Abstract: An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

Abstract: An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.

Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract: An electric leakage sensing apparatus includes a coupling capacitor having one end connected to a DC power supply, a pulse generator that supplies a pulse to the other end of the coupling capacitor, a voltage detector that detects a voltage at the coupling capacitor charged by the pulse, an electric leakage determination part that compares the voltage detected by the voltage detector to a threshold value, and makes a determination of existence or non-existence of an electric leakage of the DC power supply based on a comparison result, and a booster circuit that applies a boosted pulse voltage to the coupling capacitor. The pulse generator converts an output voltage of the booster circuit into the pulse voltage. The voltage detector includes an offset voltage generating circuit that generates an offset voltage.

Abstract: An electric leakage sensing apparatus includes a coupling capacitor having one end connected to a DC power supply, a pulse generator that supplies a pulse to the other end of the coupling capacitor, a voltage detector that detects a voltage at the coupling capacitor charged by the pulse, an electric leakage determination part that compares the voltage detected by the voltage detector to a threshold value, and makes a determination of existence or non-existence of an electric leakage of the DC power supply based on a comparison result, and a booster circuit that applies a boosted pulse voltage to the coupling capacitor. The pulse generator converts an output voltage of the booster circuit into the pulse voltage. The voltage detector includes an offset voltage generating circuit that generates an offset voltage.

Abstract: Easy execution of proximity communication with a specific vehicle is to be enabled. A mobile proximity radio-communication terminal receives an event-report application which is sent from an application server for causing a mode to transit to a vehicle communication mode which performs proximity communication with an on-board proximity radiocommunication terminal mounted on a vehicle that is suffering from generation of abnormality and permits the mode to transit into the vehicle communication mode based on such event-report application and then sends authentication information to the on-board proximity radiocommunication terminal by proximity communication.

Abstract: The present invention relates to an image processing apparatus, method, program and recording medium, which make it possible to remove an obstacle, which blocks the field of view, and provide an image of a pleasant field of view. An interference status detector determines whether it is necessary to correct an image obtained by an image pickup unit, and an obstacle detector detects a pixel corresponding to an obstacle in an obtained image. An obstacle removal processor, based on output from a movement status controller and an obstacle registry, replaces the pixel of the obstacle in the frame of the image to be corrected with a corresponding pixel in the chronologically previous frame, carries out correction so as to remove the obstacle from the image, and outputs the corrected image to a display unit.

Abstract: A code-type sensor for detecting a change in capacitance includes a plurality of detection electrodes for detecting a change in capacitance, a shield electrode surrounding the plurality of detection electrodes so as to restrict a detection range of the capacitance and having an opening in a direction of detection, and a contact detecting electrode for detecting contact disposed along a longitudinal direction of the sensor. The detection electrodes are disposed at a position close to the opening in the shield electrode and at a position far from the opening in the shield electrode. The contact detecting electrode is disposed on a back side in the direction of detection of the shield electrode.