Abstract: An epoxy resin composition used as a structural bonding agent is provided. Specifically, used is an epoxy resin composition containing an epoxy resin (A) having an epoxy equivalent of 500 to 10,000 g/eq represented by the formula (1) below: wherein, Ar is an aromatic ring, X is a structural unit having an alkylene chain, Y is a structural unit having a polyether chain, R11 and R12 are a glycidyl ether group or a 2-methylglycidyl ether group, R13 and R14 are a hydroxyl group, a glycidyl ether group, or a 2-methylglycidyl ether group, R15 and R16 are a hydrogen atom or a methyl group, m1 and m2 are 0 to 25, and m1+m2?1, p1 and p2 are 0 to 5, and q is 0.5 to 5, an epoxy resin (B) having an epoxy equivalent of 100 to 300 g/eq, and thermally expandable particles (C).

Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

Abstract: The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

Abstract: Provided is a molybdenum sulfide that is ribbon-shaped and particularly suitable for a hydrogen generation catalyst. Disclosed are a ribbon-shaped molybdenum sulfide, in which 50 particles as measured by observation with a scanning electron microscope (SEM) have a shape of, on average, 500 to 10000 nm in length, 10 to 1000 nm in width, and 3 to 200 nm in thickness; a method for producing the ribbon-shaped molybdenum sulfide, including: (1) heating a molybdenum oxide at a temperature of 200 to 1000° C. in the presence of a sulfur source; or (2) heating a molybdenum oxide at a temperature of 100 to 800° C. in the absence of a sulfur source, and then heating the molybdenum oxide at a temperature of 200 to 1000° C. in the presence of a sulfur source; and a hydrogen generation catalyst including the ribbon-shaped molybdenum sulfide.

Abstract: A molybdenum sulfide powder according to the invention contains molybdenum disulfide having a 3R crystal structure. A heavy-metal adsorbent according to the invention contains molybdenum sulfide particles, and the molybdenum sulfide particles have a median diameter Dso of 10 nm to 1,000 nm obtained by a dynamic light scattering type particle diameter distribution measuring device. A photothermal conversion material according to the invention contains a material containing molybdenum sulfide particles and generates heat by absorbing light energy.

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having the layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

Abstract: The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

Abstract: Provided is a molybdenum sulfide that is ribbon-shaped and particularly suitable for a hydrogen generation catalyst. Disclosed are a ribbon-shaped molybdenum sulfide, in which 50 particles as measured by observation with a scanning electron microscope (SEM) have a shape of, on average, 500 to 10000 nm in length, 10 to 1000 nm in width, and 3 to 200 nm in thickness; a method for producing the ribbon-shaped molybdenum sulfide, including: (1) heating a molybdenum oxide at a temperature of 200 to 1000° C. in the presence of a sulfur source; or (2) heating a molybdenum oxide at a temperature of 100 to 800° C. in the absence of a sulfur source, and then heating the molybdenum oxide at a temperature of 200 to 1000° C. in the presence of a sulfur source; and a hydrogen generation catalyst including the ribbon-shaped molybdenum sulfide.

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve the object.

Abstract: The invention provides an epoxy compound A represented by the following formula (1): in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R3 to R8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R3 to R8 is a glycidyl ether group or a 2-methylglycidyl ether group; R9 to R12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p1, p2, and q are average values of repetition, m is 0.5 to 10, p1 and p2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

Abstract: Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound represented by the following Formula (1) in which n and m each independently represent an integer from 1 to 5; Aly represents a group containing a substituted or unsubstituted allyl group and represented by the following Formula (2) (in Formula (2), Z represents a direct bond or a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent; and R1, R2, and R3 each independently represent a hydrogen atom or a methyl group); MI represents a maleimide group represented by the following Formula (3) (in Formula (3), R4 and R5 each independently represent a hydrogen atom or a methyl group); and A represents a structure having two benzene rings and represented by the following Formula (4-1) or (4-2) (each benzene ring may have a substituent; and X represents a direct bond or a divalent linking group):

Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

Abstract: An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

Abstract: The present invention provides an oxazine compound which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon double bond structure so as to achieve an object. The present invention further provides a composition containing the oxazine compound of the present invention, a cured product containing the composition, and a laminate having the cured product layer. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention so as to achieve an object.

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.

Abstract: The present invention provides an oxazine compound having a specific structure, which contains a group having an aromatic ring structure and a plurality of specified carbon-carbon triple bond structure. The present invention further provides a composition containing the oxazine compound having a specific structure of the present invention, a cured product containing the composition, and a laminate having a layer of the cured product. The present invention further still provides a composition for a heat-resistant material and a composition for an electronic material, which contain the composition containing the oxazine compound of the present invention.