Abstract: According to one embodiment, a programmable logic switch includes first and second word lines above a first path transistor, a first pillar passing through the first and second word lines and connected to the first path transistor, a second pillar passing through the first and second word lines and connected to the first path transistor, a first memory device between the first pillar and the first word line, a second memory device between the first pillar and the second word line, a third memory device between the second pillar and the first word line, and a fourth memory device between the second pillar and the second word line.

Abstract: A reconfigurable integrated circuit device includes a memory unit for storing configuration information. The memory unit has a nonvolatile memory transistor having a gate connected to a first wire, a first terminal connected to a second wire, and a second terminal connected to a third wire. The memory unit also includes a switch circuit connected to the third wire. The switch circuit alters the configuration of the integrated circuit device by, for example, opening and closing to make wiring connections or disconnections. The integrated circuit device additionally includes a data supply circuit for supplying bit data and a first power supply circuit for supplying voltages to the first wire for storing bit data in the first nonvolatile memory transistor and for storing bit data as a charge level on the third wire.

Abstract: A circuit according to embodiments includes: a plurality of bit-string comparators each of which includes a plurality of single-bit comparators each of which includes first and second input terminals, first and second match-determination terminals, and a memory storing data and inverted data in a pair, the first input terminal being connected to a respective search line, the second input terminal being connected to an inverted search line being paired with the respective search line, and a matching line connecting the first and second match-determination terminals of the single-bit comparators; a pre-charge transistor of which source is connected to a supply voltage line; a common matching line connected to a drain of the pre-charge transistor and the matching lines of the bit-string comparators; and an output inverter of which input is connected to the common matching line.

Abstract: A memory circuit according to an embodiment includes: a first transistor including a first source/drain electrode, a second source/drain electrode, and a first gate electrode; a second transistor including a third source/drain electrode connected to the second source/drain electrode, a fourth source/drain electrode, and a second gate electrode; a third transistor and a fourth transistor forming an inverter circuit, the third transistor including a fifth source/drain electrode, a sixth source/drain electrode, and a third gate electrode connected to the second source/drain electrode, the fourth transistor including a seventh source/drain electrode connected to the sixth source/drain electrode, an eighth source/drain electrode, and a fourth gate electrode connected to the second source/drain electrode; and an output terminal connected to the sixth source/drain electrode.

Abstract: One embodiment provides a semiconductor integrated circuit, including: a substrate; a plurality of nonvolatile memory portions formed in the substrate, each including a first nonvolatile memory and a second nonvolatile memory; and a plurality of logic transistor portions formed in the substrate, each including at least one of logic transistor, wherein the logic transistors include: a first transistor which is directly connected to drains of the first and second nonvolatile memories at its gate; and a second transistor which is not directly connected to the drains of the first and second nonvolatile memories, and wherein a bottom surface of the gate of each of the logic transistors sandwiching the first and second nonvolatile memories is lower in height from a top surface of the substrate than a bottom surface of the control gate of each of the first and second nonvolatile memories.

Abstract: In one embodiment, a method for implementing a circuit design for an integrated circuit includes: (a) obtaining a first wiring to satisfy a given operating frequency; (b) calculating a maximum bypass wiring length based on the given operating frequency and a critical path of the first wiring; (c) obtaining a second wiring by bypassing the first wiring using wires other than wires of the first wiring in a first wiring group, wherein wiring of the integrated circuit is categorized into a plurality of wiring groups, and the first wiring is included in the first wiring group of the categorized wiring groups; and (d) replacing the first wiring with the second wiring, if a difference between the second wiring and the first wiring is not larger than the maximum bypass wiring length, and not replacing the first wiring if said difference is larger than the maximum bypass wiring length.

Abstract: According to one embodiment, a configuration memory includes first and second data lines, a first memory string which comprises at least first and second nonvolatile memory transistors which are connected in series between a common node and the first data line, a second memory string which comprises at least third and fourth nonvolatile memory transistors which are connected in series between the common node and the second data line, and a flip-flop circuit which comprises a first data holding node connected to the common node and a second data holding node connected to a configuration data output node.

Abstract: One embodiment provides a semiconductor integrated circuit, including: a first input wire; a second input wire; a first look-up table (LUT) comprising: a plurality of first memories; a first number of first switches connected to the first input wire; and a second number of second switches connected to the second input wire, the second number being less than the first number, the first LUT being configured to output information which is stored in one of the first memories; and a second LUT including: a plurality of second memories; a third number of third switches connected to the second input wire; and a fourth number of fourth switches connected to the first input wire, the fourth number being less than the third number, the second LUT being configured to output information which is stored in one of the second memories.

Abstract: According to one embodiment, a programmable logic switch includes first and second word lines above a first path transistor, a first pillar passing through the first and second word lines and connected to the first path transistor, a second pillar passing through the first and second word lines and connected to the first path transistor, a first memory device between the first pillar and the first word line, a second memory device between the first pillar and the second word line, a third memory device between the second pillar and the first word line, and a fourth memory device between the second pillar and the second word line.

Abstract: One embodiment provides a look-up table circuit, including: 2i memories, a half of which constituting a first memory group, the other half of which constituting a second memory group; first to i-th input terminals to which first to i-th input signals are input, respectively; a first output terminal; a switch group that selectively connects one of the memories to the first output terminal according to the first to i-th input signals; a first power-off switch that shuts off power supply to the first memory group in response to one of the first to i-th input signals; and a second power-off switch that shuts off power supply to the second memory group in response to the one of the first to i-th input signals.

