Patents by Inventor Masato Honma

Masato Honma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10583640
    Abstract: A method for producing a fiber-reinforced composite material is provided. By satisfying particular conditions, this method is capable of suppressing the problem of poor appearance caused by the release film in the production of the fiber-reinforced composite material having a three-dimensional shape by heat-press molding to enable production of the fiber-reinforced composite material having a high quality appearance in high cycle. A method for manufacturing a fiber-reinforced composite material wherein a fiber-reinforced substrate containing a reinforcing fiber (A) and a thermosetting resin (B) is sandwiched between release films (C) to constitute a layered material, and the layered material is pressed in a mold heated to molding temperature to thereby cure the thermosetting resin (B), wherein the method satisfies the following (i), (ii), and (iii) or (i), (ii), and (iv): (i) the fiber-reinforced composite material has at least 1 bent part, (ii) the molding temperature is 130 to 180° C.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: March 10, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Naokichi Imai, Masato Honma
  • Patent number: 10571963
    Abstract: A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 25, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masato Honma, Takashi Fujioka
  • Publication number: 20190382543
    Abstract: Provided is a mountain-shaped structure material being excellent in stiffness and lightness. The present invention is a structure material including a resin, reinforced fibers and voids. The structure material has a specific bending stiffness represented as Ec1/3·??1 being 2.5 or more where a bending modulus is Ec and a density is ?. The structure material has a mountain shape.
    Type: Application
    Filed: December 20, 2017
    Publication date: December 19, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takashi FUJIOKA, Yoshiki TAKEBE, Masato HONMA
  • Patent number: 10509443
    Abstract: A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover. The area of the joining portion is within a range of 10 cm2 or more and 100 cm2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: December 17, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Masato Honma, Takashi Fujioka
  • Publication number: 20190313542
    Abstract: A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.
    Type: Application
    Filed: June 20, 2017
    Publication date: October 10, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takashi FUJIOKA, Masato HONMA
  • Publication number: 20190299495
    Abstract: A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80° C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G?) of the structure precursor is less than 1.2×108 Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G?) of the structure precursor is 1.2×108 Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.
    Type: Application
    Filed: December 9, 2016
    Publication date: October 3, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takashi FUJIOKA, Yoshiki TAKEBE, Masato HONMA
  • Publication number: 20190237862
    Abstract: The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265° C.
    Type: Application
    Filed: September 25, 2017
    Publication date: August 1, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Mitsushige HAMAGUCHI, Takashi FUJIOKA, Masato HONMA
  • Publication number: 20190208654
    Abstract: The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity.
    Type: Application
    Filed: September 25, 2017
    Publication date: July 4, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Mitsushige HAMAGUCHI, Takashi FUJIOKA, Masato HONMA
  • Publication number: 20190054706
    Abstract: A method of producing a fiber reinforced composite material satisfies condition 1: a thermosetting resin base material (B) includes a thermosetting resin (a) and a nonwoven fabric-shaped base material (a thermosetting resin base material satisfying the condition 1 is referred to as a thermosetting resin base material (B-1)); and condition 2: the thermosetting resin base material (B) is a base material including the thermosetting resin (a), and a porous sheet-shaped base material (b) or a film-shaped base material (c), the thermosetting resin (a) has a viscosity of 1,000 Pa·s or more at 40° C., and the thermosetting resin (a) has a minimum viscosity of 10 Pa·s or less during heating from 30° C. at a temperature rise rate of 1.5° C./min (a thermosetting resin base material satisfying the condition 2 is referred to as a thermosetting resin base material (B-2)).
    Type: Application
    Filed: February 14, 2017
    Publication date: February 21, 2019
    Inventors: Tomohiro Takehara, Masato Honma, Terry Sakurai Brown, Noriyuki Hirano
  • Publication number: 20190002655
    Abstract: A structure material includes a resin, reinforced fibers, and voids. The structure material includes a volume content of the resin being within a range of 2.5% by volume or more and 85% by volume or less, a volume content of the reinforced fibers being within a range of 0.5% by volume or more and 55% by volume or less, the voids being contained in the structure material in a rate within a range of 10% by volume or more and 97% by volume or less, a thickness St of the structure material satisfying a conditional expression: St?Lf2·(1?cos(?f)), and a specific bending modulus of the structure material represented as Ec1/3·??1 being within a range of 3 or more and 20 or less, and a bending modulus Ec of the structure material being 3 GPa or more.
