Patents by Inventor Masashi UMETSU

Masashi UMETSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240040692
    Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 ?m or less.
    Type: Application
    Filed: July 25, 2023
    Publication date: February 1, 2024
    Applicant: IBIDEN CO., LTD.
    Inventors: Kentaro WADA, Koji KONDO, Kenji KUNIEDA, Masashi UMETSU, Yuta OKAGA