Abstract: A semiconductor device according to an embodiment includes a metal part including a first surface and a second surface on an opposite side to the first surface. A semiconductor chip is mounted on the first surface of the metal part and is electrically connected to the metal part. A terminal part includes a third surface being in contact with the second surface of the metal part, a fourth surface on an opposite side to the third surface, and side surfaces between the third surface and the fourth surface. A resin is provided on the second surface of the metal part and the side surfaces of the terminal part.

Abstract: There is provided a strap-bonding machine, including a metal ribbon tape storage portion configured to hold a metal ribbon tape, a metal ribbon tape-cutting portion configured to cut the metal ribbon tape fed from the metal ribbon tape storage portion to a metal strap having a predefined shape, a metal strap-carrying portion configured to feed the metal strap to a picking-position, a lead frame-carrying portion configured to carry a lead frame mounted a semiconductor chip on and having a lead terminal, and a bonding portion configured to pick up the metal strap at the picking-position, to carry the metal strap above the lead frame and to bond the metal strap to the semiconductor chip and the lead terminal.