Abstract: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions.

Abstract: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions.

Abstract: The pressing method includes the first step of displacing a sub-piston provided within a sub-cylinder from its initial position to press working fluid such that the working fluid is introduced via a check valve into a main cylinder to displace a main piston provided therein, and the second step of causing the sub-piston to return to the initial position such that the working fluid is supplied to the sub-cylinder. The first and second steps are repeated successively until the working fluid in the main cylinder attains a prescribed pressure level. With this method, variation in the way of pressing an object is alleviated, contamination due to the working fluid is prevented, and downsizing of the pressing mechanism is enabled.

Abstract: A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

Abstract: In a resin sealing method, a plurality of semiconductor chips are placed in line on a sheet-type substrate with an adhesive tape, and electrodes provided on the semiconductor chips and the sheet-type substrate are connected with each other with wires, so that the connected substrate is fixed to a mold surface of a lower mold. Then, the lower mold and an upper mold are closed and thereafter molten resin is injected into upper cavities and lower cavities provided in line respectively and hardened. Then, the upper and lower molds are opened to take out the sheet-type substrate having the plurality of semiconductor chips sealed thereto, and the sheet-type substrate is cut along the boundaries between the semiconductor chips by dicing for completing each package. According to this method, particularly a BOC type CSP can be efficiently sealed with resin in high dimensional accuracy.

Abstract: There are provided a shaft rotating around the shaft's center in a direction in which a blade rotates, and the blade fixed to the shaft and moving at a rate of movement, wherein the shaft's center rotates at a predetermined rate of rotation with a small radius of rotation rapidly, the rate of rotation being greater than the rate of movement. Thus the blade is pressed against and thus cuts a substrate and produces chips and the blade is disengaged from the substrate and the chips thus move in the direction in which the blade rotates and the chips are thus removed from between the cutting edge of the blade and the substrate. This can provide reduced working resistance and hence enhanced working efficiency and also prevent the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: The mold clamping device with improved transmission mechanism includes: a middle platen 2 fixedly supported by a support base 1 and carrying the lower metallic mold 6; and front tie-bars 3a extending slidably therethrough. A movable platen 4 carrying the upper metallic mold 7 is secured to the top ends of the front tie-bars 3a. The horizontal connecting bar members 5a and 5b connect the bottom ends of the front and the rear tie-bars 3a and 3b. The middle platen 2 and the horizontal connecting bar members 5a and 5b are operatively coupled by means of the pantograph mechanism consisting of flat bar-shaped links 15a and 15b, whose front and rear joints are pinned to annular links 16a and 16bengaging with a left-and-right-handed ball thread member 17 driven by a driving source.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface place rotating shaft, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis and a rotating mechanism rotating the substrate axis about an eccentric axis. Angular velocity of rotation of the substrate axis about the eccentric axis is set larger than angular velocity of rotation of the substrate holding mechanism about the substrate axis. Thus, contact area between a small area on the substrate and the polishing pad is increased, bias wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, polishing rate is improved.

Abstract: The present invention provides a method of fabricating an electronic component, using a tool for pressing a chip against a substrate and heating the same, connecting a chip electrode and a substrate electrode together via a bump, placing the substrate in alignment with a die alignment plane for an upper die and a lower die, clamping the upper die and the lower die to form a cavity and exhausting the cavity via an exhaust hole to evacuate the same, and injecting melted resin into the cavity and curing the melted resin to provide sealing resin. Then, in a predetermined ambient at a predetermined temperature the substrate is pressed against a test board and a predetermined electrical signal is applied from the test board via an external electrode to the chip to test an operation of an electronic component configured on a unit region of the substrate and the chip. Thereafter, cutting along a virtual line completes the electronic component.

Abstract: The pressing method includes the first step of displacing a sub-piston provided within a sub-cylinder from its initial position to press working fluid such that the working fluid is introduced via a check valve into a main cylinder to displace a main piston provided therein, and the second step of causing the sub-piston to return to the initial position such that the working fluid is supplied to the sub-cylinder. The first and second steps are repeated successively until the working fluid in the main cylinder attains a prescribed pressure level. With this method, variation in the way of pressing an object is alleviated, contamination due to the working fluid is prevented, and downsizing of the pressing mechanism is enabled.

Abstract: In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.

Abstract: An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.

Abstract: A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.

Abstract: A semiconductor device includes an insulating substrate; a semiconductor chip on which plural electrodes including at least one ground electrode and at least one power source electrode are disposed; plural leads supported by an obverse surface of the insulating substrate, the plural leads being connected to corresponding electrodes on the semiconductor chip; at least one grounding conductor plate on a reverse surface of the insulating substrate; and at least one power source conductor plate on the reverse surface of the insulating substrate.

Abstract: The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

Abstract: A semiconductor device having a heat radiating member and a laminated structure for improvements in electrical and heat radiating characteristics. The heat radiating member is partially exposed outside a resin package of the semiconductor device to radiate heat generated by a semiconductor element to the outside of the device. In the laminated structure, a capacitor having a small capacity is formed by two electrically conductive plates one of which is connected to power supply leads and the other of which is connected to a grounded portion of the semiconductor element and to a grounding lead.

Abstract: A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.