Abstract: Provided are a floating restricting member restricting the floating position of a bundle of sheets; and a holding mechanism holding the floating restricting member relative to a side fence. The floating restricting member includes a sheet contact section being brought into contact with the sheets from above; and a sheet-floating restricting section restricting the floating position of the floating sheet that is floated while air is blown thereto. The holding mechanism sets the floating restricting member in the initial state where the sheet-floating restricting section restricts the floating position of the sheet, in the sheet-placing time retracted state where the sheets are pushed against the sheet contact section so that the floating restricting member is retracted, and in the sheet-ejecting time retracted state where, when the sheets are to be removed, the sheet is pushed against the sheet contact section from below so that the floating restricting member is retracted.

Abstract: A far-infrared plane heater 6 is placed in a closed-container-shaped device body 3 of an oxidation annealing device 1, an oxygen addition gas feed pipe 8 through which an oxygen addition gas containing water vapor and oxygen is fed into the device body 3 is connected to a gas exhaust pipe 11 through which gas in the device body 3 is discharged, and jet nozzles 16 through which the oxygen addition gas containing water vapor and oxygen is ejected to an oxygen-deficient portion of a substrate 50 are brought into communication with the oxygen addition gas feed pipe 8. This allows oxidation annealing of a large substrate at high throughput and low cost while preventing a leakage current.

Abstract: A sheet feeding device includes: a sheet stacking member; an air blowing unit configured to blow air onto the sheet bundle placed on the sheet stacking member to suspend multiple sheets of the sheet bundle; a lifting/lowering unit configured to lift/lower the sheet stacking member; an optical reflection sensor configured to detect a suspended sheet suspended by the air blowing unit; and a control unit configured to control the lifting/lowering unit based on an output value of the optical reflection sensor. The optical reflection sensor is configured to be capable of detecting an area corresponding to multiple sheets in a sheet suspension zone extending between a non-suspended sheet bundle and a conveying member configured to convey an uppermost sheet of the multiple suspended sheets. The non-suspended sheet bundle is made up of sheets not suspended during a period when air is blown by the air blowing unit.

Abstract: A far-infrared plane heater 6 is placed in a closed-container-shaped device body 3 of an oxidation annealing device 1, an oxygen addition gas feed pipe 8 through which an oxygen addition gas containing water vapor and oxygen is fed into the device body 3 is connected to a gas exhaust pipe 11 through which gas in the device body 3 is discharged, and jet nozzles 16 through which the oxygen addition gas containing water vapor and oxygen is ejected to an oxygen-deficient portion of a substrate 50 are brought into communication with the oxygen addition gas feed pipe 8. This allows oxidation annealing of a large substrate at high throughput and low cost while preventing a leakage current.

Abstract: A semiconductor device includes at least one thin-film transistor 116, which includes: a crystalline semiconductor layer 120 including a region 110 to be a channel region and source and drain regions 113; a gate electrode 107 for controlling the conductivity of the region 110 to be a channel region; a gate insulating film 106 arranged between the semiconductor layer 120 and the gate electrode 107; and source and drain electrodes 115 connected to the source and drain regions 113, respectively. At least one of the source and drain regions 113 contains an element to be a donor or an acceptor and a rare-gas element, but the region 110 to be a channel region does not contain the rare-gas element. The atomic weight of the rare-gas element is greater than that of the element to be a donor or an acceptor. The concentration of the rare-gas element in the at least one region as measured in the thickness direction thereof decreases continuously from the upper surface of the at least one region toward its lower surface.

Abstract: A sheet feeding device includes: a sheet storage unit that stores a sheet stack of a plurality of sheets; and a plurality of nozzles configured to generate air currents blown out to the sheet stack, the air currents separate an uppermost sheet from the rest of stack of the plurality of sheets including a next sheet, the next sheet being situated immediately below the uppermost sheet.

Abstract: A semiconductor device includes at least one thin-film transistor 116, which includes: a crystalline semiconductor layer 120 including a region 110 to be a channel region and source and drain regions 113; a gate electrode 107 for controlling the conductivity of the region 110 to be a channel region; a gate insulating film 106 arranged between the semiconductor layer 120 and the gate electrode 107; and source and drain electrodes 115 connected to the source and drain regions 113, respectively. At least one of the source and drain regions 113 contains an element to be a donor or an acceptor and a rare-gas element, but the region 110 to be a channel region does not contain the rare-gas element. The atomic weight of the rare-gas element is greater than that of the element to be a donor or an acceptor. The concentration of the rare-gas element in the at least one region as measured in the thickness direction thereof decreases continuously from the upper surface of the at least one region toward its lower surface.

Abstract: A rotary electrical machine comprises: a stator core; a rotor core arranged at the inner periphery of this stator core; a bracket connected with one end of the stator core; a first bearing arranged by means of the bracket; a frame and a housing connected with the other end of the stator core; a second bearing arranged by means of the housing; a ventilation fan provided between the rotor core and the first bearing, with vanes provided on the outside in the axial direction; a rotor shaft that is freely rotatably supported by the first bearing and second bearing; an inlet provided in the frame or the housing; and an outlet provided in the frame or the housing.

Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Abstract: To provide an electric rolling stock driving apparatus allowing for an enhanced reliability of rolling stock system, a main motor 14 for driving an electric rolling stock, a VVVF inverter 13 for driving the main motor, and a brake controller 12 for controlling braking forces of wheels 16 are provided within a driving truck 9, allowing for an improvement in reliability of a rolling stock system that otherwise might have deficiencies such as an increased rolling stock manufacture term or an increased trouble restoration time by a complicated implementation of wiring due to an arrangement according to a relevant art in which, for driving a rolling stock, associated apparatuses are separately mounted to a car body and a truck.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: A rotary electrical machine comprises: a stator core; a rotor core arranged at the inner periphery of this stator core; a bracket connected with one end of the stator core; a first bearing arranged by means of the bracket; a frame and a housing connected with the other end of the stator core; a second bearing arranged by means of the housing; a ventilation fan provided between the rotor core and the first bearing, with vanes provided on the outside in the axial direction; a rotor shaft that is freely rotatably supported by the first bearing and second bearing; an inlet provided in the frame or the housing; and an outlet provided in the frame or the housing.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: A resistor having reliability in electrical connection between an upper surface electrode and a side face electrode, and in bonding strength between a first thin film and a second thin film is provided. The resistor includes upper surface electrodes formed on a main surface a substrate and side face electrodes disposed to side faces of the substrate and connected electrically to the pair of upper surface electrodes, respectively. The upper surface electrode includes a first upper surface electrode layer and a bonding layer overlying the first upper surface electrode layer. The side face electrode includes a first thin film disposed to a side face of the substrate, a second thin film composed of copper-base alloy film and connected electrically to the first thin film, a first plating film formed by nickel plating for covering the second thin film, and a second plating film covering the first plating film.

Abstract: In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.