Abstract: There is provided a technique that includes: (a) supplying a first gas containing a group XIV element to a substrate on which a film containing the group XIV element is formed such that reaction by-products generated by reaction with the group XIV element contained in the film formed on the substrate are saturated and adsorbed on the substrate; (b) supplying a second gas containing a halogen after (a); and (c) etching the film containing the group XIV element formed on the substrate by alternately repeating (a) and (b).

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: A thermal head for a thermal recording machine including an insulating substrate which is composed of a printed circuit board made of a heat resistant resin and covered with a copper film, a plurality of thermal resistors disposed on the insulating substrate in the direction corresponding to the scanning, discrete electrodes electrically connecting first ends of the thermal resistors to a control element, a common electrode electrically connecting the other ends of the thermal resistors together, a heat releasing layer formed of the copper film of the insulating substrate on the lower portions of the thermal resistors, and a thermal accumulating layer of a polyimide resin covering the heat releasing layer.

Abstract: A method of manufacturing a thermal printing head includes forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a large number of lead electrodes are formed beforehand in such a manner that the lead electrodes are separated from the common electrodes by a predetermined distance and are disposed on one side of the common electrodes in a vertical direction. It further includes performing a first etching on the layer of polyimide resin precursor such that a predetermined pattern is formed.