    Type: Application
    Filed: December 9, 2016
    Publication date: January 3, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yoshiki TAKEBE, Masato HONMA
  • Publication number: 20190002654
    Abstract: A structure material includes a resin, reinforced fibers, and voids, a volume content of the resin being within a range of 2.5% by volume or more and 85% by volume or less, a volume content of the reinforced fibers being within a range of 0.5% by volume or more and 55% by volume or less, the voids being contained in the structure material in a rate within a range of 10% by volume or more and 97% by volume or less, a thickness St of the structure material satisfying a conditional expression: St?Lf2·(1?cos(?f)) where a length of the reinforced fibers is Lf and an oriented angle of the reinforced fibers in a sectional direction of the structure material is ?f, and a compression strength in an in-plane direction at 50% compression of the structure material measured in accordance with JIS K7220 being 3 MPa or more.
    Type: Application
    Filed: December 9, 2016
    Publication date: January 3, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Kotaro SHINOHARA, Yoshiki TAKEBE, Masato HONMA
  • Publication number: 20180362760
    Abstract: Provided is a molding material which includes a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly(phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.
    Type: Application
    Filed: June 14, 2018
    Publication date: December 20, 2018
    Applicant: Toray Industries, Inc.
    Inventors: Naokichi Imai, Atsuki Tsuchiya, Masato Honma, Kohei Yamashita, Shunsuke Horiuchi, Koji Yamauchi
  • Publication number: 20180299925
    Abstract: A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.
    Type: Application
    Filed: September 6, 2016
    Publication date: October 18, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180284845
    Abstract: A housing includes: a top cover; a bottom cover; and a reinforcing structure that is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the top cover or the bottom cover. The reinforcing structure is (1) joined to the bottom cover or the top cover with a pealing load of 60 N/cm2 or more and 5000 N/cm2 or less at 23° C. and with a pealing load of less than 60 N/cm2 at 200° C., and/or (2) joined to the top cover or the bottom cover by thermal welding.
    Type: Application
    Filed: September 6, 2016
    Publication date: October 4, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180270967
    Abstract: A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover, and has a flat portion, and a rising wall member erected on a rim of the flat portion. The rising wall member of the reinforcing structure is joined to a rising wall member erected on a rim of the bottom cover or the top cover.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 20, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180260002
    Abstract: A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover. The area of the joining portion is within a range of 10 cm2 or more and 100 cm2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180260003
    Abstract: An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Yoshiki TAKEBE, Naokichi IMAI, Takashi FUJIOKA
  • Publication number: 20180244879
    Abstract: A resin supply material used for press molding or vacuum-pressure molding of a fiber-reinforced resin, the resin supply material including a continuous porous material and a thermosetting resin, wherein an average pore cross-sectional area ratio P expressed by formula (I) is 1.1 or more: P=AII/AI ??(I) AI: average pore cross-sectional area in region I AII: average pore cross-sectional area in region II Region I: region occupying 10% of total volume of continuous porous material from surface layer on both surfaces thereof Region II: whole region of continuous porous material.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 30, 2018
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Naokichi Imai, Satomi Hiasa
  • Patent number: 10023737
    Abstract: Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly (phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: July 17, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Naokichi Imai, Atsuki Tsuchiya, Masato Honma, Kohei Yamashita, Shunsuke Horiuchi, Koji Yamauchi
  • Publication number: 20180186134
    Abstract: A method for producing a fiber-reinforced composite material is provided. By satisfying particular conditions, this method is capable of suppressing the problem of poor appearance caused by the release film in the production of the fiber-reinforced composite material having a three-dimensional shape by heat-press molding to enable production of the fiber-reinforced composite material having a high quality appearance in high cycle. A method for manufacturing a fiber-reinforced composite material wherein a fiber-reinforced substrate containing a reinforcing fiber (A) and a thermosetting resin (B) is sandwiched between release films (C) to constitute a layered material, and the layered material is pressed in a mold heated to molding temperature to thereby cure the thermosetting resin (B), wherein the method satisfies the following (i), (ii), and (iii) or (i), (ii), and (iv): (i) the fiber-reinforced composite material has at least 1 bent part, (ii) the molding temperature is 130 to 180° C.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 5, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Naokichi IMAI, Masato HONMA