Patents by Inventor Masataka Arai

Masataka Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10724636
    Abstract: Provided is a combined oil ring that further reduces engine oil consumption. A combined oil ring attached to an oil ring groove of a piston includes: a pair of upper and lower side rails each formed into a flat annular shape, and having a slide contact part that comes into sliding contact with a cylinder; and a spacer expander arranged between the pair of upper and lower side rails. In at least the upper side rail of the pair of upper and lower side rails, a cross-sectional shape of the slide contact part along an axial direction of the piston is a tapered shape linearly spreading from upper to lower parts of the piston; the tapered shape is at an angle of 5 to 30 degrees with respect to a central axis of the spacer expander, and has a vertex of the tapered shape within 0.15 mm from a lower end of the side rail; and a part closer to the lower end than the vertex is formed into a curved shape having a curvature of R0.01 to 0.5.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: July 28, 2020
    Assignee: NIPPON PISTON RING CO., LTD.
    Inventors: Masataka Kawasaki, Mamoru Miyamoto, Hideshi Hitosugi, Kenji Arai
  • Patent number: 10493749
    Abstract: A printing apparatus includes a printing head configured to eject a first ink and a second ink, wherein the second ink generates less deposition than the first ink, an ink absorber configured to absorb the ink ejected from the printing head, a detection unit configured to detect a state of the ink absorber through an optical method, and a control unit configured to cause the printing head to eject the second ink to the ink absorber based on a detection result of the detection unit.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 3, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomoki Yamamuro, Atsushi Arai, Masaya Uetsuki, Toshimitsu Danzuka, Kazuo Suzuki, Yoshinori Nakagawa, Masataka Kato, Tsuyoshi Ibe, Shin Genta, Tatsuaki Orihara
  • Publication number: 20190329640
    Abstract: A vibration prevention device i ncludes a vehicle body-side bracket having an inner space and a vibration prevention member disposed in the inner space. A press-fitting surface and a press-fitting groove are formed on an inner surface of the vehicle body side bracket. The press-fitting surface and the press-fitting groove extend from an edge portion of the inner space opening through an outer surface of the bracket, The vibration prevention member has a first attachment member, a second attachment member, and an insulator disposed between the first attachment member and the second attachment member. The second attachment member has an abutting portion pressed against the press-fitting surface and an attachment portion press-fitted into the press-fitting groove.
    Type: Application
    Filed: April 23, 2019
    Publication date: October 31, 2019
    Inventors: Hirokazu Kadowaki, Masataka Hirano, Yusuke Arai
  • Patent number: 10350893
    Abstract: An inkjet printing apparatus includes a head, a platen, a platen absorbent that temporarily stores ink ejected from the head, a waste ink storage container that stores the ink discharged from the platen absorbent, and an estimation unit that, in a case where the platen is divided into a plurality of regions in a direction intersecting a conveyance direction of the printing medium, estimates an amount of ink stored in the waste ink storage container based on a position of a region to which the ink is ejected by the head and an amount of ink ejected to the region.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshinori Nakagawa, Atsushi Arai, Masaya Uetsuki, Toshimitsu Danzuka, Kazuo Suzuki, Masataka Kato, Tsuyoshi Ibe, Shin Genta, Tatsuaki Orihara, Tomoki Yamamuro
  • Patent number: 8629556
    Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: January 14, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Mitsuo Sugino, Takeshi Hosomi, Masahiro Wada, Masataka Arai
  • Publication number: 20110120630
    Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.
    Type: Application
    Filed: January 26, 2011
    Publication date: May 26, 2011
    Applicant: Sumitomo Bakelite Co., Ltd.
    Inventors: Maroshi YUASA, Takeshi Hosomi, Masataka Arai
  • Patent number: 7655871
    Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: February 2, 2010
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
  • Publication number: 20090321919
    Abstract: The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.
    Type: Application
    Filed: April 20, 2007
    Publication date: December 31, 2009
    Inventors: Mitsuo Sugino, Takeshi Hosomi, Masahiro Wada, Masataka Arai
  • Publication number: 20090166060
    Abstract: An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.
