Patents by Inventor Masataka Sakurai

Masataka Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11141975
    Abstract: According to one embodiment, a size of an element substrate is reduced, and a printhead using the element substrate can print high-quality image. The multilayer structured element substrate comprises a plurality of print elements, and a circuit configured to input a data signal and a clock signal used for driving the plurality of print elements. And, a print element array formed by arranging the plurality of print elements in line is diagonally arranged with respect to a side constituting an outer shape of the element substrate. A print element at one end of the print element array is a dummy element not contributing to printing. The circuit is provided not only at the same position as that of the dummy element but also in a layer different from that of the dummy element.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: October 12, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Hidenori Yamato, Masataka Sakurai
  • Patent number: 10814623
    Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: October 27, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ryo Kasai, Nobuyuki Hirayama, Masataka Sakurai, Kengo Umeda, Hidenori Yamato, Makoto Takagi, Tatsuhito Goden, Sadayoshi Sakuma, Nobuyuki Suzuki, Toru Eto
  • Patent number: 10668719
    Abstract: A recording element substrate includes a substrate, a plurality of energy generating elements arranged on the substrate to form an element row, a plurality of supply ports arranged along the element row to form a supply port row, and a plurality of supply paths extending from the plurality of supply ports along the thickness direction of the substrate, wherein a plurality of beam portions disposed between adjacent supply ports in the direction of the supply port row has a plurality of conductor layers in which a conductor layer including a power supply conductor connected to the energy generating elements and a conductor layer including a ground conductor connected to the energy generating elements, are stacked along the thickness direction of the substrate, and wherein at least one of the plurality of conductor layers is occupied by one power supply conductor or one ground conductor.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: June 2, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masataka Sakurai, Nobuyuki Hirayama, Ryo Kasai, Kengo Umeda, Hidenori Yamato, Masanobu Ohmura, Tatsuhito Goden
  • Patent number: 10596815
    Abstract: A liquid ejection head is capable of performing high-speed ejection operation as well as reducing a depth dimension. For this purpose, in a configuration in which flexible circuits electrically connect element substrates to electrical substrates, the electrical substrates are arrayed in two lines along a plane different from a plane on which the element substrates are arrayed and the flexible circuits electrically connect the element substrates to the electrical substrates while being bent.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: March 24, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Okushima, Satoshi Oikawa, Satoshi Kimura, Tatsurou Mori, Kengo Umeda, Masataka Sakurai
  • Patent number: 10532565
    Abstract: In a print element substrate: if an amount of a voltage drop when the number of print elements driven simultaneously in a state in which the predetermined voltage is applied with respect to one print element array is largest is set as an amount of a voltage drop of the print element array, and a sum of amounts of voltage drops of the print element arrays assigned to one group is set as an amount of a voltage drop of the group, a difference between a largest value and a smallest value of the amounts of the voltage drops of the M groups is smaller than a largest value of the amounts of the voltage drops of the N print element arrays.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: January 14, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yohei Osuki, Masataka Sakurai, Ryo Kasai, Kengo Umeda, Hidenori Yamato
  • Patent number: 10479075
    Abstract: A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side; and a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: November 19, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ryo Kasai, Masataka Sakurai, Koichi Ishida
  • Patent number: 10427400
    Abstract: A printhead comprises a printing element, a driving circuit configured to drive the printing element, an analog signal processing circuit configured to process one or more analog signals, a bias circuit configured to supply a bias voltage to the analog signal processing circuit, and a control terminal to which a control signal is inputted. In a state in which the analog signal processing circuit and the bias circuit are receiving a supply of power, it is possible to switch starting and stopping of at least one of the analog signal processing circuit and the bias circuit based on the control signal.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: October 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hidenori Yamato, Hideo Kanno, Masataka Sakurai, Ryo Kasai, Kengo Umeda
  • Publication number: 20190248133
    Abstract: According to one embodiment, a size of an element substrate is reduced, and a printhead using the element substrate can print high-quality image. The multilayer structured element substrate comprises a plurality of print elements, and a circuit configured to input a data signal and a clock signal used for driving the plurality of print elements. And, a print element array formed by arranging the plurality of print elements in line is diagonally arranged with respect to a side constituting an outer shape of the element substrate. A print element at one end of the print element array is a dummy element not contributing to printing. The circuit is provided not only at the same position as that of the dummy element but also in a layer different from that of the dummy element.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 15, 2019
