Abstract: A device test method performed in a substrate test apparatus which includes a mounting table for mounting thereon a substrate on which a device having an electrode is formed, the mounting table being movable by a X-direction motor and a Y-direction motor, and a probe card arranged to face the mounting table. A measuring electrode is arranged to correspond to the electrode of the device, the probe card has a probe that is engageable with the measuring electrode, and the X-direction motor or Y-direction motor generates torque to keep the mounting table from moving when measuring an electrical characteristic of the device. In the device test method, after the probe is engaged with the measuring electrode, when measuring an electrical characteristic of the device, the maximum value of the torque generated by the X-direction motor or Y-direction motor is limited to a predetermined value or less.

Abstract: A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

Abstract: A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.

Abstract: A device test method performed in a substrate test apparatus which includes a mounting table for mounting thereon a substrate on which a device having an electrode is formed, the mounting table being movable by a X-direction motor and a Y-direction motor, and a probe card arranged to face the mounting table. A measuring electrode is arranged to correspond to the electrode of the device, the probe card has a probe that is engageable with the measuring electrode, and the X-direction motor or Y-direction motor generates torque to keep the mounting table from moving when measuring an electrical characteristic of the device. In the device test method, after the probe is engaged with the measuring electrode, when measuring an electrical characteristic of the device, the maximum value of the torque generated by the X-direction motor or Y-direction motor is limited to a predetermined value or less.

Abstract: A cooling device operating method and corresponding cooling device used in an inspection apparatus. The method controls a cooling device which in turn cools a wafer chuck on which a semiconductor wafer is loaded. The temperature of the wafer chuck is controllable using the cooling device and a heating device. Low temperature and high temperature inspections of the wafer are performed under control of the controller. The cooling device is continuously run via the controller for the low temperature inspection, but it is stopped at least one time at the start of the high temperature inspection via the controller.

Abstract: A probe device, for performing an electrical test of a semiconductor device formed on a semiconductor wafer, includes a mounting table on which the semiconductor wafer is mounted, a driving mechanism configured to bring a probe into contact with an electrode of the semiconductor device mounted on the mounting table, and a temperature control mechanism configured to control a temperature of the mounting table. The mounting table includes a disk-shaped first electrode, a disk-shaped second electrode, and a disk-shaped insulating plate interposed between the first electrode and the second electrode. The first electrode, the second electrode and the insulating plate are fixed to each other at a fixing part provided at their respective centers, and are locked to be movable in a diametric direction at a locking part provided at an outer side of the fixing part in the diametric direction.

Abstract: A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.

Abstract: A cooling device operating method which is capable of reducing power consumption of the cooling device used in an inspection apparatus. The method controls a cooling device which cools a wafer chuck on which a semiconductor wafer is loaded. The temperature of the wafer chuck is controllable through the cooling device and a heating device. Low temperature and high temperature inspections of the wafer can be performed under control of the controller, and the cooling device is continuously run through control of the controller for the low temperature inspection while it is stopped at least one time at the start of the high temperature inspection through the controller for the high temperature inspection.

Abstract: A temperature control apparatus that controls a temperature of a target object by a heat exchange between a temperature control liquid and the target object. The apparatus includes a pressurizing unit that pressurizes the temperature control liquid to increase a boiling point thereof; a heating unit that increases a temperature of the temperature control liquid to become higher than or equal to a boiling point of the temperature control liquid observed at a normal pressure; and a heat exchanging unit that exchanges heat between the target object and the temperature control liquid whose temperature has been increased to become higher than or equal to the boiling point of the temperature control liquid observed at the normal pressure.

Abstract: A water removal apparatus removes water contained in a coolant circulating between a target object and a cooling system through a circulation line. The water removal apparatus includes a bypass line through which a part of the coolant separated from the circulation line flows; a heat exchanger, provided in the bypass line, for heating the coolant flowing along the bypass line by using a waste heat of the cooling system; and a water adsorption material, provided at a downstream side of the heat exchanger, for adsorbing the water contained in the coolant. Further, an inspection apparatus, for performing an inspection for a semiconductor wafer mounted on the target object while controlling a temperature of the semiconductor wafer on the target object, includes the water removal apparatus.

Abstract: A pulsation reducing apparatus is used for an apparatus having a pump for circulating a liquid in a circulating line and a tank for storing the liquid circulating via the pump. The pulsation reducing apparatus includes a supplement tank for reserving the liquid such that a liquid surface height of the supplement tank is higher than that of the tank. The tank is connected to the supplement tank and the empty space portion of the tank is connected to the supplement tank via a gas exhaust line. When the empty space portion of the tank communicates with that of the supplement tank via the gas exhaust line due to a reduction of the liquid in the tank, the gas in the tank is exhausted to the empty space portion of the supplement tank via the gas exhaust line and the liquid in the supplement tank is supplemented into the tank.

