outputs one of signals amplified by the plurality of first amplification circuits. A second amplification circuit amplifies a voltage of the signal output from the selecting section, and supplies the signal to the outside.