Abstract: The present invention provides an intra-hoistway measurement system automatically measuring dimensions within an elevator hoistway prior to elevator installation to reduce labor of workers. An intra-hoistway measurement system according to the present invention includes: a reference laser device that is mounted to a structure on a ceiling or in an upper portion of the hoistway for an elevator and emits a laser beam toward a lowermost part; a mobile measuring device that has a plane measuring device to measure horizontal dimensions within the hoistway; and a moving device that is mounted to the structure on the ceiling or in the upper portion of the hoistway and moves the mobile measuring device up and down. The mobile measuring device has a reference laser detection device that detects the laser beam emitted from the reference laser device, and an attitude detection device that detects its own attitude.

Abstract: A torque rod capable of suppressing an outside member from being deformed or broken at the time of a vulcanized molding. A torque rod includes: a first antivibration device including: a cylindrical outside member having an axial end face, an axial inside member disposed on an internal peripheral side of the outside member, and an antivibration base body including a rubber-like elastic body adhered, in a vulcanized manner, to an external peripheral face of the inside member and to an internal peripheral face of the outside member; and a connecting member connected to a second antivibration device connecting two members by a rubber-like elastic body, the connecting member being an article integrated with the outside member, wherein the outside member includes a level difference which is provided at the axial end face around an entire circumference and which has a radial outside axially concaved relative to a radial inside.

Abstract: A semiconductor device includes: a semiconductor chip, and a lead frame. The semiconductor chip is mounted over a die pad. Four suspension leads are connected with the die pad and at least one of them is provided between first and second lead groups and is deformed to protrude toward the first lead group. At least one of the leads of the second lead group which is nearer to the deformed suspension lead is deformed to be apart from remaining leads of the second lead group.

Abstract: A semiconductor device includes: a semiconductor chip, and a lead frame. The semiconductor chip is mounted over a die pad. Four suspension leads are connected with the die pad and at least one of them is provided between first and second lead groups and is deformed to protrude toward the first lead group. At least one of the leads of the second lead group which is nearer to the deformed suspension lead is deformed to be apart from remaining leads of the second lead group.

Abstract: A semiconductor device includes: a semiconductor chip, and a lead frame. The semiconductor chip is mounted over a die pad. Four suspension leads are connected with the die pad and at least one of them is provided between first and second lead groups and is deformed to protrude toward the first lead group. At least one of the leads of the second lead group which is nearer to the deformed suspension lead is deformed to be apart from remaining leads of the second lead group.

Abstract: A semiconductor device includes: a semiconductor chip, and a lead frame. The semiconductor chip is mounted over a die pad. Four suspension leads are connected with the die pad and at least one of them is provided between first and second lead groups and is deformed to protrude toward the first lead group. At least one of the leads of the second lead group which is nearer to the deformed suspension lead is deformed to be apart from remaining leads of the second lead group.

Abstract: A packaging method, and an apparatus for carrying out the method, comprises the operation of a conveyor for conveying articles to be packaged, the supply of a packaging film to be formed into a tubular-shaped package for enclosing or packaging the articles to be packaged, and the provision of end sealing mechanisms for sealing the ends of the tubular packages.

Abstract: A packaging article inclusion-proofing device for use with an end-sealing mechanism includes a motor for driving a conveyor for feeding packaging articles, with a predetermined space therebetween, into a packaging material which is disposed downstream and formed into a packaging tube, a motor for driving a series of rolls which deliver the packaging material, and a motor for driving an end-sealing mechanism for achieving end-sealing of the tubular packaging material. A deviation detecting sensor is provided for detecting any deviation of the packaging articles from a position at which they would normally be disposed during the end-sealing operation. A reference timing pulse generator generates predetermined reference timing pulses with respect to the feeding of the packaging articles.

Abstract: A vacant package-proofing control device for use in conenction with a packaging machine includes a first motor for driving a conveyor for feeding articles to be packaged, with a predetermined spaced defined therebetween, and a second motor for driving a series of rolls which deliver packaging material, formed into a tube, into which the articles are to be inserted for packaging. A third motor is also provided for driving a pair of end-sealing mechanisms. An absence detecting sensor is disposed at a predetermined position upstream of the end-sealing mechanisms for detecting the absence of any packaging article from its predetermined position upon its conveyor. A reference timing pulse generator is also provided for generating predetermined reference timing pulses in connection with the timing of the feeding of the packaging articles.