    Type: Application
    Filed: March 20, 2006
    Publication date: July 2, 2009
    Inventors: Iji Onozuka, Masataka Arai, Takeshi Hosomi
  • Publication number: 20090126974
    Abstract: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit board utilizing the prepreg with a carrier are provided. There is provided a process for continuously manufacturing a prepreg with a carrier comprising an insulating resin layer having a backbone material of a textile fabric, (a) laminating the insulating resin layer side of a first and a second carriers comprising an insulating resin layer on one side on the both sides of the textile fabric, respectively, to form a laminate and bonding them under a reduced pressure, and (b) after the bonding, heating the laminate at a temperature equal to or higher than a melting point of the insulating resin.
    Type: Application
    Filed: September 27, 2006
    Publication date: May 21, 2009
    Inventors: Maroshi Yuasa, Takeshi Hosomi, Masataka Arai
  • Publication number: 20080254300
    Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.
    Type: Application
    Filed: March 23, 2005
    Publication date: October 16, 2008
    Inventors: Masataka Arai, Takeshi Hosomi, Hiroaki Wakabayashi
  • Publication number: 20080193886
    Abstract: A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has an annular container (12) having an inner cylindrical portion (15) forming an inner circumferential side surface, an outer cylindrical portion (13) forming an outer circumferential side surface, an open end (26), and a close end (10). A flow (28) of air is formed so as to have a velocity component in the direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of the annular container (12). Fuel (23) is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.
    Type: Application
    Filed: February 9, 2005
    Publication date: August 14, 2008
    Applicant: EBARA CORPORATION
    Inventors: Shunsuke Amano, Masataka Arai
  • Publication number: 20070272201
    Abstract: A combustion apparatus according to the present invention can positively control and generate burnt gas recirculation with a simple structure. The combustion apparatus has a cylindrical container (12) having a combustion chamber, a close end (10), and an open end (26), an inflow passages (20) for supplying combustion air into the combustion chamber in the cylindrical container (12), and a fuel nozzle (18) for supplying fuel into the combustion chamber in the cylindrical container (12). A flow (28) of air is formed so as to have a velocity component in a direction of a central axis (J) from the open end (26) to the close end (10) and a velocity component to swirl in a circumferential direction of said annular container (12). Fuel is injected so as to have a velocity component in the direction of the central axis (J) from the close end (10) to the open end (26) and a velocity component directed radially outward.
    Type: Application
    Filed: February 9, 2005
    Publication date: November 29, 2007
    Applicant: EBARA CORPORATION
    Inventors: Shunsuke Amano, Masataka Arai
  • Patent number: 7071273
    Abstract: Provided are a tetrafluoroethylene copolymer excellent in paste extrudability, which comprises a unit based on tetrafluoroethylene and a unit based on a monomer represented by a formula of CF2?CF—O—(CF2)nCF?CF2 (wherein n is an integer of from 1 to 6), wherein a content of the unit based on the monomer represented by the formula is from 0.1 to 0.5% by mass, wherein a particle size of a primary particle is from 0.1 to 0.5 ?m, wherein a standard specific gravity is from 2.14 to 2.25, wherein a paste extrusion pressure is from 24.5 to 73.5 MPa and wherein the copolymer remains not undergoing melt molding; a fine powder of a tetrafluoroethylene copolymer; and a production method and a paste extruded product thereof. The TFE copolymer is excellent in paste extrudability and the molded product thereof is excellent in heat resistance and transparency.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: July 4, 2006
    Assignee: Asahi Glass Company, Limited
    Inventors: Shigeki Kobayashi, Shinya Higuchi, Masataka Arai, Hiroki Nagai
  • Patent number: 7009018
    Abstract: Provided is a tetrafluoroethylene copolymer consisting of a unit based on tetrafluoroethylene and a unit based on a monomer represented by CF2?CFORf1Rf2 (where Rf1 is a polyfluoroalkylene group which may contain an etheric oxygen atom and Rf2 is a polyfluorocycloalkyl group which may contain an etheric oxygen atom), wherein a content of the latter is from 0.005 to 0.5% by mass. The tetrafluoroethylene copolymer is excellent both in paste extrudability and in heat resistance, has characteristics such as excellent transparency of a molded product, and is suitably applicable to paste extrusion and compression molding.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: March 7, 2006
    Assignee: Asahi Glass Company, Limited
    Inventors: Kazuya Oharu, Hidekazu Okamoto, Shin Tatematsu, Shigeki Kobayashi, Shinya Higuchi, Masataka Arai, Hiroki Nagai
  • Publication number: 20050187363
    Abstract: Provided is a tetrafluoroethylene copolymer consisting of a unit based on tetrafluoroethylene and a unit based on a monomer represented by CF2?CFORf1Rf2 (where Rf1 is a polyfluoroalkylene group which may contain an etheric oxygen atom and Rf2 is a polyfluorocycloalkyl group which may contain an etheric oxygen atom), wherein a content of the latter is from 0.005 to 0.5% by mass. The tetrafluoroethylene copolymer is excellent both in paste extrudability and in heat resistance, has characteristics such as excellent transparency of a molded product, and is suitably applicable to paste extrusion and compression molding.
