Patents by Inventor Masataka Matsunaga
Masataka Matsunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230207331Abstract: A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.Type: ApplicationFiled: March 30, 2021Publication date: June 29, 2023Inventors: Takuo Kawauchi, Masataka Matsunaga, Ryoichi Sakamoto, Masaru Honda, Satoshi Nishimura
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Patent number: 10840213Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.Type: GrantFiled: July 7, 2017Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takahiro Masunaga, Yasutaka Soma, Takashi Koga, Shogo Hara, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
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Patent number: 10424502Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.Type: GrantFiled: July 7, 2017Date of Patent: September 24, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takahiro Masunaga, Takashi Koga, Yasuharu Iwashita, Shingo Katsuki, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
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Patent number: 10340248Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.Type: GrantFiled: July 7, 2017Date of Patent: July 2, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
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Publication number: 20180019226Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Yasutaka SOMA, Takashi KOGA, Shogo HARA, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
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Publication number: 20180019153Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Takashi KOGA, Yasuharu IWASHITA, Shingo KATSUKI, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
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Publication number: 20180019225Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takashi KOGA, Takeshi TAMURA, Takahiro MASUNAGA, Yuji MIMURA, Masaru HONDA, Toshifumi INAMASU, Satoshi NISHIMURA
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Patent number: 9607869Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.Type: GrantFiled: August 12, 2014Date of Patent: March 28, 2017Assignee: Tokyo Electron LimitedInventors: Masataka Matsunaga, Naoto Yoshitaka, Satoshi Nishimura
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Patent number: 9330898Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.Type: GrantFiled: March 4, 2011Date of Patent: May 3, 2016Assignee: Tokyo Electron LimitedInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Patent number: 9165758Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.Type: GrantFiled: December 26, 2011Date of Patent: October 20, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Naoto Yoshitaka, Yasuharu Iwashita, Masataka Matsunaga
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Publication number: 20150059985Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.Type: ApplicationFiled: August 12, 2014Publication date: March 5, 2015Inventors: Masataka Matsunaga, Naoto Yoshitaka, Satoshi Nishimura
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Publication number: 20140158303Abstract: This bonding system comprises a bonding processing station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate into/out of the bonding processing station. The bonding processing station comprises a coating device which applies an adhesive to the substrate to be processed or the supporting substrate and a heat treatment device that heats the substrate, to which the adhesive has been applied. In addition, a bonding device turns over one of the substrates, and presses the overturned substrate against the other substrate with an adhesive therebetween, thereby bonding the substrates together. A conveyance region conveys the substrate(s) to the coating device, the heat treatment device and the bonding device.Type: ApplicationFiled: June 25, 2012Publication date: June 12, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Publication number: 20130280825Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.Type: ApplicationFiled: December 26, 2011Publication date: October 24, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Naoto Yoshitaka, Yasuharu Iwashita, Masataka Matsunaga
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Publication number: 20130153116Abstract: The present disclosure includes: a joint processing station including a coating unit applying an adhesive to a processing target substrate or a supporting substrate, a first heat processing unit heating the substrates coated with the adhesive, a second heat processing unit heating the substrates to a higher temperature, a reversing unit reversing front and rear surfaces of the substrate, a joint unit joining the processing target substrate and the supporting substrate together by pressing them, and a transfer region for transferring the substrates to the units; and a transfer-in/out station transferring the substrates into/from the joint processing station.Type: ApplicationFiled: March 15, 2011Publication date: June 20, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Publication number: 20130146229Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.Type: ApplicationFiled: March 4, 2011Publication date: June 13, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
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Publication number: 20130062013Abstract: A joint apparatus that joins a processing target substrate and a supporting substrate together, includes: a processing container that is capable of hermetically closing an inside thereof; a joint unit that joins the processing target substrate and the supporting substrate together by pressing the processing target substrate and the supporting substrate via an adhesive; and a superposed substrate temperature regulation unit that temperature-regulates a superposed substrate joined in the joint unit, wherein the joint unit and the superposed substrate temperature regulation unit are arranged in the processing container, A delivery unit for delivering the processing target substrate, the supporting substrate, or the superposed substrate to/from an outside of the processing container is provided in the processing container, and the superposed substrate temperature regulation unit is provided in the delivery unit.Type: ApplicationFiled: September 11, 2012Publication date: March 14, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Shinji OKADA, Masatoshi SHIRAISHI, Masatoshi DEGUCHI, Naoto YOSHITAKA, Shintaro SUGIHARA, Masataka MATSUNAGA
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Publication number: 20050042555Abstract: A coating and developing apparatus has an interface section equipped with a temperature adjuster (a cooling unit). A temperature-raised substrate due to exposure on periphery of the substrate outside a circuit-forming area thereon is adjusted to a predetermined temperature by the temperature adjuster and then transferred to an exposing apparatus. The temperature adjustments before exposure provide almost the same temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, thus achieving high yields. The interface section is further provided with first and second transfer mechanisms, the first serving to transfer substrates between the processor and the exposing apparatus and the second serving to transfer substrates to each unit of a shelf section, for high transfer performance, thus achieving high throughput.Type: ApplicationFiled: October 7, 2004Publication date: February 24, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Michiaki Matsushita, Masataka Matsunaga, Seiji Kozawa
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Patent number: 6814809Abstract: A coating and developing apparatus has an interface section equipped with a temperature adjuster (a cooling unit). A temperature-raised substrate due to exposure on periphery of the substrate outside a circuit-forming area thereon is adjusted to a predetermined temperature by the temperature adjuster and then transferred to an exposing apparatus. The temperature adjustments before exposure provide almost the same temperature over many substrates to be transferred to the exposing apparatus for less thermal effects to exposing processing, thus achieving high yields. The interface section is further provided with first and second transfer mechanisms, the first serving to transfer substrates between the processor and the exposing apparatus and the second serving to transfer substrates to each unit of a shelf section, for high transfer performance, thus achieving high throughput.Type: GrantFiled: December 7, 2001Date of Patent: November 9, 2004Assignee: Tokyo Electron LimitedInventors: Michiaki Matsushita, Masataka Matsunaga, Seiji Kozawa
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Patent number: 6790681Abstract: In this invention, a time period taken with a wafer W to be transferred to the heat processing apparatus in the post exposure baking unit through the out stage in the aligner, the wafer transfer mechanism, the transition unit, the wafer transfer mechanism, and the temperature regulation and transfer apparatus in the post exposure baking unit is controlled to be approximately constant.Type: GrantFiled: June 18, 2002Date of Patent: September 14, 2004Assignee: Tokyo Elecetron LimitedInventors: Masataka Matsunaga, Akira Miyata, Yuichi Douki
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Publication number: 20020197746Abstract: In this invention, a time period taken with a wafer W to be transferred to the heat processing apparatus in the post exposure baking unit through the out stage in the aligner, the wafer transfer mechanism, the transition unit, the wafer transfer mechanism, and the temperature regulation and transfer apparatus in the post exposure baking unit is controlled to be approximately constant.Type: ApplicationFiled: June 18, 2002Publication date: December 26, 2002Inventors: Masataka Matsunaga, Akira Miyata, Yuichi Douki