Abstract: The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

Abstract: The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.

Abstract: An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.

Abstract: A silver ink including silver particles and a protective agent containing at least one amine compound dispersed in a dispersion medium containing, as a main solvent, a solvent having a vapor pressure at 20° C. of 40 mmHg or less and a vapor pressure at 70° C. of 0.09 mmHg or more, in an amount of 80% or more on a mass basis relative to the total dispersion medium. The amine compound has a mass average molecular weight of 115 or less, and the total amount of the amine compound is 1 part by weight or more and 14 parts by weight or less per 100 parts by weight of the silver particles. The silver ink has a moisture content of 500 ppm or more and 50,000 ppm or less and enables a practical metal film to be formed even through calcination at a low temperature of 70° C. or less.

Abstract: The present invention relates to a method of testing for genetic susceptibility to type-2 diabetes in a subject that comprises detecting one or more polymorphisms present in the KCNQ1 gene and/or EIF2AK4 gene in a DNA-containing sample collected from the subject. The present invention permit a method of accurately, conveniently, and rapidly testing the genetic susceptibility of subjects to type-2 by targeting determinative genetic factors of genetic susceptibility to type-2 diabetes.

Abstract: The invention provides for a method to inhibit the binding between the p85 and p110 subunits of said PI3-kinase and thus a method to modulate PI3-kinase activity and modulate the response of cells to external stimuli. In particular, disabling, by conventional means, residues located in the inter-SH2 domain of said p85 subunit, specifically a region containing amino acid residue 478 to amino acid residue 513 of p85.alpha. subunit, or amino acid residue 445 to amino acid residue 485 of p85.beta. subunit of said PI3-kinase. Interference with these binding regions will affect binding between the subunits and results in inhibiting PI3-kinase activity. This invention further relates to a methods to modulate the serine kinase activity of the PI3-kinase which can be achieved by disabling the DRHNSN sequence of the p110 subunit and can also be used to effect changes in overall PI3-kinase activity. This invention is further related to an (ant)agonist which affects serine kinase activity of PI3-kinase.