Patents by Inventor Masato Hinata

Masato Hinata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10071462
    Abstract: To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: September 11, 2018
    Assignee: FUJI MANUFACTURING CO., LTD.
    Inventors: Keiji Mase, Daisuke Chino, Masato Hinata
  • Patent number: 9505102
    Abstract: To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 ?m and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm and an ejection pressure of 0.2 MPa to 0.6 MPa without masking so that 0.25 cm3 or less of the abrasive is included per 1000 cm3 of the compressed gas discharged from the ejection nozzle.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 29, 2016
    Assignee: FUJI MANUFACTURING CO., LTD.
    Inventors: Keiji Mase, Masato Hinata
  • Publication number: 20160243673
    Abstract: To cut out a bard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2 and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
    Type: Application
    Filed: April 5, 2016
    Publication date: August 25, 2016
    Inventors: Keiji Mase, Daisuke Chino, Masato Hinata
  • Patent number: 9333624
    Abstract: To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: May 10, 2016
    Assignee: FUJI MANUFACTURING CO., LTD
    Inventors: Keiji Mase, Daisuke Chino, Masato Hinata
  • Publication number: 20160023325
    Abstract: To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 ?m and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm and an ejection pressure of 0.2 MPa to 0.6 MPa without masking so that 0.25 cm3 or less of the abrasive is included per 1000 cm3 of the compressed gas discharged from the ejection nozzle.
    Type: Application
    Filed: August 17, 2015
    Publication date: January 28, 2016
    Inventors: Keiji Mase, Masato Hinata
  • Patent number: 9144884
    Abstract: To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 ?m and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm and an ejection pressure of 0.2 MPa to 0.6 MPa without masking so that 0.25 cm3 or less of the abrasive is included per 1000 cm3 of the compressed gas discharged from the ejection nozzle.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: September 29, 2015
    Assignee: FUJI MANUFACTURING CO., LTD.
    Inventors: Keiji Mase, Masato Hinata
  • Publication number: 20140065930
    Abstract: To provide a scribing method by blasting that allows forming a groove at high accuracy without masking, a blasting machine that includes an ejection nozzle having a slit-shaped ejection opening with a width of 10 to 500 ?m and a length of 5 to 5000 times the width, and an abrasive with a median diameter equal to or less than one-half of a width of the ejection opening of the ejection nozzle and with a maximum particle diameter smaller than a width of the ejection opening are used; and the abrasive is ejected together with compressed gas on a surface of a workpiece at an ejection distance of 0.1 to 3.0 mm without masking so that an ejection quantity of the abrasive is to be 0.25 cm3 or less relative to discharge gas amount 1000 cm3 in a range of ejection pressure of 0.2 to 0.6 MPa.
    Type: Application
    Filed: August 12, 2013
    Publication date: March 6, 2014
    Applicant: FUJI MANUFACTURING CO., LTD.
    Inventors: Keiji Mase, Masato Hinata
  • Publication number: 20130303053
    Abstract: To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 14, 2013
    Applicant: FUJI MANUFACTURING CO., LTD
    Inventors: Keiji Mase, Daisuke Chino, Masato Hinata
  • Publication number: 20120264355
    Abstract: In a polishing performed by imparting kinetic energy to abrasive using a compressed gas flow, horizontal cutting force is obtained while vertical cutting force acting on a surface of a workpiece is inhibited. A compressed gas containing no abrasive is ejected from an accelerated flow generation nozzle 10 toward a surface of a workpiece W to generate an accelerated flow S along the surface of the workpiece W. Also, abrasive 30 is introduced into an abrasive introduction path 20 opening toward the surface of the workpiece W at an area where the accelerated flow S is generated, preferably together with a compressed gas to merge the abrasive 30 with the accelerated flow S and make the abrasive 30 slide along the surface of the workpiece W. Thus, horizontal cutting force is exerted on the surface.
    Type: Application
    Filed: March 23, 2012
    Publication date: October 18, 2012
    Inventors: Keiji MASE, Masato Hinata
  • Publication number: 20100008808
    Abstract: A highly reliable sliding face modification material capable of forming a stable film of molybdenum disulfide on the sliding face of a sliding member, the sliding face modification material having a molybdenum disulfide content of 95 wt % or more and an organic material content of 1500 ppm or less in weight ratio, and the sliding face modification material being projected onto the sliding face to form a coating layer.
    Type: Application
    Filed: October 15, 2007
    Publication date: January 14, 2010
    Inventors: Yuuki Yoshimi, Yoichiro Nakamura, Hirotaka Kawabata, Masato Ishiwata, Masato Hinata, Katsuhiro Shikano