Abstract: An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

Abstract: An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

Abstract: A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module includes a mold part and is arranged along the heat receiving surface of the heat sink. Motor leads are taken out from the motor case and electrically connected to the power module and winding wires. The drive apparatus has the motor case, a control circuit substrate, the heat sink, the power module and a power circuit substrate arranged in this order in the axial direction. The motor leads are connected to the power module at an opposite side of the motor case relative to the mold part in the axial direction.

Abstract: Two power modules, in which switching elements for switching over currents supplied to coils of a motor are resin-molded, are provided to face each other sandwiching a plane including a rotation axis of a shaft. A first smoothing capacitor, second smoothing capacitors and a choke coil are located between the power modules. By consolidating large-sized electronic parts between the power modules, a control unit can be reduced in size and impedance of electric conductor connecting the electronic parts and the power modules can be reduced.

Abstract: A heat sink is provided on a motor. A power module is provided on the heat sink to switch current supply to motor coils. A control circuit substrate is arranged on the heat sink and connected electrically to the power module. A power circuit substrate is connected electrically to the power module and arranged at an opposite side of the control circuit substrate relative to the heat sink. A control circuit connector is electrically connected to the control circuit substrate. A power circuit connector is electrically connected to the power circuit substrate. The control circuit connector and the power circuit connector are arranged between the control circuit substrate and the power circuit substrate.

Abstract: In two systems of three-phase alternating-current inverter devices that drive a motor, power elements on power supply sides of bridge circuits are mounted on unit bases to constitute upper arm units. Power elements on ground sides of the bridge circuits are mounted on unit bases to constitute lower arm units. The upper arm units and the lower arm units are arranged separately on upper surfaces and outside surfaces of heat dissipation blocks of a heat sink. Heats generated by the power elements do not interfere with each other and are emitted to the heat sink, whereby heat dissipation performance of the power elements constituting the bridge circuits is improved.

Abstract: A power module of a drive unit of an electric motor is formed by inserting multiple power transistors, which supply a drive current to a coil wound around a stator or a rotor, and wirings connecting the power transistors in a resin, which is formed in the shape of a plate, by resin molding. Electronic components such as aluminum electrolytic capacitors, a choke coil and a first connector are provided in a board thickness direction of the power module and are electrically connected with the wirings of the power module. Thus, a construction for electrically connecting the wirings of the power module formed by the resin molding and the electronic components can be simplified.

Abstract: A power module, a control board and a heat sink are provided on one axial side of a shaft of an electric motor, which consists of a motor case, a stator, a rotor, the shaft and the like. The power module is electrically connected with extraction lines, which extend from a coil wound around the stator, and supplies a drive current to the coil. The control board for controlling switching of the power module is provided on a motor case side of the power module. The heat sink is provided on a side of the control board opposite to the motor case. Thus, when setting of an output of the electric motor is changed, a body size of the heat sink can be changed without changing a positional relationship between the control board and the electric motor and a positional relationship between the power module and the electric motor.

Abstract: A power module for supplying driving current to coils wound on a stator of an electric motor and a heat sink for absorbing heat generated at the power module are provided at an axial outside of a motor casing. An intermediate member is provided between the motor casing and the heat sink. The intermediate member has a bottom plate portion fixed to an axial end plate of the motor casing and a cylindrical side wall axially extending from the bottom plate portion. An outer peripheral surface of the heat sink is in contact with an inner peripheral surface of the cylindrical side wall, so that the power module fixed to the heat sink is arranged in a space, which is within a range smaller than an outer diameter of the motor casing.

Abstract: An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.

Abstract: A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.

Abstract: A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: A tabletop electric stirrer includes a rotating body and an electric rotating drive. This stirrer can perform stirring efficiently, can easily crush and dissolve a water soluble capsule not only in hot water but also in cold water, and can crush a plurality of capsules in a short period of time.

Abstract: A tabletop electric stirrer comprising a rotating body and an electric rotating means, wherein the rotating body comprises a stirring shaft, a rotating disk, and a stirring means provided with stirring blades, the stirring means being provided at one end of the stirring shaft, the rotating disk being provided directly above the stirring blades provided to the stirring means, and the other end of the stirring shaft being configured so as to be connected to the electric rotating means, wherein the stirring means has a spherical or conical tip, the tip being located on a center line of the stirring shaft, and a maximum diameter of a cross-section of the stirring means perpendicular to the stirring shaft is greater than a diameter of the stirring shaft and smaller than a diameter of the rotating disk, wherein the stirring blades are provided in such a manner that at least two stirring blades are located along an outer circumference with the maximum diameter of the stirring means so as to face the stirring shaft,

Abstract: A method of inspecting an electronic circuit that includes a first integrated circuit and a second integrated circuit formed on a circuit board. The first integrated circuit has a first power source, and an input circuit that has a test signal output section and the second integrated circuit has a second power source and an output circuit that has a signal input section. The method includes steps of: turning on the first and second power sources at prescribed voltage levels; changing voltage level of the first power source; applying a test signal to the signal input section of the second integrated circuit; detecting an output signal of the signal output section of the first integrated circuit; and examining whether there is a sufficient margin in the electronic circuit by comparing the test signal and the output signal.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: An electronic control system has a microcomputer monitoring section and an output controlling section. A microcomputer is prohibited from controlling control objects of a vehicle by a control prohibition section in the output controlling section and monitoring halting section halts the abnormality monitoring program executed by a monitoring section, when there is a heavy-load program processing request. Thus, the microcomputer executes the heavy-load program processing with reduced processing load. The abnormality monitoring is started by the monitoring section, when the processing of the heavy-load program is terminated. Further, after normal operation of the microcomputer is checked, the control system allows the microcomputer to start controlling the control objects.