    Inventors: Hidenori Yamato, Masataka Sakurai
  • Patent number: 10350884
    Abstract: There is provided an elongated liquid ejection head capable of voltage drop suppression and high-speed ejection operation. For this purpose, in each of flexible circuits electrically connecting element substrates to electrical substrates, a width Wa on a side connected to the electrical substrate is smaller than the width of another area.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Okushima, Satoshi Oikawa, Satoshi Kimura, Tatsurou Mori, Kengo Umeda, Masataka Sakurai
  • Patent number: 10322578
    Abstract: A liquid ejection head includes a substrate including an electrically insulating film, an energy generating element provided on the substrate and configured to generate energy used to eject a liquid, a flow path formed through the substrate and communicating with an ejection port configured to eject a liquid, and a wiring layer formed in the electrically insulating film of the substrate, used to drive the energy generating element, provided apart from a wall defining the flow path, and provided to surround the flow path in a plan view of the substrate.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 18, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomoko Kudo, Takaaki Yamaguchi, Keiji Tomizawa, Masaki Oikawa, Yoshihiro Hamada, Masataka Sakurai
  • Patent number: 10300698
    Abstract: A liquid ejection head includes a substrate, a heat generating resistor element arranged on the substrate and a flow channel forming member for forming a flow channel. The flow channel forming member has a side wall surrounding at least part of the heat generating resistor element. The heat generating resistor element has a pair of oppositely disposed sides and a pair of electrical connection regions which extend along the respective ones of the pair of sides and are separated from the respective ones of the pair of sides by a distance. The side wall has at least one concave corner which is comprised of a curved surface or a surface extending obliquely to the pair of sides and the heat generating resistor element has at least one convex corner which faces the at least one concave corner of the side wall and is rounded or chamfered.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: May 28, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keiji Tomizawa, Masataka Sakurai, Akiko Hammura
  • Patent number: 10286661
    Abstract: Disclosed is a liquid discharge method of discharging liquid with a liquid discharge head having a heating surface that contacts and heats the liquid and a discharge port that faces the heating surface and discharges the liquid. The method includes heating the liquid through the heating surface to generate a bubble such that the bubble communicates with an atmosphere, thereby discharging the liquid. The liquid that is being discharged from the discharge port includes a trailing portion. The trailing portion moves toward the heating surface in response to a reduction in volume of the bubble and contacts the heating surface. The method further includes heating the trailing portion through the heating surface while the trailing portion is in contact with the heating surface, thereby generating a bubble.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: May 14, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shintaro Kasai, Yoshiyuki Nakagawa, Akira Shibasaki, Masataka Sakurai, Ken Tsuchii, Akiko Hammura, Tatsurou Mori, Shinji Kishikawa
  • Patent number: 10286660
    Abstract: A liquid discharge head which discharges a liquid, includes, a substrate on which plural heaters configured to generate heat for discharging a liquid are provided, an electroconductive protective film configured to cover the plural heaters and define a group consisting of the covered plural heaters in the substrate, a discrete wiring connected with the protective film for each group in the substrate, a common wiring connected with the discrete wiring for each group in common, and a terminal connected with the common wiring and configured to electrically connect the common wiring with an outside of the substrate, wherein electrical resistance of the discrete wiring is higher than electrical resistance of the common wiring.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 14, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Masataka Sakurai
  • Publication number: 20190023007
    Abstract: A recording element substrate includes a substrate, a plurality of energy generating elements arranged on the substrate to form an element row, a plurality of supply ports arranged along the element row to form a supply port row, and a plurality of supply paths extending from the plurality of supply ports along the thickness direction of the substrate, wherein a plurality of beam portions disposed between adjacent supply ports in the direction of the supply port row has a plurality of conductor layers in which a conductor layer including a power supply conductor connected to the energy generating elements and a conductor layer including a ground conductor connected to the energy generating elements, are stacked along the thickness direction of the substrate, and wherein at least one of the plurality of conductor layers is occupied by one power supply conductor or one ground conductor.
