Patents by Inventor Masashi Yajima

Masashi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow soldering apparatus
    Patent number: 4847465
    Abstract: A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.
    Type: Grant
    Filed: September 2, 1986
    Date of Patent: July 11, 1989
    Assignee: Sony Corporation
    Inventors: Toshio Toyama, Kazuya Kato, Tadamasa Tanaka, Masashi Yajima, Harutaka Hayasaka, Toru Arai, Hitoshi Terada