Patents by Inventor Masato Honma

Masato Honma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180299925
    Abstract: A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.
    Type: Application
    Filed: September 6, 2016
    Publication date: October 18, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180284845
    Abstract: A housing includes: a top cover; a bottom cover; and a reinforcing structure that is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the top cover or the bottom cover. The reinforcing structure is (1) joined to the bottom cover or the top cover with a pealing load of 60 N/cm2 or more and 5000 N/cm2 or less at 23° C. and with a pealing load of less than 60 N/cm2 at 200° C., and/or (2) joined to the top cover or the bottom cover by thermal welding.
    Type: Application
    Filed: September 6, 2016
    Publication date: October 4, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180270967
    Abstract: A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover, and has a flat portion, and a rising wall member erected on a rim of the flat portion. The rising wall member of the reinforcing structure is joined to a rising wall member erected on a rim of the bottom cover or the top cover.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 20, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180260003
    Abstract: An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Yoshiki TAKEBE, Naokichi IMAI, Takashi FUJIOKA
  • Publication number: 20180260002
    Abstract: A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover. The area of the joining portion is within a range of 10 cm2 or more and 100 cm2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 13, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Masato HONMA, Takashi FUJIOKA
  • Publication number: 20180244879
    Abstract: A resin supply material used for press molding or vacuum-pressure molding of a fiber-reinforced resin, the resin supply material including a continuous porous material and a thermosetting resin, wherein an average pore cross-sectional area ratio P expressed by formula (I) is 1.1 or more: P=AII/AI ??(I) AI: average pore cross-sectional area in region I AII: average pore cross-sectional area in region II Region I: region occupying 10% of total volume of continuous porous material from surface layer on both surfaces thereof Region II: whole region of continuous porous material.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 30, 2018
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Naokichi Imai, Satomi Hiasa
  • Patent number: 10023737
    Abstract: Provided is a molding material comprising a composite of 1 to 50 wt % of a continuous reinforcing fiber bundle (A) and 0.1 to 20 wt % of a poly (phenylene ether ether ketone) oligomer (B); and 30 to 98.9 wt % of a thermoplastic resin (C) adhering to the composite, wherein the component (B) has a melting point of not higher than 270° C. Also provided are a method for molding the molding material, a method for producing the molding material, and a method for producing a fiber-reinforced composite material. A molded article having high heat resistance and dynamic properties can be easily produced without impairing the economic efficiency and productivity during the process for producing a molding material. In addition, a fiber-reinforced composite material can be produced with more ease and high productivity.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: July 17, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Naokichi Imai, Atsuki Tsuchiya, Masato Honma, Kohei Yamashita, Shunsuke Horiuchi, Koji Yamauchi
  • Publication number: 20180186134
    Abstract: A method for producing a fiber-reinforced composite material is provided. By satisfying particular conditions, this method is capable of suppressing the problem of poor appearance caused by the release film in the production of the fiber-reinforced composite material having a three-dimensional shape by heat-press molding to enable production of the fiber-reinforced composite material having a high quality appearance in high cycle. A method for manufacturing a fiber-reinforced composite material wherein a fiber-reinforced substrate containing a reinforcing fiber (A) and a thermosetting resin (B) is sandwiched between release films (C) to constitute a layered material, and the layered material is pressed in a mold heated to molding temperature to thereby cure the thermosetting resin (B), wherein the method satisfies the following (i), (ii), and (iii) or (i), (ii), and (iv): (i) the fiber-reinforced composite material has at least 1 bent part, (ii) the molding temperature is 130 to 180° C.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 5, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Naokichi IMAI, Masato HONMA
  • Patent number: 10005905
    Abstract: A molding material is provided including a composite having 1 to 50 wt % of (A) a bundle of continuous reinforcing fibers and 0.1 to 40 wt % of (B) a polyarylene sulfide prepolymer or (B?) a polyarylene sulfide; and 10 to 98.9 wt % of (C) a thermoplastic resin adhered to the composite; wherein the composite further has (D) a zero-valent transition metal compound or (E) a low-valent iron compound in an amount of 0.001 to 20 mol % based on the amount of sulfur atoms contained in the component (B) or (B?). A prepreg and a method of producing a fiber-reinforced molding base material is also provided. By using the molding material according to the present invention which exhibits excellent economic efficiency and productivity, a molded article having excellent mechanical characteristics can be easily produced.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: June 26, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Naokichi Imai, Kaori Narimatsu, Masato Honma, Shunsuke Horiuchi, Koji Yamauchi
  • Patent number: 9963576
    Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: May 8, 2018
    Assignee: Toray Industríes, Inc.
    Inventors: Atsuki Tsuchiya, Masato Honma, Ryuji Sawaoka
  • Publication number: 20180066118
    Abstract: A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN·cm or more at 23° C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula: Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70° C.
    Type: Application
    Filed: February 24, 2016
    Publication date: March 8, 2018
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Takashi Fujioka, Satomi Hiasa
  • Publication number: 20180044488
    Abstract: A resin supply material used for press molding or vacuum-pressure molding of a fiber-reinforced resin includes a reinforcing fiber base material and a thermosetting resin, wherein a tensile rupture strain of the reinforcing fiber base material is 1% or more at temperature T, and/or a tensile strength of the reinforcing fiber base material is 0.5 MPa or more at the temperature T, wherein Temperature T is a temperature at which the viscosity of the thermosetting resin is minimum in heating of the thermosetting resin at a temperature elevation rate of 1.5° C./minute from 40° C.
