Patents by Inventor Masasi Ookubo

Masasi Ookubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4931726
    Abstract: A semiconductor device testing apparatus which has a plurality of probes and plurality of coaxial cables connected therewith for impedance matching and a plurality of springs for providing flexibility to the individual probes to absorb a level difference in the surface of a semiconductor device.The apparatus constructed in this manner allows for an effective test of a semiconductor device with a high density electrode arrangement.
    Type: Grant
    Filed: June 21, 1988
    Date of Patent: June 5, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Susumu Kasukabe, Masasi Ookubo, Yutaka Akiba, Minoru Tanaka, Hitoshi Yokono