Patents by Inventor Masataka Watabe

Masataka Watabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder circuit
    Patent number: 6476487
    Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: November 5, 2002
    Assignee: Showa Denko K.K.
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai
  • Solder circuit
    Publication number: 20010020744
    Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Application
    Filed: January 8, 2001
    Publication date: September 13, 2001
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai
  • Method of forming solder film
    Patent number: 5928440
    Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: July 27, 1999
    Assignee: Showa Denko K.K.
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai
  • Method of forming solder film
    Patent number: 5750271
    Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: May 12, 1998
    Assignee: Showa Denko K.K.
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai
  • Solution for selectively imparting tackiness to a metallic surface
    Patent number: 5713997
    Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: February 3, 1998
    Assignee: Showa Denko K.K.
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai
  • Method of forming solder film
    Patent number: 5556023
    Abstract: A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
    Type: Grant
    Filed: October 31, 1994
    Date of Patent: September 17, 1996
    Assignee: Showa Denko K.K.
    Inventors: Takeo Kuramoto, Masataka Watabe, Satoshi Noda, Takashi Shoji, Takekazu Sakai