Abstract: A method for producing an electronic device 1 includes: a preparation step of preparing a substrate 2 with an electrode having a first electrode layer 20 on a substrate 10, where the first electrode layer includes a first conductive layer 21 and a second conductive layer 22 disposed on the first conductive layer, and an eaves part 24 in which the second conductive layer projects outside the first conductive layer is formed in at least a part of a predetermined region A of an edge of the first electrode layer when viewed from a thickness direction of the substrate; a device functional part forming step of forming a device functional part 30 on the first electrode layer; a second electrode layer forming step of forming a second electrode layer on the device functional part so that a part of the second electrode layer is disposed on the predetermined region; and a non-conductive part forming step of forming a non-conductive part 40 on the at least a part of the predetermined region before the second electrode la

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: An organic EL element includes a support substrate, an organic EL portion that is disposed on the support substrate and is formed by stacking a first electrode layer, an organic functional layer, and a second electrode layer, a sealing member that seals the organic EL portion, and one or more moisture absorbing portions that have moisture absorption characteristics. The moisture absorbing portion is disposed in an outer edge portion of a light emitting area of the organic EL portion in which the first electrode layer, the organic functional layer, and the second electrode layer are sequentially continuously superimposed when viewed in a stacking direction of the organic EL portion. An area of the moisture absorbing portion disposed on the light emitting area is smaller than an area of the light emitting area.

Abstract: A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20° C. to a melting point of a parent resin of the flexible base material.

Abstract: A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.

Abstract: A method for producing an organic device 1, includes: first forming steps S02 and S03 of producing a support substrate 10 with an organic functional layer; a winding step S05 of winding the support substrate 10 with an organic functional layer and a protective film 13; a peeling step S06 of feeding out the protective film 13 and the support substrate 10 have been wound in, and peeling off the protective film 13; a heating step S07 of heating the support substrate 10 with an organic functional layer after the peeling step S06; and a second forming step S08 of forming at least one layer selected from the second electrode layer 9 and an organic functional layer 7 not formed in the first forming step S03 and being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S07.

Abstract: A method of manufacturing an organic EL element (1) includes: a step of forming a first electrode layer (5), an organic functional layer (7), and a second electrode layer (9) on a substrate (3), a step of detecting a defective portion after forming the second electrode layer (9), a step of removing the second electrode layer (9) in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer (9) side when the defective portion has been detected, and a step of forming a sealing layer (11) after removing the second electrode layer 9 in the defective portion.

Abstract: A manufacturing method of an organic electronic device of the present invention, includes: a removing step of removing a volatile component from a flexible base material; a fixing step of fixing the flexible base material onto a support substrate via an adhesive layer; and a forming step of forming a device main body sequentially including a first electrode layer, at least one organic functional layer, and a second electrode layer on the flexible base material that is fixed onto the support substrate, on a side opposite to the support substrate, in this order, in which a vapor pressure of the volatile component is greater than or equal to 101325 Pa within a temperature range from 20° C. to a melting point of a parent resin of the flexible base material.

Abstract: A method for producing an organic device 1, includes: first forming steps S02 and S03 of producing a support substrate 10 with an organic functional layer; a winding step S05 of winding the support substrate 10 with an organic functional layer and a protective film 13; a peeling step S06 of feeding out the protective film 13 and the support substrate 10 have been wound in, and peeling off the protective film 13; a heating step S07 of heating the support substrate 10 with an organic functional layer after the peeling step S06; and a second forming step S08 of forming at least one layer selected from the second electrode layer 9 and an organic functional layer 7 not formed in the first forming step S03 and being one of the organic functional layers comprising the multiple organic functional layers, after the heating step S07.

Abstract: According to a method for manufacturing an organic electronic device, a sealing member (19) that includes a sealing substrate (15), an adhesive part (13) exhibiting adhesiveness and is provided on the sealing substrate (15), and a hygroscopic part (11) being a hygroscopic cured product provided on the adhesive part (13) is bonded to an organic electronic element (17).

Abstract: An organic electroluminescent device comprising: a transparent support substrate having flexibility; a light emitting element disposed on the transparent support substrate and including a pair of electrodes and a luminescent layer disposed between the pair of electrodes; a sealing material layer disposed on the transparent support substrate so as to cover and seal the light emitting element; and a sealing substrate disposed on the sealing material layer, wherein based on an arithmetic average of roughness profile defined in JIS B 0601-1994, the surface roughness of a surface of the sealing substrate beside the sealing material layer has a smaller value than the surface roughness of the other surface of the sealing substrate, and the arithmetic average of roughness profile of the surface of the sealing substrate beside the sealing material layer and a thickness of the sealing material layer satisfy a requirement represented by the following formula (I): 0.002<(Ra/t)<0.

