Abstract: A technology for placing spacers free from the occurrence of streaks is provided. Random numbers are generated by a computer, and made in one-by-one association with discharge positions of an object for discharging every generation, and stored in a memory unit of the computer. Coefficient values are determined for the respective discharge positions based on the stored random numbers, and individual voltage values to be required for the respective discharge positions are calculated through the multiplication of voltages set for respective nozzle holes N1 to Nn by the coefficient values. When the respective voltages corresponding to the discharge positions are applied to piezoelectric elements inside a discharge head and a discharge liquid containing the spacers are discharged through the plural nozzles N1 to Nn provided in the discharge head, the spacers are placed on the object for discharging by numbers according to the random numbers.

Abstract: A technology for placing spacers free from the occurrence of streaks is provided. Random numbers are generated by a computer, and made in one-by-one association with discharge positions of an object for discharging every generation, and stored in a memory unit of the computer. Coefficient values are determined for the respective discharge positions based on the stored random numbers, and individual voltage values to be required for the respective discharge positions are calculated through the multiplication of voltages set for respective nozzle holes N1 to Nn by the coefficient values. When the respective voltages corresponding to the discharge positions are applied to piezoelectric elements inside a discharge head and a discharge liquid containing the spacers are discharged through the plural nozzles N1 to Nn provided in the discharge head, the spacers are placed on the object for discharging by numbers according to the random numbers.

Abstract: According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.

Abstract: According to the invention, when targets are sputtered, each of them moves with respect to a substrate; and therefore, the entire area of the substrate is opposed to the targets during sputtering, so that a film of homogeneous quality can be formed on the surface of the substrate. During the sputtering, not only the targets but also magnetic field forming devices are moved relative to the targets, and therefore, a large area of the targets can be sputtered. In addition, when the magnetic field forming devices are also moved with respect to the substrate, the region of the target which is highly sputtered, moves with respect to the substrate, so that the thickness distribution of the film formed on the substrate can be even more uniform.