Abstract: The present invention provides a photoresponsive gas-generating material that is to be used in a micropump of a microfluid device having fine channels formed therein, and is capable of effectively generating gases for transporting a microfluid in response to light irradiation and transporting the microfluid at an improved transport efficiency. The present invention also provides a micropump incorporating the photoresponsive gas-generating material. A photoresponsive gas-generating material 13 is to be used in a micropump having fine channels formed in a substrate, and comprises a photo-sensitive acid-generating agent and an acid-sensitive gas-generating agent, and a micropump 10 has the photoresponsive gas-generating material 13 housed therein.

Abstract: The present invention provides a photoresponsive gas-generating material that is to be used in a micropump of a microfluid device having fine channels formed therein, and is capable of effectively generating gases for transporting a microfluid in response to light irradiation and transporting the microfluid at an improved transport efficiency. The present invention also provides a micropump incorporating the photoresponsive gas-generating material. A photoresponsive gas-generating material 13 is to be used in a micropump having fine channels formed in a substrate, and comprises a photo-sensitive acid-generating agent and an acid-sensitive gas-generating agent, and a micropump 10 has the photoresponsive gas-generating material 13 housed therein.

Abstract: The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200° C. or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.

Abstract: To provide a micropump device having good controllability over the amount of gas generated from the gas generating material and thus the amount of liquid fed by the micropump. The micropump device includes a micropump 10 and a controller 50. The micropump 10 includes: a microchannel 22 serving as a channel for liquid; a gas generating material 34 generating a gas upon exposure to light and supplying the gas to the microchannel 22; and a light source 42 for irradiating the gas generating material 34 with light 44. The controller 50 supplies to the light source 42 a control pulse signal CS that causes the light source 42 to blink on and off in a binary manner by repeating a pulse train pattern composed of a fixed number of bits each capable of having two states, one of which is a first level allowing the light source 42 to be turned on and the other of which is a second level allowing the light source 42 to be turned off.

Abstract: The present invention provides a microfluidic device with a micro-pump system in which the production process is simplified and the device is further downsized. A microfluidic device 1 has a gas generation portion 3. The gas generation portion 3 has a substrate 10 and a gas generation layer 20. The substrate 10 has a first main surface 10a and a second main surface 10b. The substrate 10 has a micro-channel 14 with an opening at least on the first main surface 10a. The gas generation layer 20 is disposed on the first main surface 10a of the substrate 10 so as to cover an opening 14a. The gas generation layer 20 generates gas by receiving an external stimulus.

Abstract: To provide a micropump device having good controllability over the amount of gas generated from the gas generating material and thus the amount of liquid fed by the micropump. The micropump device includes a micropump 10 and a controller 50. The micropump 10 includes: a microchannel 22 serving as a channel for liquid; a gas generating material 34 generating a gas upon exposure to light and supplying the gas to the microchannel 22; and a light source 42 for irradiating the gas generating material 34 with light 44. The controller 50 supplies to the light source 42 a control pulse signal CS that causes the light source 42 to blink on and off in a binary manner by repeating a pulse train pattern composed of a fixed number of bits each capable of having two states, one of which is a first level allowing the light source 42 to be turned on and the other of which is a second level allowing the light source 42 to be turned off.

Abstract: The present invention provides a microfluidic device with a micro-pump system in which the production process is simplified and the device is further downsized. A microfluidic device 1 has a gas generation portion 3. The gas generation portion 3 has a substrate 10 and a gas generation layer 20. The substrate 10 has a first main surface 10a and a second main surface 10b. The substrate 10 has a micro-channel 14 with an opening at least on the first main surface 10a. The gas generation layer 20 is disposed on the first main surface 10a of the substrate 10 so as to cover an opening 14a. The gas generation layer 20 generates gas by receiving an external stimulus.

Abstract: The present invention provides a photoresponsive gas-generating material that is to be used in a micropump of a microfluid device having fine channels formed therein, and is capable of effectively generating gases for transporting a microfluid in response to light irradiation and transporting the microfluid at an improved transport efficiency. The present invention also provides a micropump incorporating the photoresponsive gas-generating material. A photoresponsive gas-generating material 13 is to be used in a micropump having fine channels formed in a substrate, and comprises a photo-sensitive acid-generating agent and an acid-sensitive gas-generating agent, and a micropump 10 has the photoresponsive gas-generating material 13 housed therein.

Abstract: Obtained is a dicing and die bonding tape that makes it possible to pick up a semiconductor chip easily and reliably in dicing a semiconductor wafer to pickup the semiconductor chip together with the whole die bonding film. A dicing and die bonding tape used in dicing of a wafer, in obtaining a semiconductor chip, and in die bonding of the semiconductor chip, the dicing and die bonding tape having a die bonding film 3, and a non pressure sensitive adhesive film 4 bonded on one surface of the die bonding film 3, the separation strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being within a range of 1 to 6 N/m, the shear strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being 0.3 to 2 N/mm2.

Abstract: It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 ?m or thinner, for example, about 25 to 30 ?m at a high productivity.

Abstract: A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.

Abstract: It is the object of the invention to provide a method for manufacturing a semiconductor chip capable of obtaining a semiconductor chip at a high manufacturing efficiency without damages. The invention is a method for manufacturing a semiconductor chip, which comprises a tape adhesion step of sticking a pressure sensitive adhesive tape for dicing having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by radiating light to a semiconductor wafer with a circuit formed; a dicing step for dicing the wafer with the pressure sensitive adhesive tape for dicing stuck and dividing the semiconductor wafer into each semiconductor chip; a separation step of separating at least a portion of the pressure sensitive adhesive tape for dicing from the semiconductor chip by radiating light to the divided each semiconductor chip; and a pickup step of picking the semiconductor chip up by a needle-less pickup method.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.

Abstract: It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 ?m.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without damaging an adherend by giving stimulation thereto, a tape employing this adhesive substance, and a method for peeling off the adhesive substance. An adhesive substance, which contains a gas-generating agent for generating gas by stimulation, gas generated from said gas-generating agent being discharged to the outside of said adhesive substance so as not to foam said adhesive substance, and gas generated from said gas-generating agent peeling at least part of an adhesive surface of said adhesive substance off an adherend so as to decrease adhesive strength.

Abstract: It is an object of the present invention to provide an adhesive substance capable of being easily peeled off without damaging an adherend by means of irradiation with light, an adhesive product, and a connected structure. The present invention relates to an adhesive substance containing an azo compound generating gas by means of irradiation with light, at least part of gas generated from said azo compound being discharged to the outside of said adhesive substance.

Abstract: An object of the present invention is to provide an adhesive substance capable of being easily peeled off without using light and damaging an adherend, a method for peeling off the adhesive substance, and a connected structure.

Abstract: A semiconductor wafer (W) where circuits are formed in the area formed in the area divided by streets is split into semiconductor chips having an individual circuit. By interposing an adhesive sheet whose adhesive force is lowered by stimulation between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) is held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damaging or deforming.

Abstract: The purpose of the invention is to provide a double-sided adhesive tape which prevents a wafer from damaging even when the wafer has a considerably thin thickness of about 50 &mgr;m, which has improved handlability, which is favorably used for processing of an IC chip and which facilitates its peeling, and a method for manufacturing an IC chip using it.

Abstract: It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 &mgr;m.