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: An organic EL element comprises a supporting substrate 12 having a first side surface 12b and a second side surface 12c located opposite to the first side surface in the first direction, a first electrode-attached on the supporting substrate, an organic EL body 16 disposed on the first electrode, a second electrode 18 disposed extending from the first side surface to the second side surface and covering at least a part of the organic EL body, and a sealing member disposed on the second electrode, extending from the first side surface to the second side surface and sealing at least the organic EL body, each of the side surfaces 18a and 20a of the second electrode and the sealing member on the first side surface-side being made evened with the first side surface, and each of the side surfaces 18b and 20b of the second electrode and the sealing member on the second side surface-side being made evened with the second side surface, in the first direction.

Abstract: A production method for an organic EL element includes a step of forming an organic EL section on an organic EL section arrangement area in a first electrode section while conveying an electrode-attached substrate in a first direction, a step of forming a band-shaped conductive film along the first direction to cover the organic EL section and at least a part of an external connection area in the first electrode section while conveying the electrode-attached substrate on which the organic EL section is formed in the first direction, and a step of forming a groove section that separates the conductive film into a first part and a second part being a second electrode section by removing the conductive film in a predetermined area in a second direction while conveying the electrode-attached substrate on which the conductive film is formed in the first direction, and extends in the first direction.

Abstract: An organic EL element includes a support substrate, an organic EL portion that is disposed on the support substrate and is formed by stacking a first electrode layer, an organic functional layer, and a second electrode layer, a sealing member that seals the organic EL portion, and one or more moisture absorbing portions that have moisture absorption characteristics. The moisture absorbing portion is disposed in an outer edge portion of a light emitting area of the organic EL portion in which the first electrode layer, the organic functional layer, and the second electrode layer are sequentially continuously superimposed when viewed in a stacking direction of the organic EL portion. An area of the moisture absorbing portion disposed on the light emitting area is smaller than an area of the light emitting area.

Abstract: According to a method for manufacturing an organic electronic device, a sealing member (19) that includes a sealing substrate (15), an adhesive part (13) exhibiting adhesiveness and is provided on the sealing substrate (15), and a hygroscopic part (11) being a hygroscopic cured product provided on the adhesive part (13) is bonded to an organic electronic element (17).

Abstract: A method of manufacturing an organic EL element (1) includes: a step of forming a first electrode layer (5), an organic functional layer (7), and a second electrode layer (9) on a substrate (3), a step of detecting a defective portion after forming the second electrode layer (9), a step of removing the second electrode layer (9) in the defective portion by irradiating the defective portion with a laser beam (L) from the second electrode layer (9) side when the defective portion has been detected, and a step of forming a sealing layer (11) after removing the second electrode layer 9 in the defective portion.

Abstract: A method for manufacturing an organic electronic element according to one embodiment is a method for manufacturing an organic electronic element 1A having an organic functional layer and includes: a substrate drying step S10 of heating and drying a plastic substrate 10 containing moisture; and an element body formation step S20 of forming an element body 20 including the organic functional layer on the plastic substrate dried in the substrate drying step. The plastic substrate is heated with an infrared ray by irradiating the plastic substrate with the infrared ray in the substrate drying step, and an integral value of a first wavelength range of 1.2 ?m to 5.0 ?m is larger than an integral value of a second wavelength range of 5.0 ?m to 10.0 ?m in a radiation spectrum of the infrared ray.

Abstract: An organic electroluminescent device comprising: a transparent support substrate having flexibility; a light emitting element disposed on the transparent support substrate and including a pair of electrodes and a luminescent layer disposed between the pair of electrodes; a sealing material layer disposed on the transparent support substrate so as to cover and seal the light emitting element; and a sealing substrate disposed on the sealing material layer, wherein based on an arithmetic average of roughness profile defined in JIS B 0601-1994, the surface roughness of a surface of the sealing substrate beside the sealing material layer has a smaller value than the surface roughness of the other surface of the sealing substrate, and the arithmetic average of roughness profile of the surface of the sealing substrate beside the sealing material layer and a thickness of the sealing material layer satisfy a requirement represented by the following formula (I): 0.002<(Ra/t)<0.

Abstract: An organic light-emitting device comprises an anode; a hole injection layer in contact with the anode; a light-emitting layer over the hole injection layer; and a cathode over the light-emitting layer, wherein the hole injection layer comprises an organic semiconductor material doped with a partially fluorinated fullerene such as C60. The dopant is present in the range of about 0.1-20 wt %, optionally 0.1-5 wt %. The organic semiconductor is preferably a polymer comprising repeat units of formula (I): wherein Ar1 and Ar2 in each occurrence are independently selected from optionally substituted aryl or heteroaryl groups; n is greater than or equal to 1, preferably 1 or 2; R is H or a substituent; any of Ar1, Ar2 and R may be linked by a direct bond or linking group; and x and y are each independently 1, 2 or 3.