Patents by Inventor Masatake Hoshina

Masatake Hoshina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5518671
    Abstract: A method of setting molding conditions for an injection molding machine 1 using a mold 2 whose specifications data are unclear included three setting processes. In the first setting process A, by inputting known data into controller 3, the molding conditions based on a data base prepared in advance and said input known data are set. In the second setting process B, injection molding is performed according to prescribed molding conditions pre-selected concerning injection pressure P, injection speed V and the injection start position of screw 4, and then, based on the product just molded, injection pressure P is altered, to set said altered injection pressure P, injection speed V and proper pre-feed measurement value Md as molding conditions. In the third setting process C, injection molding is performed according to molding conditions obtained from said second setting process B, and subsequently, taking into account the findings from the product just molded, said molding conditions are adjusted.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: May 21, 1996
    Assignee: Nissei Plastic Industrial Co., Ltd.
    Inventors: Michiaki Takizawa, Fumio Shiozawa, Takashi Magario, Makoto Takeuchi, Masatake Hoshina, Minoru Yamazaki, Toshimi Kato
  • Patent number: 5350546
    Abstract: Upon setting various molding conditions relating to new molding, one or more than two of pseudo-correlation data Q1, Q2, Q3, Q4, Q5 . . . which are secondary physical values (a fluid pressure, a hold pressure, a pressure coefficient and the like) previously set in accordance with primary physical values (a thickness, a fluid length and the like) relating to a virtual molded article, and upon setting of the molding conditions, the molding conditions are computed from primary physical values relating to molding of an actual molded article in accordance with the correlation data Q1 . . . , the molding conditions including a design condition for dies or a result of analysis of operation.
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: September 27, 1994
    Assignee: Nissei Plastic Industrial Co., Ltd.
    Inventors: Makoto Takeuchi, Shiji Aiba, Masatake Hoshina, Minoru Yamazaki