Abstract: A biological growth inhibition factor assay method includes: a first step of mixing a photosynthetic sample, with an aqueous solution sample to prepare a test measurement solution, letting the test measurement solution stand, and then after illuminating light onto the test measurement solution for a predetermined illumination time, measuring the light amount of the delayed fluorescence that is emitted; a second step of mixing the photosynthetic sample with a standard sample, in which biological growth inhibition factors are not present, to prepare a standard measurement solution, letting the standard measurement solution stand, and then after illuminating light onto the standard measurement solution for a predetermined illumination time, measuring the light amount of the delayed fluorescence that is emitted; and a third step of computing assay values based on the light amounts of delayed fluorescence, respectively measured in the first step and the second step, and determining a comparison value of the assay

Abstract: A biological growth inhibition factor assay method includes: a first step of mixing a photosynthetic sample, with an aqueous solution sample to prepare a test measurement solution, letting the test measurement solution stand, and then after illuminating light onto the test measurement solution for a predetermined illumination time, measuring the light amount of the delayed fluorescence that is emitted; a second step of mixing the photosynthetic sample with a standard sample, in which biological growth inhibition factors are not present, to prepare a standard measurement solution, letting the standard measurement solution stand, and then after illuminating light onto the standard measurement solution for a predetermined illumination time, measuring the light amount of the delayed fluorescence that is emitted; and a third step of computing assay values based on the light amounts of delayed fluorescence, respectively measured in the first step and the second step, and determining a comparison value of the assay

Abstract: A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with a resin. A metallic sheet or moisture penetration blocking sheet is adhered on the IC chip surface opposite to the side that faces the printed wiring board.

Abstract: The present invention relates to an immunochromatographic test reader, etc., having structures that enable accommodation of a plurality of immunochromatographic test utensils that differ in outer shape and enable immunochromatographic test utensils to be managed readily in association with information concerning the immunochromatographic test utensils.

Abstract: Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.

Abstract: Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.

Abstract: A semiconductor module includes: a printed wiring board made of an insulator with conductor patterns formed on both sides thereof. An IC chip is mounted on the printed wiring board and sealed with a resin. A metallic sheet or moisture penetration blocking sheet is adhered on the IC chip surface opposite to the side that faces the printed wiring board.

Abstract: Polyethylene terephthalate resin composition comprising a polyethylene terephthalate resin and nigrosine, optionally containing fibrous reinforcing material, e.g. in an amount of about 10 to 120% by weight relative to the polyethylene terephthalate resin. The polyethylene terephthalate resin composition enables the production of molded products good in appearance, surface gloss, mechanical characteristics and light fastness. The composition has a crystallization rate upon molding which is lower than that of a corresponding natural polyethylene terephthalate resin containing no coloring agents and which is also lower than that of a corresponding polyethylene terephthalate resin composition comprising a polyethylene terephthalate resin and carbon black. The composition is capable of forming a molded product that can elongate more than 200% and also more than two times relative to a corresponding natural polyethylene terephthalate resin containing no coloring agents.

Abstract: A semiconductor device capable of giving glitch noise to a test signal used in a noise test for the device. The semiconductor device includes an input circuit for receiving either a test signal supplied from a device tester or a control signal, and an internal circuit connected to the input circuit by a signal line. The internal circuit operates based on a signal provided from the input circuit. The signal line is connected to a noise generator. The noise generator generates glitch noise in a test signal supplied from the tester.

Abstract: Colored thermoplastic resin composition comprising a transparent thermoplastic resin and a black dye contained therein, wherein said black dye is a black dye obtained by reaction of at least one anionic surfactant selected from the group consisting of(a) sulfuric acid ester-series surfactants,(b) phosphoric acid ester-series surfactants,(c) sulfonic acid-series surfactants and(d) carboxylic acid-series surfactants, and nigrosine.

Abstract: A black polyamide resin composition comprising a polyamide resin and coloring agents, wherein nigrosine, aniline black and carbon black are contained as the coloring agents.