Patents by Inventor Masataka Nakanishi

Masataka Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7829657
    Abstract: Disclosed is a composition for the delivery of nucleic acid to target cells or tissues, which comprises a polycationically charged polymer as a carrier of nucleic acid. The polycationically charged polymer is a polymer which may comprise a charged polymer segment having a main chain based on poly(amino acid), polysaccharide, polyester, polyether, polyurethane or vinyl polymer and having, as a side chain, a group of formula —NH—(CH2)a—(NH(CH2)2)e—NH2 (wherein a and e independently denote an integer of 1 to 5) which is connected to the main chain either directly or via a linker. The disclosed composition has low toxicity, and has a high efficiency in introducing nucleic acid into cells.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: November 9, 2010
    Assignee: The University of Tokyo
    Inventors: Kazunori Kataoka, Keiji Itaka, Nobuhiro Nishiyama, Shigeto Fukushima, Woo-Dong Jang, Kanjiro Miyata, Masataka Nakanishi, Shunsaku Asano, Naoki Kanayama
  • Publication number: 20100179353
    Abstract: This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass.
    Type: Application
    Filed: August 14, 2007
    Publication date: July 15, 2010
    Applicant: NIPPONKAYAKU KABUSHIKIKAISHA
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Takao Sunaga
  • Publication number: 20090286929
    Abstract: A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60?(2a+b)/(2a+2b+2c)?0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).
    Type: Application
    Filed: November 29, 2006
    Publication date: November 19, 2009
    Inventors: Katsuhiko Oshimi, Shigeru Moteki, Takao Sunaga, Masataka Nakanishi, Sumio Ichimura
  • Publication number: 20090131607
    Abstract: [Problems] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [Means for Solving Problems] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.
    Type: Application
    Filed: October 10, 2006
    Publication date: May 21, 2009
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Ryutaro Tanaka, Toru Kurihashi
  • Publication number: 20090117388
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin.
    Type: Application
    Filed: October 16, 2006
    Publication date: May 7, 2009
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Patent number: 7521100
    Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.
    Type: Grant
    Filed: April 6, 2004
    Date of Patent: April 21, 2009
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiko Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai
  • Publication number: 20090069513
    Abstract: An object of the present invention is to provide a multifunctional epoxy resin that is in a liquid state and that has a multifunctional structure. The multifunctional epoxy resin can be used as a reactive diluent and also used for a wide range of applications such as a molding material, a casting material, a laminating material, a paint, an adhesive, and a resist. The epoxy resin of the present invention is produced by glycidylation of dipentaerythritol represented by formula (1): wherein, in the number of moles of a hexafunctional compound (HG) and the number of moles of a pentafunctional compound (LG) in the epoxy resin, the ratio of the number of moles of (HG) to the total number of moles of (HG) and (LG), namely HG/(HG+LG), is in the range of 0.05 to 0.9.
    Type: Application
    Filed: May 9, 2006
    Publication date: March 12, 2009
    Applicant: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Takao Sunaga
  • Publication number: 20090054587
    Abstract: An object of the present invention is to provide an epoxy resin exhibiting superior heat resistance, dielectric properties, water resistance, and workability, a resin composition containing the epoxy resin, and a prepreg and a laminated plate. The epoxy resin of the invention is expressed by the following formula. (In the formula, R represents a hydrocarbon group having a carbon number of 1 to 4. m Represents an integer of 1 to 4 and when m is 2 to 4, R's may be the same or different. n Represents a positive number of 1 to 6 on average.) The epoxy resin composition of the invention contains the epoxy resin of the invention and a curing agent.
    Type: Application
    Filed: March 14, 2006
    Publication date: February 26, 2009
    Applicant: Nippon Kayaku Kabushiki Kaisha
    Inventors: Katsuhiko Oshimi, Yasumasa Akatsuka, Masataka Nakanishi, Takao Sunaga
  • Publication number: 20090012203
    Abstract: [PROBLEMS] The present invention relates to a crystalline epoxy resin, which gives a cured object excellent in various properties including flame retardancy, low water absorption, and impact resistance. The object of the present invention is to provide epoxy resin which is useful as an optical material, an epoxy resin composition containing crystals of the epoxy resin having excellent storage stability and a cured object obtained from the composition. [MEANS FOR SOLVING PROBLEMS] The crystalline epoxy resin obtained by the glycidylation of the compound represented by the following formula (1).
    Type: Application
    Filed: April 28, 2006
    Publication date: January 8, 2009
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Masataka Nakanishi, Ryutaro Tanaka
  • Publication number: 20080285616
    Abstract: A system for testing objects such as electronic devices and mechanical components to see how they can withstand thermally hard circumstances created by a thermal agent supplied from a supplying system communicating with a testing section by and through an inlet flow path and an outlet flow path, wherein heat exchange is effected between the incoming agent and the outgoing agent, so that the remaining heat content, worm or cold, is taken and utilized for later uses.
