Patents by Inventor Masato Shiobara

Masato Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connected construction of a high-frequency package and a wiring board
    Patent number: 6781488
    Abstract: A connected construction of a high-frequency package and a wiring board have an excellent high-frequency transmission characteristic without degradation of the transmission characteristic of even high-frequency signals in a wide band ranging from 20 GHz to 80 GHz in the case of connecting a high-frequency package to a wiring board. A distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of a high-frequency transmission line substrate constituting the high-frequency package, and a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of the wiring board on which the high-frequency package is mounted, are set in consideration of the dielectric constant of the high-frequency transmission line substrate and the dielectric constant of the wiring board in order to improve the high-frequency transmission characteristic between the high-frequency transmission line substrate and the wiring board.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Yoshio Tsukiyama, Masato Shiobara
  • Connected construction of a high-frequency package and a wiring board
    Publication number: 20030030516
    Abstract: The present invention was developed in order to provide a connected construction of a high-frequency package and a wiring board having an excellent high-frequency transmission characteristic, without degradation of the transmission characteristic of even high-frequency signals in a wide band ranging from 20 GHz to 80 GHz in the case of connecting a high-frequency package to a wiring board, wherein a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of a high-frequency transmission line substrate constituting the high-frequency package, and a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of the wiring board on which the high-frequency package is mounted, are set in consideration of the dielectric constant of the high-frequency transmission line substrate and the dielectric constant of the wiring board in order to improve the high-frequency transmission characteristic between the high-frequency transmission
    Type: Application
    Filed: March 26, 2002
    Publication date: February 13, 2003
    Inventors: Yoshio Tsukiyama, Masato Shiobara
  • High-frequency package
    Patent number: 6489679
    Abstract: A highfrequency package has an excellent high-frequency characteristic in a band from quasi-millimeter wavelength to 90 GHz frequency. A sealed construction can be easily manufactured, leading to a reduction in cost, and is excellent in strength.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: December 3, 2002
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Yoshio Tsukiyama, Masato Shiobara, Yoshihisa Araya
  • High-frequency package
    Publication number: 20010004129
    Abstract: The present invention was developed in order to provide a high-frequency package, having an excellent high-frequency characteristic in a band from quasi-millimeter wavelength to 90 GHz frequency and a favorably sealed construction, which can be easily manufactured, leading to a reduction in cost, and is excellent in strength.
    Type: Application
    Filed: December 6, 2000
    Publication date: June 21, 2001
    Inventors: Yoshio Tsukiyama, Masato Shiobara, Yoshihisa Araya