    Type: Application
    Filed: March 16, 2005
    Publication date: August 25, 2005
    Applicant: Asahi Glass Company, Limited
    Inventors: Kazuya Oharu, Hidekazu Okamoto, Shin Tatematsu, Shigeki Kobayashi, Shinya Higuchi, Masataka Arai, Hiroki Nagai
  • Publication number: 20050064195
    Abstract: Provided are a tetrafluoroethylene copolymer excellent in paste extrudability, which comprises a unit based on tetrafluoroethylene and a unit based on a monomer represented by a formula of CF2?CF—O—(CF2)nCF?CF2 (wherein n is an integer of from 1 to 6), wherein a content of the unit based on the monomer represented by the formula is from 0.1 to 0.5% by mass, wherein a particle size of a primary particle is from 0.1 to 0.5 ?m, wherein a standard specific gravity is from 2.14 to 2.25, wherein a paste extrusion pressure is from 24.5 to 73.5 MPa and wherein the copolymer remains not undergoing melt molding; a fine powder of a tetrafluoroethylene copolymer; and a production method and a paste extruded product thereof. The TFE copolymer is excellent in paste extrudability and the molded product thereof is excellent in heat resistance and transparency.
    Type: Application
    Filed: November 22, 2004
    Publication date: March 24, 2005
    Applicant: ASAHI GLASS COMPANY LIMITED
    Inventors: Shigeki Kobayashi, Shinya Higuchi, Masataka Arai, Hiroki Nagai
  • Publication number: 20050040342
    Abstract: There is disclosed a vessel for pretreatment of elementary analysis wherein the vessel is a ceramic vessel produced by chemical vapor deposition (CVD) method. And there is disclosed an inductively coupled plasma torch that has at least an induction coil and a nozzle and is used in an apparatus for elementary analysis by ICP method, wherein the nozzle is a ceramic nozzle produced by CVD method. Thus, there can be provided a vessel for pretreatment of elementary analysis that excels in heat resistance and chemical resistance such as acid resistance, and has high purity. There can be also provided an inductively coupled plasma torch used in an apparatus for analysis by ICP method that enables accurate elementary analysis and excels in durability, and an apparatus for elementary analysis by ICP method having this.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 24, 2005
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Noboru Kimura, Joji Kuniya, Masataka Arai
  • Patent number: 6447915
    Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: September 10, 2002
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Toshio Komiyatani, Masao Uesaka, Masataka Arai, Hitoshi Kawaguchi
  • Patent number: 4143110
    Abstract: Finely ground polytetrafluoroethylene molding powder with or without a filler is subjected to high speed agitation in the presence of a medium consisting essentially of water and a hydrophobic organic liquid at a ratio of 0.5 to 1 liter per 1 Kg of the resin to agglomerate it. Hydrophobic organic liquids mean organic liquid which dissolve less than 15 wt. % in water at the temperature of agglomeration.The volumetric ratio of the organic liquid to water is in a range of 2 to 1/2.The agglomerated product having narrow particle size distribution and high bulk density and free flowing property can be obtained by the agitation for short time.
    Type: Grant
    Filed: July 8, 1977
    Date of Patent: March 6, 1979
    Assignee: Asahi Glass Company Ltd.
    Inventors: Mituharu Morozumi, Masataka Arai, Shigeru Iseki