    Type: Application
    Filed: December 20, 2007
    Publication date: November 20, 2008
    Inventors: Masataka Nakanishi, Hironobu Kurara, Taihei Nishikawa
  • Publication number: 20080249049
    Abstract: A composition for the delivery of nucleic acid to target cells or tissues, which comprises polycationically charged polymer as a carrier of nucleic acid is provided. Said polycationically charged polymer is a polymer which may comprise a charged polymer segment having a main chain based on poly(amino acid), polysaccharide, polyester, polyether, polyurethane or vinyl polymer and having, as a side chain, a group of formula —NH—(CH2)a—(NH(CH2)2)e—NH2 (wherein a and e independently denote an integer of 1 to 5) which is connected to said main chain either directly or via a linker. This composition is low-toxic, and has a high efficiency in introducing nucleic acid into cells.
    Type: Application
    Filed: February 8, 2006
    Publication date: October 9, 2008
    Inventors: Kazunori Kataoka, Keiji Itaka, Nobuhiro Nishiyama, Shigeto Fukushima, Woo-Dong Jang, Kanjiro Miyata, Masataka Nakanishi, Shunsaku Asano, Naoki Kanayama
  • Publication number: 20080216998
    Abstract: A thermostat includes a plate body, a heat insulator, and an electric heater. The plate body defines a cavity therewithin. The plate body has on its bottom two openings, which communicate with the cavity and function as a cooling medium inlet and a cooling medium outlet, respectively. The outer periphery of the plate body is covered with the heat insulator. That prevents heat intrusion and/or dissipation from the outer periphery of the plate body in transferring heat between the mounting face and a heat transfer medium within the cavity. That reduces the thermal influence on the mounting face, thereby ensuring more uniform temperature distribution on the mounting face.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 11, 2008
    Inventors: Masataka Nakanishi, Hironobu Kurara, Taihei Nishikawa
  • Publication number: 20080200636
    Abstract: It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof. It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance. There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.
    Type: Application
    Filed: February 20, 2006
    Publication date: August 21, 2008
    Inventors: Masataka Nakanishi, Yasumasa Akatsuka, Katsuhiko Oshimi, Takao Sunaga
  • Publication number: 20080153976
    Abstract: An object of the present invention is to provide an epoxy resin that can be easily produced, can easily achieve a molecule-aligned state, and can be cured to provide a cured material with optical anisotropy and excellent toughness and thermal conductivity. The epoxy resin of the present invention is represented by the following formula (1): (wherein n is 0.1 to 20 (the number is an average). The epoxy resin of the present invention can be produced by extending the chain of an epoxide of 4,4?-bisphenol F with 4,4?-biphenol.
    Type: Application
    Filed: December 21, 2005
    Publication date: June 26, 2008
    Applicant: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Katsuhiko Oshimi, Masataka Nakanishi, Shigeru Moteki
  • Publication number: 20080149208
    Abstract: In one example, a piping system 20 is built around a wire (elongated flexible member) 25. An inlet pipe 21 and an outlet pipe 22 are fixed to both sides of the wire 25 parallel to each other via a plurality of pipe holders 26. Further, insulator holders 27 are attached to the wire 25 and heat insulating sections 28 are attached to the insulator holders 27. A cylindrical gap 51 is formed between the inlet pipe 21 and the inner surface of each of the heat insulating section 28.
    Type: Application
    Filed: December 26, 2007
    Publication date: June 26, 2008
    Inventors: Hironobu Kurara, Taihei Nishikawa, Masataka Nakanishi
  • Publication number: 20080032154
    Abstract: An epoxy resin represented by formula (1) below: wherein the ratio of the component having two nuclei accounting for 25% or less in terms of the area corresponding to the component in a gel permeation chromatogram.
    Type: Application
    Filed: July 8, 2005
    Publication date: February 7, 2008
    Inventors: Yasumasa Akatsuka, Katsuhiko Oshimi, Masataka Nakanishi
  • Publication number: 20080021173
    Abstract: The present invention relates to an epoxy resin whose cured product has a high heat resistance, and directed to provide an epoxy resin improved in adhesiveness and toughness in comparison with the conventional highly heat resistant epoxy resin. Specifically disclosed is an epoxy resin obtainable by glycidylation of a mixture of (a) a phenol compound condensate which is a condensate of phenols and glyoxal and contains not less than 80% (area % by a gel permeation chromatography) of a compound represented by the formula (1): (wherein R represents each independently a hydrogen atom, (C1-C15) hydrocarbon group or trifluoromethyl group); and (b) a phenol compound other than (a) or a phenol resin.
    Type: Application
    Filed: June 24, 2005
    Publication date: January 24, 2008
    Inventors: Masataka Nakanishi, Yasumasa Akatsuka, Katsuhiko Oshimi, Ryutaro Tanaka
  • Publication number: 20070161100
    Abstract: Disclosed is a photosensitive resin composition comprising a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1). In the formula, R1 to R8 independently represents a hydrogen atom, a C1-C4 alkyl group or a halogen atom.
    Type: Application
    Filed: February 8, 2005
    Publication date: July 12, 2007
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Ryutaro Tanaka, Masataka Nakanishi, Yasumasa Akatsuka, Hiroo Koyanagi
  • Publication number: 20060208219
    Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.
    Type: Application
    Filed: April 6, 2004
    Publication date: September 21, 2006
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Naoyuki Ochi, Masahiro Hirano, Sumio Ichimura, Masaru Kudo, Katsuhiro Oshimi, Masataka Nakanishi, Yasumasa Akatsuka, Eiichi Nishihara, Masayuki Itai