Abstract: Provided are a detection method for a sound source and a detection device therefor, which are capable of accurately detecting the position of a sound source through use of measurement results of sound intensities. In the detection method, Iall=?(Ix2+Iy2+Iz2), which is a total value of the sound intensities Ix, Iy, and Iz in three axial directions (x-, y-, and z-axis directions) orthogonal to each other at a sound receiving point (P) in a sound field, is calculated, and then the position of the sound source is estimated after extracting the sound source by performing processing with averaged values within a predetermined peak width instead of the magnitude of a peak in a sound intensity waveform of the total value, or the position of the sound source is estimated after extracting the sound source with attention being given to a spatial travel speed of a sound intensity or a sound particle velocity of the total value.

Abstract: Provided are a detection method for a sound source and a detection device therefor, which are capable of accurately detecting the position of a sound source through use of measurement results of sound intensities. In the detection method, Iall=?(Ix2+Iy2+Iz2), which is a total value of the sound intensities Ix, Iy, and Iz in three axial directions (x-, y-, and z-axis directions) orthogonal to each other at a sound receiving point (P) in a sound field, is calculated, and then the position of the sound source is estimated after extracting the sound source by performing processing with averaged values within a predetermined peak width instead of the magnitude of a peak in a sound intensity waveform of the total value, or the position of the sound source is estimated after extracting the sound source with attention being given to a spatial travel speed of a sound intensity or a sound particle velocity of the total value.

Abstract: Disclosed is a polishing method which is effective to prevent lowering of the polishing efficiency in the later stage of polishing. The polishing method is characterized in that polishing is performed while so adjusting a polishing liquid as to have a pH of not less than 2 and less than 7.