Abstract: The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

Abstract: A resin sealing-type semiconductor device comprises a first semiconductor chip 15 with a large amount of heat generation, whose external electrode leading-out bonding pads 16 are wire-bonded to respective outer leads 25A and a second semiconductor chip 17 smaller in the amount of heat generation than the first semiconductor chip, whose external electrode leading-out bonding pads 18 are wire-bonded to respective outer leads 25A, wherein the first semiconductor chip 15 is molded by a high thermal conductive resin 28, and the second semiconductor chip 17 and the first semiconductor chip 15 molded by the high thermal conductive resin are integrally molded by a non-high thermal conductive resin 31. A method includes manufacturing the resin sealing-type semiconductor device.

Abstract: The related arts have difficulty in efficiently dissipating the heat generated by a resin-molded semiconductor element, and thus have the problem of thermal stress causing damage to the semiconductor element. To solve the problem, a semiconductor device of the preferred embodiments includes common leads coupled to an island, and a part of the common leads projects out from a resin seal body. The projecting common leads have a coupling portion. When mounting the semiconductor device, the common leads are bridged with brazing material. Thus, the heat generated by an integrated circuit chip mounted on the island is dissipated through the common leads to the outside of the resin seal body. In the preferred embodiments of the invention, a further improvement in heat dissipation characteristics can be accomplished by increasing the surface areas of the common leads.

Abstract: In order to produce no effect even when a first semiconductor chip with a large amount of heat generation and a second semiconductor chip with a small amount of heat generation are integrally sealed by a resin, a resin sealing-type semiconductor device comprises a first semiconductor chip 15 with a large amount of heat generation, whose external electrode leading-out bonding pads 16, 16 . . . are wire-bonded to respective outer leads 25A, 25A . . . and a second semiconductor chip 17 smaller in the amount of heat generation than the first semiconductor chip, whose external electrode leading-out bonding pads 18, 18 . . . are wire-bonded to respective outer leads 25A, 25A . . . , wherein the first semiconductor chip 15 is molded by a high thermal conductive resin 28, and the second semiconductor chip 17 and the first semiconductor chip 15 molded by the high thermal conductive resin are integrally molded by a non-high thermal conductive resin 31.