    Type: Application
    Filed: February 24, 2016
    Publication date: February 15, 2018
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Satomi Hiasa
  • Publication number: 20180044489
    Abstract: A resin supply material is used for molding a fiber-reinforced resin, includes reinforcing fibers and a resin, wherein a fiber weight content Wfi of the reinforcing fibers as expressed by formula (I) is 30% or less, and/or a fiber volume content Vfi of the reinforcing fibers as expressed by formula (II) is 20% or less Wfi=Wf1/(Wf1+Wr1)×100(%)??(I) Wf1: fiber weight (g) in resin supply material, Wr1: resin weight (g) in resin supply material Vfi=Vf1/Vp1×100(%)??(II) Vf1: fiber volume (mm3) in resin supply material, Vp1: volume (mm3) of resin supply material.
    Type: Application
    Filed: February 24, 2016
    Publication date: February 15, 2018
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Satomi Hiasa
  • Patent number: 9879123
    Abstract: A molded article excellent in dynamic characteristics and water degradation resistance can be obtained by using a fiber-reinforced polypropylene resin composition including a carbodiimide-modified polyolefin (a), a polypropylene resin (b) and reinforcing fibers (c), wherein the content of the carbodiimide group contained in a resin component in the fiber-reinforced polypropylene resin composition is 0.0005 to 140 mmol based on 100 g of a matrix resin component, and the reinforcing fibers (c) are sizing-treated with a polyfunctional compound (s); and a molding material using the fiber-reinforced polypropylene resin composition.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: January 30, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Kentaro Sano, Noriyuki Hirano, Masato Honma, Atsuki Tsuchiya
  • Publication number: 20170326820
    Abstract: A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.
    Type: Application
    Filed: November 10, 2015
    Publication date: November 16, 2017
    Inventors: Takashi Fujioka, Masato Honma
  • Publication number: 20170239895
    Abstract: A production method for a fiber reinforced composite material includes heating a preform formed by laminating a prepreg layer (I) including a reinforcement fiber (A) and a thermosetting resin (B-1) with a resin layer (II) including a thermosetting resin (B-2) and a solid additive (C) to cure the thermosetting resin (B-1) and the thermosetting resin (B-2), the cured resin layer (II?) formed by curing the resin layer (II) having an average thickness of 35 ?m or more and 300 ?m or less.
    Type: Application
    Filed: October 8, 2015
    Publication date: August 24, 2017
    Inventors: Tomohiro Takehara, Satoshi Seike, Masato Honma, Satomi Matsuo
  • Patent number: 9731440
    Abstract: A molding material comprising the following components (A) to (D) at the following ratios, in which the component (D) is bonded to a composite comprising the components (A) to (C) and the order in the weight average molecular weight is component (D)>component (B)>component (C); (A) 1 to 75 wt % of a reinforcing fiber bundle; (B) 0.01 to 10 wt % of a first propylene-based resin; (C) 0.01 to 10 wt % of a second propylene-based resin having carboxylate groups bound to the polymer chains thereof; and (D) 5 to 98.98 wt % of a third propylene-based resin. A molding material of this invention provides a long fiber-reinforced thermoplastic resin molding material containing a propylene-based resin as the matrix resin, which allows the reinforcing fibers to be well dispersed into the molded article produced at the time of injection molding and allows the molded article produced to have excellent mechanical properties.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: August 15, 2017
    Assignee: Toray Industries, Inc.
    Inventors: Masato Honma, Atsuki Tsuchiya, Keiichi Asami
  • Patent number: 9505177
    Abstract: A method is provided for producing a metal composite. The composite includes a metal material and a resin curing layer provided along the metal material, and is obtained by using heat and pressure to mold a preform. The preform includes a sheet-shaped base material containing a thermosetting resin, and a metal material arranged or layered so as to contact the sheet-shaped base material. The method for producing a metal composite includes heating the sheet-shaped base material and semi-curing the thermosetting resin while the metal material in the preform arranged inside a mold is heated to a temperature exceeding 180° C., and molding the preform into a composite using pressure, wherein the thermosetting resin is at least one type selected from the group consisting of epoxy resins, phenol resins, benzoxazine resins, and unsaturated polyester resins.
    Type: Grant
    Filed: November 24, 2011
    Date of Patent: November 29, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takashi Fujioka, Masato Honma
  • Patent number: 9475929
    Abstract: The present invention relates to fiber-reinforced thermoplastic resin composition comprising 0.1 to 10 mass % of a (meth)acrylic-based polymer, 1 to 70 mass % of reinforcing fiber, and 20 to 98.9 mass % of thermoplastic resin, wherein the (meth)acrylic-based polymer has, in a side chain, at least one functional group selected from a hydroxyl group, a carboxyl group, an amide group, and an urea group, and has a cohesive energy density (CED) of 385 to 550 MPa. The present invention provides, particularly in the case of using a polyolefin-based resin as matrix resin, a fiber-reinforced thermoplastic resin composition and a reinforcing fiber bundle which have high adhesiveness and good mechanical characteristics.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: October 25, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Atsuki Tsuchiya, Hideaki Sasaki, Masato Honma, Yumi Ando
  • Patent number: 9340672
    Abstract: A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: wherein, Ar represents an aryl; and X represents at least one selected from the group consisting of ethers, ketones, sulfides, sulfones, amides, carbonates and esters.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: May 17, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Kentaro Sano, Yuki Mitsutsuji, Masato Honma