Abstract: An automated driving assistance apparatus assists automated driving control of a passenger car, and includes a driver monitoring unit and a manual driving recovery level setting unit. The driver monitoring unit monitors the state of the driver that is driving the passenger car. The manual driving recovery level setting unit sets, in a stepwise manner, a level indicating whether or not a switch can be made from automated driving to manual driving in a predetermined switching zone, based on the state of the driver detected by the driver monitoring unit.

Abstract: An image pickup device, an image pickup device program and an image pickup method are disclosed, in which an image is picked up by setting the image pickup conditions suitable for an object, and the face image thus picked up can be easily corrected in accordance with the characteristics and preferences of the object. Once a shutter button is pressed halfway and a line-of-sight sensor 14 confirms that the line of sight of a photographer is set, a CPU 5 generates a preview image, and upon detection of the face image, infers the race, age and sex of the object using the feature amount of the face image. Further, image pickup parameters suitable for the inference result and the measurement of a length measuring sensor 13 are set, and the main image pickup process is executed under the image pickup conditions corresponding to the parameters.

Abstract: An image creating apparatus for creating plural kinds of images which are different in each image class about brushwork and expression based on data of a single image, which includes a face component library (11) and a rule library (12). The face component library (11) is composed of image libraries (11a to 11g) of the respective face components such as eyes, noses, mouths and so forth each of which stores a plurality of image groups of the respective face components having different image elements in each of image classes “i=1 to n”. An eye image library 11a stores an image group composed by a plurality of eye images having different image elements about slant and roundness for each image class. The image elements are an item for measurement about character quantities extracted from the entered image data.

Abstract: Printed circuit board suitable for the high densification of mounting parts using a solder bump and having improved connection and mounting reliability, wherein the printed circuit board includes a mounting pad provided with a solder bump by covering the mounting surface with a solder resist, and a position of forming the solder bump is arranged so as to match with a position of the viahole, or a size of the opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not be overlap the solder resist with the viahole.

Abstract: This invention is to provide a printed circuit board suitable for the high densification of mounting parts using a solder bump and for the improvements of connection reliability and mounting reliability, and proposes a printed circuit board comprising a mounting pad provided with a solder bump by covering a mounting surface with a solder resist, characterized in that a position of forming the solder bump is arranged so as to match with a position of a viahole, or a size of opening portion formed in the solder resist is made larger than a size of a land of the viahole so as not to overlap the solder resist with the viahole.

Abstract: The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Abstract: Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.