Patents by Inventor Masato OHMURA

Masato OHMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11606964
    Abstract: Breadcrumbs have a grain size distribution in which the proportion of a fraction of breadcrumbs that have a grain size 2.36 mm is 8-21 mass % and the proportion of a fraction of breadcrumbs that have a grain size ?1.18 mm is ?45 mass %, and have a bulk density of 270-600 ml/100 g. A breadcrumb powder shaker container includes: the breadcrumbs or breadcrumb mix; and a shaker container containing a breadcrumb powder to be shaken out including the breadcrumbs or the breadcrumb mix, the shaker container having a shake-out hole. The shake-out hole has a maximum diametric length of 10-55 mm. This enables simply applying the breadcrumbs or the breadcrumb mix directly to a food material, enabling a high-quality cooked breadcrumb-coated food item, while retaining the flavor of the food material to a high level irrespective of the amount of oil used in deep frying.
    Type: Grant
    Filed: February 16, 2018
    Date of Patent: March 21, 2023
    Assignee: NISSHIN SEIFUN WELNA INC.
    Inventors: Masato Ohmura, Shuhei Yamazaki, Michihiro Sakakibara
  • Publication number: 20190373927
    Abstract: Breadcrumbs have a grain size distribution in which the proportion of a fraction of breadcrumbs that have a grain size 2.36 mm is 8-21 mass % and the proportion of a fraction of breadcrumbs that have a grain size ?1.18 mm is ?45 mass %, and have a bulk density of 270-600 ml/100 g. A breadcrumb powder shaker container includes: the breadcrumbs or breadcrumb mix; and a shaker container containing a breadcrumb powder to be shaken out including the breadcrumbs or the breadcrumb mix, the shaker container having a shake-out hole. The shake-out hole has a maximum diametric length of 10-55 mm. This enables simply applying the breadcrumbs or the breadcrumb mix directly to a food material, enabling a high-quality cooked breadcrumb-coated food item, while retaining the flavor of the food material to a high level irrespective of the amount of oil used in deep frying.
    Type: Application
    Filed: February 16, 2018
    Publication date: December 12, 2019
    Inventors: Masato OHMURA, Shuhei YAMAZAKI, Michihiro SAKAKIBARA
  • Publication number: 20190014801
    Abstract: Modified wheat flour for use in the preparation of coated fried food includes a heat treated product of unmodified wheat flour and having an RVA peak viscosity of 3500 to 7000 mPa·s and a gelatinization onset temperature lower than that of the unmodified wheat flour by at least 10° C. The unmodified wheat flour preferably has a gelatinization onset temperature of 70° to 86° C. The unmodified wheat flour preferably has an RVA peak viscosity of 3000 to 5000 mPa·s. The modified wheat flour has good water dispersibility and provides coated fried foods having a crispy coating.
    Type: Application
    Filed: February 2, 2017
    Publication date: January 17, 2019
    Applicant: NISSHIN FOODS INC.
    Inventors: Ryosuke FUJIMURA, Masato OHMURA, Souichiro HIWATASHI, Michihiro SAKAKIBARA
  • Patent number: 9743677
    Abstract: A wheat flour for deep-fried food crusts is obtained by subjecting a mixture including a wheat flour and from 0.05 to 0.5 parts by mass of an emulsifier with respect to 100 parts by mass of the wheat flour to a heating treatment for 1 to 20 seconds under a condition where the temperature of the mixture is from 65 to 99° C. The emulsifier is at least one type of emulsifier selected from sucrose fatty acid esters and lecithin. The blending ratio of the emulsifier is preferably from 0.1 to 0.45 parts by mass with respect to 100 parts by mass of the wheat flour. The wheat flour has an average grain size of preferably less than 100 ?m. A crust material for deep-fried foods including the aforementioned wheat flour for deep-fried food crusts, and a tempura flour including the aforementioned wheat flour for deep-fried food crusts are also described.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: August 29, 2017
    Assignee: NISSHIN FOODS INC.
    Inventors: Masato Ohmura, Yasuyuki Yoshioka, Michihiro Sakakibara, Shinichi Fukudome, Koji Ishizuka, Satomi Nozaki, Miwa Takahashi
  • Publication number: 20160205950
    Abstract: A wheat flour for deep-fried food crusts is obtained by subjecting a mixture including a wheat flour and from 0.05 to 0.5 parts by mass of an emulsifier with respect to 100 parts by mass of the wheat flour to a heating treatment for 1 to 20 seconds under a condition where the temperature of the mixture is from 65 to 99° C. The emulsifier is at least one type of emulsifier selected from sucrose fatty acid esters and lecithin. The blending ratio of the emulsifier is preferably from 0.1 to 0.45 parts by mass with respect to 100 parts by mass of the wheat flour. The wheat flour has an average grain size of preferably less than 100 ?m. A crust material for deep-fried foods including the aforementioned wheat flour for deep-fried food crusts, and a tempura flour including the aforementioned wheat flour for deep-fried food crusts are also described.
    Type: Application
    Filed: February 26, 2014
    Publication date: July 21, 2016
    Applicant: NISSHIN FOODS INC.
    Inventors: Masato OHMURA, Yasuyuki YOSHIOKA, Michihiro SAKAKIBARA, Shinichi FUKUDOME, Koji ISHIZUKA, Satomi NOZAKI, Miwa TAKAHASHI