Patents by Inventor Masato SUGIHARA

Masato SUGIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lamination substrate and manufacturing method of the same
    Patent number: 9329422
    Abstract: A manufacturing method according to an embodiment of the present invention includes: a step of forming a tapered first groove on a surface of a semiconductor wafer; a step of forming a notch groove having a narrow width in a bottom portion of the first groove; a step of laminating the semiconductor wafer to a mother glass substrate using a sealing material; a step of forming a tapered second groove on a back surface of the semiconductor wafer; a step of separating a semiconductor substrate of the semiconductor wafer by cutting the semiconductor wafer from the second groove toward the notch groove; and a step of separating respective counter substrates by cutting the mother glass substrate along a scribe groove.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: May 3, 2016
    Assignee: JVC KENWOOD Corporation
    Inventor: Masato Sugihara
  • LAMINATION SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20150177558
    Abstract: A manufacturing method according to an embodiment of the present invention includes: a step of forming a tapered first groove on a surface of a semiconductor wafer; a step of forming a notch groove having a narrow width in a bottom portion of the first groove; a step of laminating the semiconductor wafer to a mother glass substrate using a sealing material; a step of forming a tapered second groove on a back surface of the semiconductor wafer; a step of separating a semiconductor substrate of the semiconductor wafer by cutting the semiconductor wafer from the second groove toward the notch groove; and a step of separating respective counter substrates by cutting the mother glass substrate along a scribe groove.
    Type: Application
    Filed: February 25, 2015
    Publication date: June 25, 2015
    Inventor: Masato SUGIHARA