Abstract: A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects a degree of vacuum of the second vacuum suction hole; a pressurization source that sends a fluid to the blow hole; a flow rate control valve; and a controller that determines a flow rate of the fluid to be sent to the blow hole, based on the degree of vacuum, and controls, via the flow rate control valve, the fluid sent from the pressurization source to flow at the determined flow rate.

Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

Abstract: A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

Abstract: A wafer bonding apparatus may include a first chuck, a second chuck, and a pressure device. The first chuck may include a hole formed through a central portion of the first chuck. The second chuck may have a hole formed through a central portion of the second chuck. The pressure device may be configured to pressurize a wafer toward the second chuck through the holes. An air bearing may be interposed between the pressure device and the first chuck to suppress a dislocation of the pressure device.

Abstract: A semiconductor manufacturing apparatus comprises an adsorption unit defining a plurality of pressing holes in the adsorption unit, the plurality of pressing holes configured to eject gas, and defining a plurality of suction holes in the adsorption unit, the plurality of suction holes configured to suction the gas and to handle a semiconductor chip through the gas. At least one of the suction holes is adjacent to at least one of an apex of the adsorption unit or an edge of the adsorption unit.

Abstract: A lighting device includes a light source generating a beam of illumination light, a ring-shaped aperture shielding a central portion of the illumination light and transforming the beam of illumination light into ring-shaped illumination light, and an object lens focusing the ring-shaped illumination light such that a specimen can be illuminated with the ring-shaped illumination light. An inspection apparatus including the light device also has a beam splitter and an image sensor picking up light reflected and/or diffracted from the specimen through the beam splitter. Because a central portion of the illumination light is shielded, lens flare of light transmitted by the beam splitter and the object lens is prevented thereby preventing speckles in the image produced by the image sensor.

Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

Abstract: A lighting device includes a light source generating a beam of illumination light, a ring-shaped aperture shielding a central portion of the illumination light and transforming the beam of illumination light into ring-shaped illumination light, and an object lens focusing the ring-shaped illumination light such that a specimen can be illuminated with the ring-shaped illumination light. An inspection apparatus including the light device also has a beam splitter and an image sensor picking up light reflected and/or diffracted from the specimen through the beam splitter. Because a central portion of the illumination light is shielded, lens flare of light transmitted by the beam splitter and the object lens is prevented thereby preventing speckles in the image produced by the image sensor.

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.