Patents by Inventor Masataka Ryu

Masataka Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9460953
    Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: October 4, 2016
    Assignee: Rudolph Technologies, Inc.
    Inventors: Isao Sato, Hiroki Ueno, Yasutoshi Ito, Masataka Ryu, Troy Palm
  • Publication number: 20150371886
    Abstract: A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.
    Type: Application
    Filed: December 20, 2013
    Publication date: December 24, 2015
    Applicant: RUDOLPH TECHNOLOGIES, INC.
    Inventors: Isao Sato, Hiroki Ueno, Yasutoshi Ito, Masataka Ryu, Troy Palm