Abstract: The present invention provides an anisotropic conductive film for testing an electronic component, which comprises a film substrate comprising an insulating resin and plural conductive paths insulated from each other and penetrating the film substrate in the thickness direction, preferably, an anisotropic conductive film wherein the plural conductive paths are disposed in a houndstooth check pattern and the distance between conductive paths between adjacent rows of conductive paths is smaller than the distance between conductive paths within a row of conductive paths. In another preferable embodiment, the insulating resin comprises a naphthalene skeleton epoxy resin crosslinked with a phenol resin and an acrylic rubber, and both ends of the plural conductive paths are exposed on both the front and the back surfaces of the film substrate.

Abstract: The present invention aims at providing a method of producing a highly reliable anisotropic conductive film having conductive paths disposed at a narrow pitch and comparatively highly protruding from the principal plane of a film substrate, which is free of a short-circuit (contact) of the ends of adjacent conductive paths and an unprotruded conductive path. The production method of the present invention includes preparing a structural precursor wherein plural conductive paths 52 comprising conductive wires penetrate a film substrate 51 made from an insulating polymer in the thickness direction thereof, while being insulated from each other and the end face of each conductive path 52 is present in the same plane as the principal plane of the film substrate 51, and applying a reactive ion etching to the principal plane of the film substrate 51 to allow the ends 52a, 52b of the conductive path 52 to protrude from the principal planes 51a, 51b of the film substrate 51.

Abstract: The present invention provides an anisotropic conductive film for testing an electronic component, which comprises a film substrate comprising an insulating resin and plural conductive paths insulated from each other and penetrating the film substrate in the thickness direction, preferably, an anisotropic conductive film wherein the plural conductive paths are disposed in a houndstooth check pattern and the distance between conductive paths between adjacent rows of conductive paths is smaller than the distance between conductive paths within a row of conductive paths. In another preferable embodiment, the insulating resin comprises a naphthalene skeleton epoxy resin crosslinked with a phenol resin and an acrylic rubber, and both ends of the plural conductive paths are exposed on both the front and the back surfaces of the film substrate.

Abstract: An epoxy resin composition for encapsulating a photosemi-conductor element excellent in releasing property from a mold in forming and in adhesion to the photosemi conductor element is provided. The epoxy resin composition comprises element comprising the following components (A) to (D): (A) an epoxy resin; (B) a hardener; (C) a silane coupling agent having an epoxy group, a mercapto group or an amino group; and (D) a releasing agent in which a molecule thereof has structure moieties represented by the following general formulas (1) and (2) and in which the weight ratio of the structure moiety represented by general formula (2) is 25% to 95% by weight based on the whole molecule, &Parenopenst;CH2CH2&Parenclosest;m  (1)  wherein m is a positive integer of 8 to 100 and &Parenopenst;CH2CH2O&Parenclosest;n  (2)  wherein n is a positive integer.