Abstract: A cooling/heating apparatus for circulating the cooled or heated transfer medium to a load to thereby cool or heat the load includes a heat transfer medium circulation path and a Stirling heat engine. The Stirling heat engine includes a first and a second cylinder chamber; a first and a second piston for expanding or compressing an operation gas in the first and the second cylinder chamber; and a driving mechanism for driving the first and the second piston. When the driving mechanism is driven in a forward direction, the operation gas is expanded in the first cylinder chamber and its temperature decreases, thus cooling the heat transfer medium, whereas, when the driving mechanism is driven in a backward direction, the operation gas is compressed in the first cylinder chamber and its temperature increases, thus heating the heat transfer medium.

Abstract: A temperature control apparatus that controls a temperature of a target object by a heat exchange between a temperature control liquid and the target object. The apparatus includes a pressurizing unit that pressurizes the temperature control liquid to increase a boiling point thereof; a heating unit that increases a temperature of the temperature control liquid to become higher than or equal to a boiling point of the temperature control liquid observed at a normal pressure; and a heat exchanging unit that exchanges heat between the target object and the temperature control liquid whose temperature has been increased to become higher than or equal to the boiling point of the temperature control liquid observed at the normal pressure.

Abstract: A cooling/heating apparatus for circulating the cooled or heated transfer medium to a load to thereby cool or heat the load includes a heat transfer medium circulation path and a Stirling heat engine. The Stirling heat engine includes a first and a second cylinder chamber; a first and a second piston for expanding or compressing an operation gas in the first and the second cylinder chamber; and a driving mechanism for driving the first and the second piston. When the driving mechanism is driven in a forward direction, the operation gas is expanded in the first cylinder chamber and its temperature decreases, thus cooling the heat transfer medium, whereas, when the driving mechanism is driven in a backward direction, the operation gas is compressed in the first cylinder chamber and its temperature increases, thus heating the heat transfer medium.

Abstract: A water removal apparatus removes water contained in a coolant circulating between a target object and a cooling system through a circulation line. The water removal apparatus includes a bypass line through which a part of the coolant separated from the circulation line flows; a heat exchanger, provided in the bypass line, for heating the coolant flowing along the bypass line by using a waste heat of the cooling system; and a water adsorption material, provided at a downstream side of the heat exchanger, for adsorbing the water contained in the coolant. Further, an inspection apparatus, for performing an inspection for a semiconductor wafer mounted on the target object while controlling a temperature of the semiconductor wafer on the target object, includes the water removal apparatus.

Abstract: A pulsation reducing apparatus is used for an apparatus having a pump for circulating a liquid in a circulating line and a tank for storing the liquid circulating via the pump. The pulsation reducing apparatus includes a supplement tank for reserving the liquid such that a liquid surface height of the supplement tank is higher than that of the tank. The tank is connected to the supplement tank and the empty space portion of the tank is connected to the supplement tank via a gas exhaust line. When the empty space portion of the tank communicates with that of the supplement tank via the gas exhaust line due to a reduction of the liquid in the tank, the gas in the tank is exhausted to the empty space portion of the supplement tank via the gas exhaust line and the liquid in the supplement tank is supplemented into the tank.

Abstract: A Stirling refrigeration system (1) comprises two Stirling refrigeration units (4a, 4b) incorporating respective working gas end (WGE) heat exchangers (35a, 35b) and radiators (65a, 65b). Cooling water circulates through a first radiator (65a), a first WGE heat exchanger (35a), a second radiator (65a), a second WGE heat exchanger (35a), and a cooling-water pump (67) in sequence. To facilitate deaeration of the cooling-water circuit at time of feeding cooling water, An air release duct (85) is provided at the maximal point of the cooling-water circuit. An air release valve (79) is formed in the open end of the air release duct (85) so that the air remaining in the cooling-water circuit can be easily released. The Stirling refrigeration system is compact in dimensions.

Abstract: A Stirling refrigeration system (1) comprises two Stirling refrigeration units (4a, 4b) incorporating respective working gas end (WGE) heat exchangers (35a, 35b) and radiators (65a, 65b). Cooling water circulates through a first radiator (65a), a first WGE heat exchanger (35a), a second radiator (65a), a second WGE heat exchanger (35a), and a cooling-water pump (67) in sequence. To facilitate deaeration of the cooling-water circuit at time of feeding cooling water, An air release duct (85) is provided at the maximal point of the cooling-water circuit. An air release valve (79) is formed in the open end of the air release duct (85) so that the air remaining in the cooling-water circuit can be easily released. The Stirling refrigeration system is compact in dimensions.

Abstract: According to the present invention, a main chuck, on which a wafer having a number of devices is held, is driven under the control of a computer, and the devices on the wafer are brought into electric contact with the probes arranged on the upper side of the main chuck. On the basis of outputs from the probes, a tester sequentially measures the electric characteristics of the devices.

Abstract: A temperature control apparatus for a sample susceptor is described, the temperature control apparatus is easy to maintain, which can set a temperature in a wide range from a low temperature to a high temperature, which is compact and which does not require a special processing for disposing of a cooling medium.A temperature control apparatus for a sample susceptor has a cooling unit for cooling a sample susceptor on which a wafer W is mounted, an electric heater for heating the sample susceptor, a temperature detecting unit for detecting the temperature of the sample susceptor, and a temperature adjusting unit for controlling the cooling unit and the heating unit based on a detection signal of the temperature detecting unit.