    Type: Application
    Filed: September 21, 2018
    Publication date: January 24, 2019
    Inventors: Masataka Sakurai, Nobuyuki Hirayama, Ryo Kasai, Kengo Umeda, Hidenori Yamato, Masanobu Ohmura, Tatsuhito Goden
  • Publication number: 20180370224
    Abstract: In a print element substrate: if an amount of a voltage drop when the number of print elements driven simultaneously in a state in which the predetermined voltage is applied with respect to one print element array is largest is set as an amount of a voltage drop of the print element array, and a sum of amounts of voltage drops of the print element arrays assigned to one group is set as an amount of a voltage drop of the group, a difference between a largest value and a smallest value of the amounts of the voltage drops of the M groups is smaller than a largest value of the amounts of the voltage drops of the N print element arrays.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 27, 2018
    Inventors: Yohei Osuki, Masataka Sakurai, Ryo Kasai, Kengo Umeda, Hidenori Yamato
  • Publication number: 20180370233
    Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.
    Type: Application
    Filed: June 27, 2018
    Publication date: December 27, 2018
    Inventors: RYO KASAI, NOBUYUKI HIRAYAMA, MASATAKA SAKURAI, KENGO UMEDA, HIDENORI YAMATO, MAKOTO TAKAGI, TATSUHITO GODEN, SADAYOSHI SAKUMA, NOBUYUKI SUZUKI, TORU ETO
  • Publication number: 20180361734
    Abstract: A liquid ejection head includes a substrate including an electrically insulating film, an energy generating element provided on the substrate and configured to generate energy used to eject a liquid, a flow path formed through the substrate and communicating with an ejection port configured to eject a liquid, and a wiring layer formed in the electrically insulating film of the substrate, used to drive the energy generating element, provided apart from a wall defining the flow path, and provided to surround the flow path in a plan view of the substrate.
    Type: Application
    Filed: June 12, 2018
    Publication date: December 20, 2018
    Inventors: Tomoko Kudo, Takaaki Yamaguchi, Keiji Tomizawa, Masaki Oikawa, Yoshihiro Hamada, Masataka Sakurai
  • Publication number: 20180345668
    Abstract: A liquid ejection head includes a substrate, a heat generating resistor element arranged on the substrate and a flow channel forming member for forming a flow channel. The flow channel forming member has a side wall surrounding at least part of the heat generating resistor element. The heat generating resistor element has a pair of oppositely disposed sides and a pair of electrical connection regions which extend along the respective ones of the pair of sides and are separated from the respective ones of the pair of sides by a distance. The side wall has at least one concave corner which is comprised of a curved surface or a surface extending obliquely to the pair of sides and the heat generating resistor element has at least one convex corner which faces the at least one concave corner of the side wall and is rounded or chamfered.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Inventors: Keiji Tomizawa, Masataka Sakurai, Akiko Hammura
  • Publication number: 20180326725
    Abstract: A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side; and a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.
    Type: Application
    Filed: April 16, 2018
    Publication date: November 15, 2018
    Inventors: Ryo Kasai, Masataka Sakurai, Koichi Ishida
  • Publication number: 20180304630
    Abstract: There is provided a liquid ejection head capable of performing high-speed ejection operation as well as reducing a depth dimension. For this purpose, in a configuration in which flexible circuits electrically connect element substrates to electrical substrates, the electrical substrates are arrayed in two lines along a plane different from a plane on which the element substrates are arrayed and the flexible circuits electrically connect the element substrates to the electrical substrates while being bent.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 25, 2018
    Inventors: Shingo Okushima, Satoshi Oikawa, Satoshi Kimura, Tatsurou Mori, Kengo Umeda, Masataka Sakurai