Abstract: An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.

Abstract: A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.

Abstract: A low-profile connector for connecting two circuit boards of a-mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.

Abstract: A low-profile connector for connecting two circuit boards of mobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts (conductive terminals) provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.

Abstract: A low-profile connector for connecting two circuit boards of a emobile equipment is constituted by a header and a socket. The header comprises a resin molded header body and a plurality of pairs of posts provided on the header body. The socket comprises a resin molded socket body and a plurality of sets of contacts provided on the socket body corresponding to the posts of the header. The header body and the socket body respectively have reinforcing member made of metal thin plate for reinforcing the header and the socket with respect to contortion or crack. Top end of the post is rolled to be reverse U-shape for contacting with the contact at two portions, in which a first contact portion is formed a part of a fitting portion of the contact at which the contact is held on the socket body and a second contact portion is a top end of a plate spring portion of the contact incurved for facing the first contact portion.

Abstract: An infrared sensor package has a dielectric support which is molded from a plastic material to have a sensor mount for securing a pyroelectric element as well as an IC mount for securing an IC chip that processes a signal from the pyroelectric element. The support is molded over to be integral with metal parts. The metal parts include sensor conductors for interconnection of the pyroelectric element with the IC chip, and I/O conductors for interconnection of the IC chip with I/O pins. The sensor conductors as well as the I/O conductors are both molded into and integrally with the dielectric support.