Patents by Inventor Masato NAKAGOMI

Masato NAKAGOMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11866564
    Abstract: The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 ?m and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 ?m in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface, Requirement (a1): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: January 9, 2024
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya Ekinaka, Tatsuichirou Kon, Hiroshi Kishimoto, Yume Takeda, Takehiro Suga, Satoshi Ogata, Masato Nakagomi
  • Patent number: 11028284
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: June 8, 2021
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya Ekinaka, Tatsuichirou Kon, Takehiro Suga, Hiroshi Kishimoto, Yume Morita, Satoshi Ogata, Masato Nakagomi
  • Publication number: 20200377682
    Abstract: The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 ?m and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 ?m in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface, Requirement (a1): when the chemical composition is represented by SiOxCyHz, x falls within the range 1.93-1.98, y falls within the range 0.04-0.15 and z falls within the range 0.10-0.50.
    Type: Application
    Filed: March 28, 2018
    Publication date: December 3, 2020
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya EKINAKA, Tatsuichirou KON, Hiroshi KISHIMOTO, Yume TAKEDA, Takehiro SUGA, Satoshi OGATA, Masato NAKAGOMI
  • Publication number: 20180265731
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 20, 2018
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya EKINAKA, Tatsuichirou KON, Takehiro SUGA, Hiroshi KISHIMOTO, Yume MORITA, Satoshi OGATA, Masato NAKAGOMI
  • Patent number: 9758630
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: September 12, 2017
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou Kon, Tatsuya Ekinaka, Hiroshi Kishimoto, Yume Morita, Takehiro Suga, Satoshi Ogata, Masato Nakagomi
  • Publication number: 20170107345
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Application
    Filed: March 27, 2015
    Publication date: April 20, 2017
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou KON, Tatsuya EKINAKA, Hiroshi KISHIMOTO, Yume MORITA, Takehiro SUGA, Satoshi OGATA, Masato NAKAGOMI