Patents by Inventor Masashiro Shindo

Masashiro Shindo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink element and high-frequency electronic circuit substrate using such
    Publication number: 20020071252
    Abstract: A heat sink element in the form of a coil with a high thermal conductivity is formed. One end of the heat sink element is directly connected to a circuit element connection conductor under a high potential in a high-frequency circuit mounted on an electronic circuit substrate, and the other end thereof is directly secured to a metal case having the electronic circuit substrate contained therein. As a result, the heat sink element serves as a heat channel transferring the heat generated due to the temperature increase in the circuit element connection conductor to the metal case by means of thermal conductivity.
    Type: Application
    Filed: December 10, 2001
    Publication date: June 13, 2002
    Inventors: Choichirou Kodaka, Masashiro Shindo, Tadashi Ito