Abstract: A memory circuit according to an embodiment includes: a plurality of memory cells each having one pair of first and second nonvolatile memory circuits, each of the first and second nonvolatile memory circuits in each memory cell being capable of making a transition between a high resistance state and a low resistance state, and in a state in which one memory cell in the plurality of memory cells has information stored therein, one of the first and second nonvolatile memory circuits in the one memory cell being in a high resistance state whereas the other being in a low resistance state.

Abstract: A carbon dioxide recovery system according to the present embodiments includes: an absorber bringing exhaust gas containing carbon dioxide into contact with absorbent reversibly absorbing or releasing carbon dioxide at above or below a predetermined temperature, and making the absorbent absorb carbon dioxide in the exhaust gas; a regenerator releasing carbon dioxide in the absorbent by heating the absorbent absorbing carbon dioxide at the absorber; a reflux pipeline flowing back the absorbent regenerated at the regenerator to the absorber; and a filter introducing at least a part of the absorbent, removing solids accumulated in the introduced absorbent, and returning the absorbent after the solids are removed to a vicinity of a portion where the absorbent is introduced.

Abstract: In one embodiment, a semiconductor integrated circuit has memory cells. Each of the memory cells has non-volatile memories and switching elements. The non-volatile memories and switching elements are connected in series between a first power source and a second power source. Output wirings of at least two of the memory cells are connected to each other. Input wirings are connected with control gates of the switching elements included in each of the at least two memory cells. A plurality of the switching elements included in one of the at least two of the memory cells is turned off, when an input signal or an inverted signal is inputted. Further, another plurality of the switching elements included in another one of the at least two of memory cells other than the one of the memory cells is turned on, when the input signal or the inverted signal is inputted.

Abstract: One embodiment provides a programmable logic switch in which a first nonvolatile memory and a second nonvolatile memory are formed in the same well, and in which to change the first nonvolatile memory from an erased state to a written state and leave the second nonvolatile memory being in the erased state, a first write voltage is applied to a first line connected with gate electrodes of the first and second nonvolatile memories, a second write voltage is applied to a second line connected to a source in the first nonvolatile memory, and a third write voltage lower than the second write voltage is applied to a fourth line connected to a source of the second nonvolatile memory.

Abstract: A semiconductor integrated circuit in an embodiment includes a first circuit group that includes at least one first logic block and a second circuit group that includes second logic blocks. The number of the second logic blocks is greater than the number of the first logic blocks. The first circuit group includes a first switching block and a first power control circuit. The first power control circuit commonly controls a start of power supply and a stop of the power supply for the first logic block and the first switching block. The second circuit group includes second switching blocks and a second power control circuit. The second power control circuit commonly controls a start of power supply and a stop of the power supply for the second logic blocks and the second switching blocks.

Abstract: In one embodiment, a method for implementing a circuit design for an integrated circuit includes: (a) obtaining a first wiring to satisfy a given operating frequency; (b) calculating a maximum bypass wiring length based on the given operating frequency and a critical path of the first wiring; (c) obtaining a second wiring by bypassing the first wiring using wires other than wires of the first wiring in a first wiring group, wherein wiring of the integrated circuit is categorized into a plurality of wiring groups, and the first wiring is included in the first wiring group of the categorized wiring groups; and (d) replacing the first wiring with the second wiring, if a difference between the second wiring and the first wiring is not larger than the maximum bypass wiring length, and not replacing the first wiring if said difference is larger than the maximum bypass wiring length.

Abstract: A memory circuit according to an embodiment includes: a first transistor including a first source/drain electrode, a second source/drain electrode, and a first gate electrode; a second transistor including a third source/drain electrode connected to the second source/drain electrode, a fourth source/drain electrode, and a second gate electrode; a third transistor and a fourth transistor forming an inverter circuit, the third transistor including a fifth source/drain electrode, a sixth source/drain electrode, and a third gate electrode connected to the second source/drain electrode, the fourth transistor including a seventh source/drain electrode connected to the sixth source/drain electrode, an eighth source/drain electrode, and a fourth gate electrode connected to the second source/drain electrode; and an output terminal connected to the sixth source/drain electrode.

Abstract: In one embodiment, a semiconductor integrated circuit has memory cells. Each of the memory cells has non-volatile memories and switching elements. The non-volatile memories and switching elements are connected in series between a first power source and a second power source. Output wirings of at least two of the memory cells are connected to each other. Input wirings are connected with control gates of the switching elements included in each of the at least two memory cells. A plurality of the switching elements included in one of the at least two of the memory cells is turned off, when an input signal or an inverted signal is inputted. Further, another plurality of the switching elements included in another one of the at least two of memory cells other than the one of the memory cells is turned on, when the input signal or the inverted signal is inputted.

Abstract: In an air conditioner having a main body provided with a panel 1 including a front panel 1a and a top panel 1b, the main body incorporating an air passage connecting an air inlet 2 and an air outlet 3, an air filter 4, a heat exchanger 5, a blower fan 6, and a dedusting device 7 attached to the front face of the air filter 4 which is reciprocated along the surface of the air filter 4, the top panel 1b is opened/closed as the dedusting device 7 is reciprocated.

Abstract: A carbon dioxide recovery system according to the present embodiments includes: an absorber bringing exhaust gas containing carbon dioxide into contact with absorbent reversibly absorbing or releasing carbon dioxide at above or below a predetermined temperature, and making the absorbent absorb carbon dioxide in the exhaust gas; a regenerator releasing carbon dioxide in the absorbent by heating the absorbent absorbing carbon dioxide at the absorber; a reflux pipeline flowing back the absorbent regenerated at the regenerator to the absorber; and a filter introducing at least a part of the absorbent, removing solids accumulated in the introduced absorbent, and returning the absorbent after the solids are removed to a vicinity of a portion where the absorbent is introduced.