Abstract: Disclosed is a composition for removing a photoresist which contains a reaction product of a primary or secondary organic amine having a hydroxyl group with an ethylene carbonate, propylene carbonate, ?-butylolactone, 1,3-dihydroxy-2-propanone, or a monovalent or divalent carboxylic acid, if necessary an organic amine, and a water-soluble organic solvent and/or water. This composition is capable of removing a photoresist with high performance and preventing corrosion of a metal wiring material. By using such a composition, there occurs no problem such that impurities precipitate and adhere to the substrate or the like during water rinsing after removal.