Abstract: A developing device according to the present invention comprises a turntable, a motor for rotating the turntable and a spraying nozzle for spraying mixture of developer and nitrogen gas onto the turntable in mist form. The turntable is rotated at a rotational speed of 200 rpm by driving the motor, the developer for developing the photoresist that has been formed on the upper surface of a semiconductor wafer fixed to the turntable is mixed with nitrogen gas, and the developer in mist form is sprayed from the spraying nozzle toward the turntable. The photoresist is surely removed due to the chemical reaction with the developer and the pressure of the spray of the developer.

Abstract: An adhesive layer containing a photo-curing adhesive and a thermosetting adhesive is formed on a semiconductor wafer in which a plurality of semiconductor elements are formed. The adhesive layer and the semiconductor wafer are adhered together by selectively exposing the adhesive layer to light and curing the photo-curing adhesive contained in the adhesive layer on the peripheral portion of each semiconductor element. By developing the photo-curing adhesive, the adhesive layer in an area that has not been exposed is removed. Whether the pattern of the adhesive layer is satisfactory or not is determined for each semiconductor element. A lid part is placed on the adhesive layer of the semiconductor element determined to be satisfactory, and the adhesive layer and the lid part are adhered together by heating the adhesive layer and causing the thermosetting adhesive contained in the adhesive layer to exhibit adhesive properties.

Abstract: A developing device according to the present invention comprises a turntable, a motor for rotating the turntable and a spraying nozzle for spraying mixture of developer and nitrogen gas onto the turntable in mist form. The turntable is rotated at a rotational speed of 200 rpm by driving the motor, the developer for developing the photoresist that has been formed on the upper surface of a semiconductor wafer fixed to the turntable is mixed with nitrogen gas, and the developer in mist form is sprayed from the spraying nozzle toward the turntable. The photoresist is surely removed due to the chemical reaction with the developer and the pressure of the spray of the developer.

Abstract: An adhesive layer containing a photo-curing adhesive and a thermosetting adhesive is formed on a semiconductor wafer in which a plurality of semiconductor elements are formed. The adhesive layer and the semiconductor wafer are adhered together by selectively exposing the adhesive layer to light and curing the photo-curing adhesive contained in the adhesive layer on the peripheral portion of each semiconductor element. By developing the photo-curing adhesive, the adhesive layer in an area that has not been exposed is removed. Whether the pattern of the adhesive layer is satisfactory or not is determined for each semiconductor element. A lid part is placed on the adhesive layer of the semiconductor element determined to be satisfactory, and the adhesive layer and the lid part are adhered together by heating the adhesive layer and causing the thermosetting adhesive contained in the adhesive layer to exhibit adhesive properties.