Abstract: An antenna system is provided with an antenna panel 1 which has fine bumps and dips 4 formed on a mirror surface side, which is one of surfaces opposing to each other, by etching, wherein the fine bumps and dips scatter sunlight entering the mirror surface side of the antenna panel 1 to suppress the collection of the sunlight and regularly reflect radio waves having longer wavelength than the sunlight entering the mirror surface side of the antenna panel.

Abstract: An antenna system is provided with an antenna panel 1 which has fine bumps and dips 4 formed on a mirror surface side, which is one of surfaces opposing to each other, by etching, wherein the fine bumps and dips scatter sunlight entering the mirror surface side of the antenna panel 1 to suppress the collection of the sunlight and regularly reflect radio waves having longer wavelength than the sunlight entering the mirror surface side of the antenna panel.

Abstract: According to an aspect of the present invention, an antenna system comprises: an antenna panel (1) which has fine irregularities (4) on front and back surfaces thereof, the fine irregularities (4) being formed by blasting so as to regularly reflect service radio waves having longer wavelength than sunlight and scatter sunlight. Further, according to another aspect of the present invention, a method for manufacturing an antenna system in which an antenna panel (1) is manufactured by combining a plurality of constituent parts, comprises the steps of: finishing front and back surface portions of each of the constituent parts so as to thin down the thickness of constituent parts; blasting the front and back surface portions of the constituent parts with abrasive grains; combining the plurality of constituent parts subjected to the blasting step so as to form the antenna panel (1) into a desired shape; and attaching an assistant reflecting mirror (3) to the antenna panel (1) acting as a main reflecting mirror.

Abstract: According to an aspect of the present invention, an antenna system comprises: an antenna panel (1) which has fine irregularities (4) on front and back surfaces thereof, the fine irregularities (4) being formed by blasting so as to regularly reflect service radio waves having longer wavelength than sunlight and scatter sunlight. Further, according to another aspect of the present invention, a method for manufacturing an antenna system in which an antenna panel (1) is manufactured by combining a plurality of constituent parts, comprises the steps of: finishing front and back surface portions of each of the constituent parts so as to thin down the thickness of constituent parts; blasting the front and back surface portions of the constituent parts with abrasive grains; combining the plurality of constituent parts subjected to the blasting step so as to form the antenna panel (1) into a desired shape; and attaching an assistant reflecting mirror (3) to the antenna panel (1) acting as a main reflecting mirror.

Abstract: A method for forming a contact hole in an active matrix substrate, the method comprising steps of: (a) depositing an insulating film covering a first electrode provided on a substrate and the substrate; (b) forming a contact hole by patterning said insulating film by means of dry etching; and (c) forming a second electrode, and contacting the second electrode with the first electrode; wherein in the step (b) after forming a contact hole by dry etching, a surface treatment by plasma etching or reactive ion etching with oxygen gas under a condition in which a pressure P is in a range of 100 Pa to 400 Pa is performed.

Abstract: A method of providing a contact hole including (a) depositing a first conductive film on a substrate and patterning the first conductive film to form a first electrode line, (b) depositing an insulating film on the first electrode line and the substrate, (c) forming a contact hole in the insulating film over a top surface of the first electrode line, and (d) depositing a second conductive film on the insulating film and the contact hole and patterning the second conductive film to form a second electrode line, wherein a surface of the first conductive film is subjected to an oxidizing operation in step (a) so that a contact resistance of the contact hole is lowered.